公开(公告)号：US20110200788A1

公开(公告)日：2011-08-18

申请号：US13028588

申请日：2011-02-16

申请人： Shinnosuke MAEDA ,  Tetsuo SUZUKI ,  Satoshi HIRANO

发明人： Shinnosuke MAEDA ,  Tetsuo SUZUKI ,  Satoshi HIRANO

IPC分类号： B32B3/24 ,  H05K3/06

CPC分类号： H05K3/4682 ,  H05K1/112 ,  H05K3/205 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/099 ,  Y10T428/24331 ,  Y10T428/24339

摘要： A plurality of openings are formed in a resin insulation layer on a bottom surface side of a wiring laminate portion which constitutes a multilayer wiring substrate. A plurality of motherboard connection terminals are disposed to correspond to the openings. The motherboard connection terminals are primarily comprised of a copper layer, and peripheral portions of terminal outer surfaces thereof are covered by the outermost resin insulation layer. A dissimilar metal layer made of at least one metal which is lower in etching rate than copper is formed between an inner main surface of the outermost resin insulation layer and peripheral portions of the terminal outer surfaces.

摘要翻译： 在构成多层布线基板的布线层叠体的底面侧的树脂绝缘层上形成有多个开口部。 多个主板连接端子被设置成对应于这些开口。 母板连接端子主要由铜层构成，其端子外表面的周边部分被最外层树脂绝缘层覆盖。 在最外层树脂绝缘层的内主表面和端子外表面的周边部分之间形成由蚀刻速率低于铜的至少一种金属制成的异种金属层。

公开(公告)号：US20110156272A1

公开(公告)日：2011-06-30

申请号：US12976427

申请日：2010-12-22

申请人： Shinnosuke MAEDA ,  Tetsuo SUZUKI ,  Atsuhiko SUGIMOTO ,  Tatsuya ITO ,  Takuya HANDO ,  Satoshi HIRANO

发明人： Shinnosuke MAEDA ,  Tetsuo SUZUKI ,  Atsuhiko SUGIMOTO ,  Tatsuya ITO ,  Takuya HANDO ,  Satoshi HIRANO

IPC分类号： H01L23/48

CPC分类号： H05K3/3452 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/205 ,  H05K3/383 ,  H05K3/4682 ,  H05K2201/068 ,  H05K2201/094 ,  H05K2201/09527 ,  H05K2201/099 ,  H05K2203/0346 ,  H05K2203/0369 ,  H01L2924/00

摘要： A multilayered wiring substrate, comprising: a plurality of first main surface side connecting terminals arranged in a first main surface of a stack structure; and a plurality of second main surface side connecting terminals being arranged in a second main surface of the stack structure; wherein a plurality of conductor layers are alternately formed in a plurality of stacked resin insulation layers and are operably connected to each other through via conductors tapered such that diameters thereof are widened toward the first or the second main surface, wherein a plurality of openings are formed in an exposed outermost resin insulation layer in the second main surface, and terminal outer surfaces of the second main surface side connecting terminals arranged to match with the plurality of the openings are positioned inwardly from an outer main surface of the exposed outermost resin insulation layer, and edges of terminal inner surfaces are rounded.

摘要翻译： 一种多层布线基板，包括：布置在堆叠结构的第一主表面中的多个第一主表面侧连接端子; 并且多个第二主表面侧连接端子布置在所述堆叠结构的第二主表面中; 其中多个导体层交替地形成在多个堆叠的树脂绝缘层中，并且通过锥形的通孔导体可操作地连接，使得其直径朝向第一或第二主表面加宽，其中形成多个开口 在第二主表面中暴露的最外层树脂绝缘层中，并且布置成与多个开口相匹配的第二主表面侧连接端子的端子外表面从暴露的最外层树脂绝缘层的外主表面位于内侧， 并且端子内表面的边缘是圆形的。

公开(公告)号：US20110155443A1

公开(公告)日：2011-06-30

申请号：US12979474

申请日：2010-12-28

申请人： Shinnosuke MAEDA ,  Tetsuo SUZUKI ,  Takuya HANDO ,  Tatsuya ITO ,  Satoshi HIRANO ,  Atsuhiko SUGIMOTO

发明人： Shinnosuke MAEDA ,  Tetsuo SUZUKI ,  Takuya HANDO ,  Tatsuya ITO ,  Satoshi HIRANO ,  Atsuhiko SUGIMOTO

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K1/0298 ,  H01L21/4846 ,  H01L23/49822 ,  H01L2224/16225 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K3/0055 ,  H05K3/3452 ,  H05K3/4682 ,  H05K2201/068 ,  H05K2201/094 ,  H05K2201/0989 ,  H05K2201/099

摘要： In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are formed in an outermost resin insulation layer through laser drilling so as to expose connection terminals. Subsequently, in a desmear step, smears from inside the openings are removed. In a base-material removing step performed after the build-up step, the base material is removed and the metal foil is exposed.

