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公开(公告)号：US10586096B2
公开(公告)日：2020-03-10
申请号：US15415785
申请日：2017-01-25
发明人： Neil H Talbot , Jerry Ok , Robert J Greenberg , Gregoire Cosendai , Brian V Mech , Avraham I Caspi , Fatima Anaflous , Francesco Merlini , Kelly H McClure
摘要： The present invention is a system for detecting, tracking and recognizing human faces in a visual prosthesis. In a visual prosthesis, the input camera is always higher resolution than the electrode array providing percepts to the subject. It is advantageous to detect, track and recognize human faces. Then information can be provided to the subject by highlighting the face in the visual scene, providing auditor or vibratory notice that a human face is in the visual scene, looking up the face in a database to state the name of the person in the visual scene, otherwise communication id like providing a custom vibratory pattern corresponding to known individuals (like custom ring tones associated with caller ID) or automatically zooming in on a face to aid the subject in identifying the face.
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公开(公告)号：US20200009373A1
公开(公告)日：2020-01-09
申请号：US16572417
申请日：2019-09-16
发明人： Robert Greenberg , Neil Talbot , Jerry Ok , Proyag Datta , Andrew Sha , Brianna Thielen , Dustin Tobey , Deborah Sigel
摘要： Electrode arrays for biological implants are disclosed. The present disclosure provides array designs for improving apposition (reducing the space between the array and neural tissue). The present disclosure also provides electrode array designs that can be made approximately spherical to increase the field of view of a visual prosthesis while still maintaining good apposition to neural tissue.
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公开(公告)号：US10159845B2
公开(公告)日：2018-12-25
申请号：US14941311
申请日：2015-11-13
发明人： Robert J. Greenberg , Alfred E. Mann , Dao Min Zhou , Neil Talbot , Jerry Ok , Gailland R. Nolan
IPC分类号： A61N1/37 , A61N1/375 , A61N1/05 , H05K3/36 , A61N1/36 , H05K1/03 , H05K3/32 , H05K3/40 , H05K3/42 , H05K3/46
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
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公开(公告)号：US09415221B2
公开(公告)日：2016-08-16
申请号：US13903805
申请日：2013-05-28
发明人： Robert J Greenberg , Jerry Ok , Jordan Matthew Neysmith , Kevin Wilkin , Neil Hamilton Talbot , Da-Yu Chang
CPC分类号： A61N1/36046 , A61N1/0543 , A61N1/375 , A61N1/3758 , A61N1/3787 , H01L2224/16227 , H01L2224/32225 , H01L2224/73253 , H01L2924/15311 , H01L2924/16251 , H01L2924/19104 , H01L2924/19107
摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device of the present invention includes an eclectically non-conductive bass including electrically conductive vias through the substrate. A circuit is flip-chip bonded to a subset of the vias. A second circuit is wire bonded to another subset of the vias. Finally, a cover is bonded to the substrate such that the cover, substrate and vias form a hermetic package.
摘要翻译： 本发明是用于植入人体的改进的密封包装。 本发明的可植入装置包括包含通过基底的导电通路的折衷不导电的低音。 电路倒装芯片结合到通孔的子集。 第二电路被引线接合到通孔的另一子集。 最后，将覆盖物粘合到基底上，使得盖，基底和通孔形成密封包装。
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5.发明申请Method for Making a Biocompatible Hermetic Housing Including Hermetic Electrical Feedthroughs 有权制造具有气密电气馈通的生物相容性气密壳体的方法公开(公告)号：US20140076844A1
公开(公告)日：2014-03-20
申请号：US14080549
申请日：2013-11-14
发明人： Jerry Ok , Robert J. Greenberg
CPC分类号： H05K3/4061 , B32B37/14 , C04B35/10 , C04B37/00 , C04B2237/064 , H05K1/0306 , H05K3/0044 , H05K3/0047 , H05K3/005 , H05K3/12 , H05K3/1225 , H05K3/1233 , H05K3/4614 , H05K3/4623 , H05K3/4629 , H05K2201/0376 , H05K2201/096 , H05K2201/09609 , H05K2203/1147 , H05K2203/308 , Y10T156/10
摘要： A method for fabricating a biocompatible hermetic housing including electrical feedthroughs, the method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thick film paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to foam a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via.
摘要翻译： 一种制造包括电馈通件的生物相容性密封壳体的方法，所述方法包括提供具有上表面和下表面的陶瓷片，在从所述上表面延伸到所述下表面的所述陶瓷片中形成至少一个通孔，插入 将导电性厚膜糊剂进入所述通孔中，在上陶瓷片和下陶瓷片之间通过孔填充陶瓷片层压陶瓷片，以使层叠陶瓷基板发泡，将层叠陶瓷基板烧结至烧结层叠陶瓷基板的温度， 使填充通孔的糊料形成金属化通孔，并使层压陶瓷基板在所述金属化通孔周围形成气密密封，并从烧结的层叠陶瓷基板上除去上陶瓷片和下陶瓷片材以暴露上层和 金属化通孔的下表面。
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公开(公告)号：US20140039588A1
公开(公告)日：2014-02-06
申请号：US14049056
申请日：2013-10-08
发明人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James S. Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号： A61N1/05
CPC分类号： A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： An implantable device, including a first electrically non-conductive substrate; a plurality of electrically conductive vias through the first electrically non-conductive substrate; a flip-chip multiplexer circuit attached to the electrically non-conductive substrate using conductive bumps and electrically connected to at least a subset of the plurality of electrically conductive vias; a flip-chip driver circuit attached to the flip-chip multiplexer circuit using conductive bumps; a second electrically non-conductive substrate attached to the flip-chip driver circuit using conductive bumps; discrete passives attached to the second electrically non-conductive substrate; and a cover bonded to the first electrically non-conductive substrate, the cover, the first electrically non-conductive substrate and the electrically conductive vias forming a hermetic package.
