Low barrier ohmic contact for semiconductor light emitting device
    1.
    发明授权
    Low barrier ohmic contact for semiconductor light emitting device 失效
    半导体发光器件的低阻挡欧姆接触

    公开(公告)号:US6087725A

    公开(公告)日:2000-07-11

    申请号:US161498

    申请日:1998-09-28

    IPC分类号: H01L33/28 H01L33/40 H01L33/00

    CPC分类号: H01L33/40 H01L33/28

    摘要: On a substrate of n-type GaAs, an n-type cladding layer of n-type Zn.sub.0.9 Mg.sub.0.1 S.sub.0.13 Se.sub.0.87, an n-type light guiding layer of n-type ZnS.sub.0.06 Se.sub.0.94, an active layer of ZnCdSe and a p-type light guiding layer of p-type ZnS.sub.0.06 Se.sub.0.94 are successively formed. On the p-type light guiding layer, a p-type contact structure is formed. The p-type contact structure includes a first layer of p-type ZnS.sub.0.31 Se.sub.0.54 Te.sub.0.15, a second layer of ZnS.sub.0.47 Se.sub.0.28 Te.sub.0.25, a third layer of p-type ZnS.sub.0.65 Te.sub.0.35, a fourth layer of p-type ZnS.sub.0.5 Te.sub.0.5 and a fifth layer of p-type ZnTe.

    摘要翻译: 在n型GaAs的衬底上,n型Zn0.9Mg0.1S0.13Se0.87的n型覆层,n型ZnS0.06Se0.94的n型导光层,n型ZnS0.06Se0.94的有源层 ZnCdSe和p型ZnS0.06Se0.94的p型导光层依次形成。 在p型导光层上形成p型接触结构。 p型接触结构包括第一层p型ZnS0.31Se0.54Te0.15,第二层ZnS0.47Se0.28Te0.25,第三层p型ZnS0.65Te0.35,第四层 的p型ZnS0.5Te0.5和第五层p型ZnTe。

    Light-emitting diode device
    2.
    发明授权
    Light-emitting diode device 有权
    发光二极管装置

    公开(公告)号:US06169296A

    公开(公告)日:2001-01-02

    申请号:US09176906

    申请日:1998-10-22

    IPC分类号: H01L3300

    摘要: The light-emitting diode device of the present invention includes an active layer, a p-type contact layer, a Schottky electrode and an ohmic electrode. The active layer is formed over an n-type semiconductor substrate. The contact layer is formed over the active layer. The Schottky electrode is selectively formed on the contact layer and makes Schottky contact with the contact layer. The ohmic electrode is formed to surround the Schottky electrode on the contact layer and to be electrically connected to the Schottky electrode and transmits the light emitted from the active layer.

    摘要翻译: 本发明的发光二极管器件包括有源层,p型接触层,肖特基电极和欧姆电极。 有源层形成在n型半导体衬底上。 接触层形成在有源层上。 肖特基电极选择性地形成在接触层上并与接触层进行肖特基接触。 欧姆电极形成为围绕接触层上的肖特基电极并与肖特基电极电连接并透射从有源层发射的光。

    Vertical field effect transistor using linear structure as a channel region and method for fabricating the same
    6.
    发明授权
    Vertical field effect transistor using linear structure as a channel region and method for fabricating the same 有权
    使用线性结构作为沟道区域的垂直场效应晶体管及其制造方法

    公开(公告)号:US07586130B2

    公开(公告)日:2009-09-08

    申请号:US11344574

    申请日:2006-02-01

    IPC分类号: H01L29/732

    摘要: A vertical field effect transistor includes: an active region with a bundle of linear structures functioning as a channel region; a lower electrode, functioning as one of source and drain regions; an upper electrode, functioning as the other of the source and drain regions; a gate electrode for controlling the electric conductivity of at least a portion of the bundle of linear structures included in the active region; and a gate insulating film arranged between the active region and the gate electrode to electrically isolate the gate electrode from the bundle of linear structures. The transistor further includes a dielectric portion between the upper and lower electrodes. The upper electrode is located over the lower electrode with the dielectric portion interposed and includes an overhanging portion sticking out laterally from over the dielectric portion. The active region is located right under the overhanging portion of the upper electrode.