摘要翻译： 在堆积步骤中，将多个树脂绝缘层和多个导电层以多层布置交替层叠在可分离地层叠在基材侧上的金属箔上，从而形成布线层压体部分。 在钻井工序中，通过激光钻孔在最外层的树脂绝缘层上形成多个开口，露出连接端子。 随后，在去污步骤中，去除开口内部的污迹。 在堆积步骤之后执行的基材除去步骤中，除去基材并暴露金属箔。

公开(公告)号：US20110211320A1

公开(公告)日：2011-09-01

申请号：US13031735

申请日：2011-02-22

申请人： Shinnosuke MAEDA ,  Takuya TORII ,  Tetsuo SUZUKI ,  Satoshi HIRANO

发明人： Shinnosuke MAEDA ,  Takuya TORII ,  Tetsuo SUZUKI ,  Satoshi HIRANO

IPC分类号： H05K7/00 ,  H05K3/36

CPC分类号： H01L21/6835 ,  H01L23/3107 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2221/68345 ,  H01L2924/0002 ,  H01L2924/19041 ,  H05K3/244 ,  H05K3/4682 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A multilayer wiring substrate includes first principal surface side connection terminals arranged on a first principal surface of a stacked configuration; wherein, the first principal surface side connection terminals include an IC chip connection terminal, and a passive element connection terminal; the IC chip connection terminal is located in an opening formed in a resin insulating layer of an uppermost outer layer; the passive element connection terminal is formed of an upper terminal part formed on the resin insulating layer, and a lower terminal part located in an opening formed at a portion of an inner side of the upper terminal part in the resin insulating layer; and, wherein an upper face of the upper terminal part is higher than a reference surface, and an upper face of the IC chip connection terminal and the lower terminal part are identical in height to or lower in height than the reference surface.

摘要翻译： 多层布线基板包括布置在堆叠构造的第一主表面上的第一主表面侧连接端子; 其中，所述第一主面侧连接端子包括IC芯片连接端子和无源元件连接端子; IC芯片连接端子位于形成在最外层的树脂绝缘层中的开口中; 无源元件连接端子由形成在树脂绝缘层上的上端子部和位于树脂绝缘层中的上端子部的内侧的开口部的下端子部构成， 并且其中所述上端子部分的上表面高于参考表面，并且所述IC芯片连接端子和所述下端子部分的上表面的高度与所述基准表面的高度相同或更低。

公开(公告)号：US20110198114A1

公开(公告)日：2011-08-18

申请号：US13028545

申请日：2011-02-16

申请人： Shinnosuke MAEDA ,  Tetsuo SUZUKI ,  Satoshi HIRANO

发明人： Shinnosuke MAEDA ,  Tetsuo SUZUKI ,  Satoshi HIRANO

IPC分类号： H05K1/09 ,  H01R43/00 ,  H05K1/00

CPC分类号： H05K3/4682 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/205 ,  H05K2201/09745 ,  H05K2201/099 ,  H05K2203/0361 ,  H05K2203/0369 ,  H05K2203/0588 ,  Y10T29/302 ,  Y10T29/49117 ,  H01L2924/00

摘要： A plurality of openings are formed in a resin insulation layer on a top surface side of a wiring laminate portion, and a plurality of openings are formed in a resin insulation layer on a bottom surface side thereof. A plurality of connection terminals are disposed to correspond to the openings. Peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the top surface side, and peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the bottom surface side. Each of the second-main-surface-side connection terminals has a concave portion at the center of the terminal outer surface, and the deepest portion of the concave portion is located on the interior side in relation to the peripheral portion of the terminal outer surface.

摘要翻译： 在布线层叠部的顶面侧的树脂绝缘层上形成有多个开口部，在其底面侧的树脂绝缘层上形成有多个开口部。 多个连接端子被设置成对应于这些开口。 连接端子的端子外表面的外围部分被顶表面侧上的树脂绝缘层覆盖，并且连接端子的端子外表面的周边部分被底表面侧上的树脂绝缘层覆盖。 每个第二主表面侧连接端子在端子外表面的中心具有凹部，并且凹部的最深部相对于端子外表面的周边部位于内侧 。

公开(公告)号：US20110155438A1

公开(公告)日：2011-06-30

申请号：US12978750

申请日：2010-12-27

申请人： Tatsuya ITO ,  Tetsuo SUZUKI ,  Takuya HANDO ,  Shinnosuke MAEDA ,  Atsuhiko SUGIMOTO ,  Satoshi HIRANO

发明人： Tatsuya ITO ,  Tetsuo SUZUKI ,  Takuya HANDO ,  Shinnosuke MAEDA ,  Atsuhiko SUGIMOTO ,  Satoshi HIRANO

IPC分类号： H05K1/11

CPC分类号： H05K3/4682 ,  H05K1/113 ,  H05K3/4007 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/09472

摘要： A multilayer wiring substrate has a multilayer wiring laminate portion in which a plurality of resin insulation layers made primarily of the same resin insulation material, and a plurality of conductive layers are laminated alternately. A plurality of first-main-surface-side connection terminals are disposed on one side of the laminate structure where a first main surface thereof is present, and a plurality of second-main-surface-side connection terminals being disposed on an other side of the laminate structure where a second main surface thereof is present. The plurality of conductive layers are formed in the plurality of resin insulation layers and interconnected by means of via conductors whose diameters increase toward the first main surface or the second main surface. The plurality of first-main-surface-side connection terminals comprising at least two types of terminals for connection of different articles-to-be-connected. Top surfaces of the plurality of first-main-surface-side connection terminals differ in height according to types of the articles-to-be-connected.

