Semiconductor memory having stacked capacitor
    1.
    发明授权
    Semiconductor memory having stacked capacitor 失效
    半导体存储器具有层叠电容

    公开(公告)号:US5012310A

    公开(公告)日:1991-04-30

    申请号:US566315

    申请日:1990-08-13

    CPC分类号: H01L27/10808

    摘要: A megabit dynamic random access memory realizing high integration and high reliability is disclosed. The need for an allowance for photomask alignment which is carried out to produce a stacked capacitor memory cell is eliminated. The plate electrode of each memory cell is isolated from the corresponding data line in a memory array by means of an insulating film which is self-alignedly provided around the plate electrode.

    摘要翻译: 公开了一种实现高集成度和高​​可靠性的兆比特动态随机存取存储器。 消除了对制造堆叠式电容器存储单元进行的光掩模对准的允许的需要。 每个存储单元的平板电极通过绝缘膜与存储器阵列中的对应数据线隔离,该绝缘膜自行设置在平板电极周围。

    Method for formation of insulation film on silicon buried in trench
    2.
    发明授权
    Method for formation of insulation film on silicon buried in trench 失效
    在埋在沟槽中的硅上形成绝缘膜的方法

    公开(公告)号:US4873203A

    公开(公告)日:1989-10-10

    申请号:US221351

    申请日:1988-07-19

    摘要: An insulation film on silicon buried in a trench is prepared by forming a field oxide film by using a first Si.sub.3 N.sub.4 mask formed on a silicon substrate, forming a second Si.sub.3 N.sub.4 mask for formation of a trench, forming a trench in the silicon substrate by using the second Si.sub.3 N.sub.4 mask, burying polycrystalline silicon in the trench, removing the second Si.sub.3 N.sub.4 mask while leaving the first Si.sub.3 N.sub.4 mask and oxidizing the surface of the polycrystalline silicon buried in the trench by thermal oxidation. The so-formed insulation film on silicon buried in the trench has a uniform thickness and a high dielectric strength. The surface of the substrate at a part where an active element will be formed in the future is not oxidized.

    摘要翻译: 通过使用在硅衬底上形成的第一Si 3 N 4掩模形成场氧化膜,形成用于形成沟槽的第二Si 3 N 4掩模,通过使用硅衬底形成硅衬底中的沟槽来制备掩埋在沟槽中的硅上的绝缘膜 第二Si 3 N 4掩模,在沟槽中埋入多晶硅,除去第二Si 3 N 4掩模,同时留下第一Si 3 N 4掩模,并通过热氧化氧化掩埋在沟槽中的多晶硅的表面。 埋在沟槽中的硅上如此形成的绝缘膜具有均匀的厚度和高介电强度。 在将来将形成有源元件的部分处的基板的表面不被氧化。

    Semiconductor memory having trench capacitor formed with sheath electrode
    5.
    发明授权
    Semiconductor memory having trench capacitor formed with sheath electrode 失效
    具有形成有护套电极的沟槽电容器的半导体存储器

    公开(公告)号:US4918502A

    公开(公告)日:1990-04-17

    申请号:US123235

    申请日:1987-11-20

    IPC分类号: H01L27/108

    CPC分类号: H01L27/10829

    摘要: The present invention relates to a highly packaged semiconductor memory, and more particularly to a memory cell having a trench capacitor for use in a CMOS memory. The present invention discloses a semiconductor memory employing memory cells each constructed of a trench type charge storage capacitor formed within a substrate, and a switching transistor; one electrode of the capacitor having a sheath-shaped structure which is electrically continuous with the Si substrate at a bottom of a groove and whose sideward periphery is covered with an insulator, the other electrode of the capacitor having a part which is buried inside the sheath electrode and another part which is electrically connected with an impurity diffused layer to function as a source region of the transistor. Further, a structure in which a voltage of 1/2 V.sub.cc can be applied to a plate electrode of a memory cell having a trench capacitor is disclosed.

    摘要翻译: 本发明涉及高度封装的半导体存储器,更具体地说,涉及一种具有用于CMOS存储器的沟槽电容器的存储单元。 本发明公开了一种半导体存储器,其采用由形成在衬底内的沟槽型电荷存储电容器构成的存储单元和开关晶体管; 电容器的一个电极具有鞘状结构,其在沟槽的底部与Si衬底电连接,并且其侧面被绝缘体覆盖,电容器的另一个电极具有埋在护套内的部分 电极和与杂质扩散层电连接以用作晶体管的源极区的另一部分。 此外,公开了可以向具有沟槽电容器的存储单元的板电极施加1/2Vcc的电压的结构。

    Dynamic random access memory having buried word lines
    6.
    发明授权
    Dynamic random access memory having buried word lines 失效
    具有掩埋字线的动态随机存取存储器

    公开(公告)号:US4873560A

    公开(公告)日:1989-10-10

    申请号:US155698

    申请日:1988-02-16

    CPC分类号: H01L27/10841 Y10S257/922

    摘要: This invention relates to a very large scale dynamic random access memory, and discloses a memory cell having a reduced step on the device surface portion and being hardly affected by incident radioactive rays. In a semiconductor memory consisting of a deep hole bored in a semiconductor substrate, a capacitor formed on the sidewall portion at the lower half of the deep hole and a switching transistor formed immediately above the capacitor, at least the half of a word line constituting the gate of the switching transistor is buried in an elongated recess formed at the surface portion of the semiconductor substrate.

    摘要翻译: 本发明涉及一种非常大规模的动态随机存取存储器,并且公开了一种在器件表面部分上具有减小的步长并且几乎不受入射放射线影响的存储单元。 在由在半导体衬底中钻出的深孔组成的半导体存储器中,形成在深孔下半部分的侧壁部分上的电容器和形成在电容器上方的开关晶体管,至少形成一条字线的一半构成 开关晶体管的栅极被埋在形成在半导体衬底的表面部分处的细长凹部中。

    Method for fabricating semiconductor memory with a groove
    8.
    发明授权
    Method for fabricating semiconductor memory with a groove 失效
    用于制造具有凹槽的半导体存储器的方法

    公开(公告)号:US06355517B1

    公开(公告)日:2002-03-12

    申请号:US08172101

    申请日:1993-12-23

    IPC分类号: H01L218242

    CPC分类号: G11C11/404 H01L27/10829

    摘要: A semiconductor memory having a capacitor formed by utilizing a groove formed in a semiconductor substrate and an insulated gate field effect transistor and suppressing expansion of a depletion layer from the groove, and a method for fabricating the same are disclosed. An area occupied by each memory cell can be made very small and a distance between the memory cells can also be made very small, accordingly, high density integration is facilitated.

    摘要翻译: 公开了一种半导体存储器,其具有通过利用形成在半导体衬底中的沟槽和绝缘栅场效应晶体管而形成的电容器,并且抑制了耗尽层从沟槽的膨胀及其制造方法。 可以使每个存储单元所占据的面积非常小,并且存储单元之间的距离也可以非常小,因此便于高密度集成。