摘要翻译： 一种可植入装置，包括第一不导电基底; 通过第一非导电衬底的多个导电通孔; 一个倒装芯片多路复用器电路，其使用导电凸块连接到非导电衬底，并电连接到多个导电通孔中的至少一个子集; 使用导电凸块连接到倒装芯片多路复用器电路的倒装芯片驱动器电路; 使用导电凸块连接到倒装芯片驱动电路的第二非导电衬底; 连接到第二非导电衬底的离散无源器件; 以及盖，其结合到第一非导电衬底，盖，第一非导电衬底和形成气密封装的导电通孔。
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公开(公告)号：US11219758B2
公开(公告)日：2022-01-11
申请号：US16572417
申请日：2019-09-16
发明人： Robert Greenberg , Neil Talbot , Jerry Ok , Proyag Datta , Andrew Sha , Brianna Thielen , Dustin Tobey , Deborah Sigel
摘要： Electrode arrays for biological implants are disclosed. The present disclosure provides array designs for improving apposition (reducing the space between the array and neural tissue). The present disclosure also provides electrode array designs that can be made approximately spherical to increase the field of view of a visual prosthesis while still maintaining good apposition to neural tissue.
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公开(公告)号：US09931507B2
公开(公告)日：2018-04-03
申请号：US15207425
申请日：2016-07-11
发明人： Robert J. Greenberg , Jerry Ok , Jordan Neysmith , Kevin Wilkin , Neil Hamilton Talbot , Da-Yu Chang
CPC分类号： A61N1/36046 , A61N1/0543 , A61N1/375 , A61N1/3758 , A61N1/3787 , H01L2224/16227 , H01L2224/32225 , H01L2224/73253 , H01L2924/15311 , H01L2924/16251 , H01L2924/19104 , H01L2924/19107
摘要： The present invention is an improved hermetic package for a retinal prosthesis implanted in the human body. The retinal prosthesis includes a flexible circuit electrode array suitable to stimulate the retina while connected to a hermetic package on the outside of the eye, the hermetic package including a cover and a base where the cover is bonded to the base such that the cover and base form the hermetic package.
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公开(公告)号：US20170165476A1
公开(公告)日：2017-06-15
申请号：US15374931
申请日：2016-12-09
发明人： Robert Greenberg , Neil Talbot , Jerry Ok , Proyag Datta , Andrew Sha , Brianna Thielen , Dustin Tobey , Deborah Sigel
CPC分类号： A61N1/0543 , A61N1/36046
摘要： Electrode arrays for biological implants are disclosed, particularly for stimulating a retina. The present disclosure provides array for improving apposition (reducing the space between the array and the retina. The present disclosure also provides electrode array designs that can be made approximately spherical to increase the field of view of a visual prosthesis while still maintaining good apposition.
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10.发明申请Biocompatible Bonding Method and Electronics Package Suitable for Implantation 有权生物相容性接合方法和适用于植入的电子封装公开(公告)号：US20160255720A1
公开(公告)日：2016-09-01
申请号：US14987574
申请日：2016-01-04
发明人： Robert Greenberg , Neil Talbot , Jerry Ok , Jordan Neysmith , David Zhou
CPC分类号： A61N1/3758 , A61N1/0543 , A61N1/36046 , A61N1/375 , H01L21/563 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L24/81 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13169 , H01L2224/13178 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81469 , H01L2224/81478 , H01L2224/81815 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1461 , H05K1/028 , H05K1/0306 , H05K1/09 , H05K1/111 , H05K1/113 , H05K1/115 , H05K1/189 , H05K3/10 , H05K3/188 , H05K3/305 , H05K3/321 , H05K3/328 , H05K3/3436 , H05K3/361 , H05K3/4015 , H05K3/4038 , H05K3/4084 , H05K3/423 , H05K3/4644 , H05K3/4652 , H05K3/4691 , H05K13/0469 , H05K2201/09127 , H05K2201/1028 , H05K2201/10287 , H05K2201/10295 , H05K2201/10977 , H05K2203/05 , H05K2203/06 , H05K2203/0733 , H05K2203/09 , H05K2203/107 , H05K2203/1446 , H01L2924/00 , H01L2224/05599
摘要： The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a studbump connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
摘要翻译： 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成将柔性电路连接到电子封装上的插头连接。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。
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