摘要翻译： 多层布线基板具有多层布线层叠部，其中主要由相同树脂绝缘材料制成的多个树脂绝缘层和多个导电层交替层叠。 多个第一主表面侧连接端子设置在层叠结构的存在第一主表面的一侧上，并且多个第二主表面侧连接端子设置在 其中存在第二主表面的层压结构。 多个导电层形成在多个树脂绝缘层中，并且通过直径朝向第一主表面或第二主表面增大的通孔导体互连。 多个第一主表面侧连接端子包括用于连接不同待连接物品的至少两种类型的端子。 多个第一主表面侧连接端子的顶表面根据要连接的物品的类型而不同。

公开(公告)号：US20210018861A1

公开(公告)日：2021-01-21

申请号：US16887995

申请日：2020-05-29

申请人： Masashi OHNISHI ,  Tetsuo SUZUKI ,  Shingo KUBOKI

发明人： Masashi OHNISHI ,  Tetsuo SUZUKI ,  Shingo KUBOKI

IPC分类号： G03G15/08

摘要： A developer supply device includes a body, a developer supply unit drawably insertable into the body, and a developer container removably installable in the developer supply unit. The developer container contains a developer and includes a developer discharge port. The developer supply unit includes a lever that closes the developer discharge port when the lever has moved to a first position and opens the developer discharge port when the lever has moved to a second position, and a lock that engages an engagement portion of the lever in conjunction with an operation of drawing the developer supply unit from the body to restrict the lever from moving from the first position to the second position and disengage from the engagement portion in conjunction with an operation of inserting the developer supply unit into the body to allow the lever to move from the first position to the second position.

公开(公告)号：US20110317200A1

公开(公告)日：2011-12-29

申请号：US12961266

申请日：2010-12-06

申请人： Seiji HONDA ,  Toshiharu HAYASHIDA ,  Hirota TAKAHASHI ,  Eiji NAKAHASHI ,  Kenji KUROISHI ,  Masayoshi MIKI ,  Akiyoshi OSUGI ,  Tetsuo SUZUKI

发明人： Seiji HONDA ,  Toshiharu HAYASHIDA ,  Hirota TAKAHASHI ,  Eiji NAKAHASHI ,  Kenji KUROISHI ,  Masayoshi MIKI ,  Akiyoshi OSUGI ,  Tetsuo SUZUKI

IPC分类号： G06K15/02

CPC分类号： B41J29/38 ,  G06F3/1221 ,  G06F3/1253 ,  G06F3/1285 ,  Y02D10/1592

摘要： The present invention provides an information processing apparatus including: a first control section that, when execution of printing at a printing device connected via a communications section is instructed, performs control to display at a display section a print settings screen for making settings relating to the printing; a calculation section that calculates an estimated value of power consumption that the printing device will consume if the printing is executed on the basis of the settings relating to printing; and a second control section that, when a pre-specified operation is performed at the print settings screen, performs control to display the estimated value of power consumption and display at the display section an energy saving settings screen for making, of the settings relating to printing, settings relating to energy saving.

摘要翻译： 本发明提供一种信息处理设备，包括：第一控制部分，当指示在经由通信部分连接的打印设备上执行打印时，执行控制以在显示部分显示用于进行与 打印; 计算部，其根据与打印有关的设定，计算打印装置在执行打印时消耗的功耗的估计值; 以及第二控制部，当在所述打印设置画面上执行预先指定的操作时，进行控制以显示所述功耗的估计值并在所述显示部显示用于制作与所述设置有关的设置的节能设置画面 印刷，节能设置。

公开(公告)号：US20090038743A1

公开(公告)日：2009-02-12

申请号：US12249341

申请日：2008-10-10

申请人： Tetsuo SUZUKI ,  Yoshio Kawakami

发明人： Tetsuo SUZUKI ,  Yoshio Kawakami

IPC分类号： B32B38/10

CPC分类号： G11B5/8404 ,  B24B9/065

摘要： A glass block is formed by stacking, fixing, and integrating a plurality of thin glass plates having a predetermined thickness. An annular glass block is formed by coring the glass block. Surfaces of an inside circumference and an outside circumference of the annular glass block are ground. The annular glass block of which the surfaces of the inside circumference and the outside circumference are ground are separated into individual annular glass substrates, and separated annular glass substrates are cleaned. Then, edge portions of the inside circumference and the outside circumference of a cleaned annular glass substrate are chamfered.

摘要翻译： 通过堆叠，固定和整合具有预定厚度的多个薄玻璃板来形成玻璃块。 通过取芯玻璃块形成环形玻璃块。 研磨环形玻璃块的内周和外周的表面。 将内周面和外周面的表面研磨的环状玻璃块分离成单独的环状玻璃基板，并且分离的环状玻璃基板被清洁。 然后，将清洁后的环状玻璃基板的内周缘部和外周缘部进行倒角。