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公开(公告)号：US11219758B2
公开(公告)日：2022-01-11
申请号：US16572417
申请日：2019-09-16
发明人： Robert Greenberg , Neil Talbot , Jerry Ok , Proyag Datta , Andrew Sha , Brianna Thielen , Dustin Tobey , Deborah Sigel
摘要： Electrode arrays for biological implants are disclosed. The present disclosure provides array designs for improving apposition (reducing the space between the array and neural tissue). The present disclosure also provides electrode array designs that can be made approximately spherical to increase the field of view of a visual prosthesis while still maintaining good apposition to neural tissue.
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公开(公告)号：US20170165476A1
公开(公告)日：2017-06-15
申请号：US15374931
申请日：2016-12-09
发明人： Robert Greenberg , Neil Talbot , Jerry Ok , Proyag Datta , Andrew Sha , Brianna Thielen , Dustin Tobey , Deborah Sigel
CPC分类号： A61N1/0543 , A61N1/36046
摘要： Electrode arrays for biological implants are disclosed, particularly for stimulating a retina. The present disclosure provides array for improving apposition (reducing the space between the array and the retina. The present disclosure also provides electrode array designs that can be made approximately spherical to increase the field of view of a visual prosthesis while still maintaining good apposition.
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3.发明申请Biocompatible Bonding Method and Electronics Package Suitable for Implantation 有权生物相容性接合方法和适用于植入的电子封装公开(公告)号：US20160255720A1
公开(公告)日：2016-09-01
申请号：US14987574
申请日：2016-01-04
发明人： Robert Greenberg , Neil Talbot , Jerry Ok , Jordan Neysmith , David Zhou
CPC分类号： A61N1/3758 , A61N1/0543 , A61N1/36046 , A61N1/375 , H01L21/563 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L24/81 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13169 , H01L2224/13178 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81469 , H01L2224/81478 , H01L2224/81815 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1461 , H05K1/028 , H05K1/0306 , H05K1/09 , H05K1/111 , H05K1/113 , H05K1/115 , H05K1/189 , H05K3/10 , H05K3/188 , H05K3/305 , H05K3/321 , H05K3/328 , H05K3/3436 , H05K3/361 , H05K3/4015 , H05K3/4038 , H05K3/4084 , H05K3/423 , H05K3/4644 , H05K3/4652 , H05K3/4691 , H05K13/0469 , H05K2201/09127 , H05K2201/1028 , H05K2201/10287 , H05K2201/10295 , H05K2201/10977 , H05K2203/05 , H05K2203/06 , H05K2203/0733 , H05K2203/09 , H05K2203/107 , H05K2203/1446 , H01L2924/00 , H01L2224/05599
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a studbump connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成将柔性电路连接到电子封装上的插头连接。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。
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4.发明授权Biocompatible bonding method and electronics package suitable for implantation 有权生物相容性接合方法和电子封装适合植入公开(公告)号：US09532451B2
公开(公告)日：2016-12-27
申请号：US14987574
申请日：2016-01-04
发明人： Robert Greenberg , Neil Talbot , Jerry Ok , Jordan Neysmith , David Zhou
CPC分类号： A61N1/3758 , A61N1/0543 , A61N1/36046 , A61N1/375 , H01L21/563 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L24/81 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13169 , H01L2224/13178 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81469 , H01L2224/81478 , H01L2224/81815 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1461 , H05K1/028 , H05K1/0306 , H05K1/09 , H05K1/111 , H05K1/113 , H05K1/115 , H05K1/189 , H05K3/10 , H05K3/188 , H05K3/305 , H05K3/321 , H05K3/328 , H05K3/3436 , H05K3/361 , H05K3/4015 , H05K3/4038 , H05K3/4084 , H05K3/423 , H05K3/4644 , H05K3/4652 , H05K3/4691 , H05K13/0469 , H05K2201/09127 , H05K2201/1028 , H05K2201/10287 , H05K2201/10295 , H05K2201/10977 , H05K2203/05 , H05K2203/06 , H05K2203/0733 , H05K2203/09 , H05K2203/107 , H05K2203/1446 , H01L2924/00 , H01L2224/05599
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a studbump connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成将柔性电路连接到电子封装上的插头连接。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。
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5.发明申请Biocompatible Bonding Method and Electronics Package Suitable for Implantation 审中-公开生物相容性接合方法和适用于植入的电子封装公开(公告)号：US20160158559A1
公开(公告)日：2016-06-09
申请号：US14941311
申请日：2015-11-13
发明人： Robert J. Greenberg , Alfred E. Mann , Dao Min Zhou , Neil Talbot , Jerry Ok , Gailland R. Nolan
CPC分类号： A61N1/375 , A61N1/0543 , A61N1/36046 , A61N1/3758 , H05K1/0306 , H05K3/321 , H05K3/328 , H05K3/361 , H05K3/4015 , H05K3/423 , H05K3/4652 , H05K3/4691 , H05K2201/09127 , H05K2201/1028 , H05K2201/10287 , H05K2201/10295 , H05K2201/10977 , H05K2203/0733 , H05K2203/1446 , Y10T29/49155
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。
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公开(公告)号：US20200009373A1
公开(公告)日：2020-01-09
申请号：US16572417
申请日：2019-09-16
发明人： Robert Greenberg , Neil Talbot , Jerry Ok , Proyag Datta , Andrew Sha , Brianna Thielen , Dustin Tobey , Deborah Sigel
摘要： Electrode arrays for biological implants are disclosed. The present disclosure provides array designs for improving apposition (reducing the space between the array and neural tissue). The present disclosure also provides electrode array designs that can be made approximately spherical to increase the field of view of a visual prosthesis while still maintaining good apposition to neural tissue.