    摘要翻译: 垂直场效应晶体管包括:具有用作沟道区的线性结构束的有源区; 用作源极和漏极区之一的下电极; 上电极,用作源极和漏极区域中的另一个; 用于控制所述有源区域中包括的所述线性结构束的至少一部分的电导率的栅电极; 以及栅极绝缘膜,其布置在所述有源区和所述栅电极之间,以将所述栅电极与所述线结构的束电隔离。 晶体管还包括在上电极和下电极之间的电介质部分。 上电极位于下电极的上方,电介质部分插入,并且包括从电介质部分的上方横向突出的突出部分。 有源区域位于上电极的伸出部分正下方。

    Bipolar transistor and method for fabricating the same
    7.
    发明授权
    Bipolar transistor and method for fabricating the same 有权
    双极晶体管及其制造方法

    公开(公告)号:US07091099B2

    公开(公告)日:2006-08-15

    申请号:US10807307

    申请日:2004-03-24

    IPC分类号: H01L21/331

    CPC分类号: H01L29/66242 H01L29/7378

    摘要: A bipolar transistor includes a Si single crystalline layer serving as a collector, a single crystalline Si/SiGeC layer and a polycrystalline Si/SiGeC layer which are formed on the Si single crystalline layer, an oxide film having an emitter opening portion, an emitter electrode, and an emitter layer. An intrinsic base layer is formed on the single crystalline Si/SiGeC layer, part of the single crystalline Si/SiGeC layer, the polycrystalline Si/SiGeC layer and the Co silicide layer together form an external base layer. The thickness of the emitter electrode is set so that boron ions implanted into the emitter electrode and diffused therein do not reach an emitter-base junction portion.

    摘要翻译: 双极晶体管包括形成在Si单晶层上的Si单结晶层,单晶Si / SiGeC层和多晶Si / SiGeC层,具有发射极开口部分的氧化膜,发射极 ,和发射极层。 在单晶Si / SiGeC层上形成本征基层,单晶Si / SiGeC层的一部分,多晶Si / SiGeC层和Co硅化物层一起形成外部基极层。 发射电极的厚度被设定为使得注入发射电极并在其中扩散的硼离子不会到达发射极 - 基极接合部分。

    Method for measuring semiconductor constituent element content and method for manufacturing a semiconductor device
    10.
    发明授权
    Method for measuring semiconductor constituent element content and method for manufacturing a semiconductor device 有权
    用于测量半导体构成元件含量的方法和用于制造半导体器件的方法

    公开(公告)号:US06858454B1

    公开(公告)日:2005-02-22

    申请号:US10674523

    申请日:2003-10-01

    IPC分类号: G01N21/21 G01N21/35 H01L21/66

    CPC分类号: G01N21/3563 G01N21/211

    摘要: A method for measuring semiconductor constituent element content utilizes the steps of: obtaining a film thickness of an SiGeC layer formed on a semiconductor substrate by evaluation using spectroscopic ellipsometry; measuring infrared absorption spectrum of the SiGeC layer; and obtaining a C content of the SiGeC layer based on the film thickness and the infrared absorption spectrum of the SiGeC layer. The method: obtaining an apparent Ge content of the SiGeC layer by evaluation using spectroscopic ellipsometry; and obtaining an actual Ge content of the SiGeC layer based on the apparent Ge content and the C content. The constituent element content of the SiGeC layer can be easily and accurately measured according to the above-mentioned method.

    摘要翻译: 一种测量半导体构成元件含量的方法采用以下步骤:通过使用分光椭圆偏光度法评估在半导体衬底上形成的SiGeC层的膜厚度; 测量SiGeC层的红外吸收光谱; 并根据SiGeC层的膜厚和红外吸收光谱获得SiGeC层的C含量。 该方法:通过使用分光椭偏仪评估获得SiGeC层的表观Ge含量; 并且基于表观Ge含量和C含量获得SiGeC层的实际Ge含量。 根据上述方法可以容易且精确地测量SiGeC层的构成元素含量。