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公开(公告)号：US10220202B2
公开(公告)日：2019-03-05
申请号：US15585093
申请日：2017-05-02
发明人： Jordan Neysmith , Robert Greenberg , James Little , Brian Mech , Neil Talbot , Qingfang Yao , David Zhou
IPC分类号： A61N1/05 , A61N1/36 , H05K1/11 , H05K3/38 , H05K3/46 , H05K1/09 , H05K3/18 , H05K1/02 , H05K1/03 , H05K3/06 , H05K3/22 , H05K3/00
摘要： A flexible circuit electrode array with more than one layer of metal traces comprising: a polymer base layer; more than one layer of metal traces, separated by polymer layers, deposited on the polymer base layer, including electrodes suitable to stimulate neural tissue; and a polymer top layer deposited on the polymer base layer and the metal traces. Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, or cortical stimulation many purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow.
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公开(公告)号：US10159845B2
公开(公告)日：2018-12-25
申请号：US14941311
申请日：2015-11-13
发明人： Robert J. Greenberg , Alfred E. Mann , Dao Min Zhou , Neil Talbot , Jerry Ok , Gailland R. Nolan
IPC分类号： A61N1/37 , A61N1/375 , A61N1/05 , H05K3/36 , A61N1/36 , H05K1/03 , H05K3/32 , H05K3/40 , H05K3/42 , H05K3/46
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
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公开(公告)号：US09861820B2
公开(公告)日：2018-01-09
申请号：US15154757
申请日：2016-05-13
发明人： Robert J. Greenberg , Neil Talbot , Proyag Datta , Dustin Tobey , Dao Min Zhou , Jessy Dorn
CPC分类号： A61N1/36046 , A61B5/04001 , A61N1/0531 , A61N1/3606 , A61N1/36135 , A61N1/37217 , A61N1/3758
摘要： The present invention consists of an implantable device with a hermetic electronics package that houses electronics. The hermetic package is attached to a flexible circuit electrode array having its electrodes arranged in a trapezoidal electrode array field that is suitable to stimulate the visual cortex. The hermetic electronics package is provided with a fixation structure that secures, protects and dissipates heat from the electronics package. The entire implantable device can be entirely implanted within the head.
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公开(公告)号：US20170232251A1
公开(公告)日：2017-08-17
申请号：US15585093
申请日：2017-05-02
发明人： Jordan Neysmith , Robert Greenberg , James Little , Brian Mech , Neil Talbot , Qingfang Yao , David Zhou
CPC分类号： A61N1/0543 , A61N1/0541 , A61N1/36046 , H05K1/028 , H05K1/0353 , H05K1/09 , H05K1/111 , H05K1/115 , H05K1/118 , H05K3/0014 , H05K3/0017 , H05K3/0041 , H05K3/06 , H05K3/188 , H05K3/22 , H05K3/388 , H05K3/4644 , H05K2201/0129 , H05K2201/0133 , H05K2201/0141 , H05K2201/0154 , Y10T29/49156 , Y10T29/49158
摘要： A flexible circuit electrode array with more than one layer of metal traces comprising: a polymer base layer; more than one layer of metal traces, separated by polymer layers, deposited on the polymer base layer, including electrodes suitable to stimulate neural tissue; and a polymer top layer deposited on the polymer base layer and the metal traces. Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, or cortical stimulation many purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow.
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