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公开(公告)号：US4923772A
公开(公告)日：1990-05-08
申请号：US341273
申请日：1989-04-17
申请人： Steven J. Kirch , John R. Lankard , John J. Ritsko , Kurt A. Smith , James L. Speidell , James T. Yeh
发明人： Steven J. Kirch , John R. Lankard , John J. Ritsko , Kurt A. Smith , James L. Speidell , James T. Yeh
CPC分类号： G03F1/58 , G03F1/24 , Y10S430/146
摘要： The present invention is a mask and methods for making masks for use with a laser projection etching system. The unique mask is able to withstand the fluences of the high energy and high power lasers used without degrading. Specifically, the new projection etching masks are fabricated of patterned multiple dielectric layers having alternating high and low indices of refraction on a UV grade synthetic fused silica substrate in order to achieve maximum reflectivity of the laser energy in the opague areas and maximum transmissivity of the laser energy in the transparent areas of the mask.
摘要翻译： 本发明是用于制造用于激光投影蚀刻系统的掩模的掩模和方法。 独特的面罩能够承受高能量和高功率激光器的使用而不降解的能量。 具体来说，新的投影蚀刻掩模由在UV级合成熔融石英基底上具有交替的高折射率和低折射率的图案化多个电介质层制成，以便实现在op区域中激光能量的最大反射率和激光器的最大透射率 能量在面具的透明区域。
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公开(公告)号：US07784673B2
公开(公告)日：2010-08-31
申请号：US12189388
申请日：2008-08-11
CPC分类号： B23K3/0638 , B23K35/02 , B23K2101/40 , H01L2224/11
摘要： A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 公开了一种用于将导电接合材料注射成非矩形模具中的多个空腔的系统和方法。 该方法包括将填充头与非矩形模具对准。 非矩形模具包括多个空腔。 填充头被放置成与非矩形模具基本接触。 旋转运动提供给非矩形模具和填充头中的至少一个，同时填充头基本上与非矩形模具接触。 将导电接合材料从填充头推向非矩形模具。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。
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公开(公告)号：US20080302502A1
公开(公告)日：2008-12-11
申请号：US12189822
申请日：2008-08-12
IPC分类号： B22D17/00
CPC分类号： B23K3/0638 , B23K1/20 , B23K2101/40 , H01L24/11 , H01L24/742 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 公开了一种用于将导电接合材料注射成表面中的多个空腔的系统，方法和装置。 该方法包括将填充头与表面对准。 模具包括多个空腔。 该方法还包括将填充头与表面实质接触。 至少第一气体围绕填充头的第一区域引导。 所述至少第一气体具有高于位于储存器中的导电接合材料的熔点的温度，从而将导电接合材料保持在熔融状态。 导电接合材料从表面压出填料头。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。
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公开(公告)号：US5321886A
公开(公告)日：1994-06-21
申请号：US68037
申请日：1993-05-28
IPC分类号： H01L23/12 , G02F1/13 , H01L21/768 , H05K3/00 , H05K3/02 , H05K3/20 , H05K3/22 , H05K3/28 , H05K3/46
CPC分类号： H05K3/225 , H01L21/76886 , G02F1/1309 , H05K2201/0394 , H05K2201/1028 , H05K2203/0769 , H05K2203/107 , H05K2203/173 , H05K3/0017 , H05K3/027 , H05K3/20 , H05K3/28 , Y10T29/49124 , Y10T29/49155 , Y10T29/49742
摘要： A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
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公开(公告)号：US07410092B2
公开(公告)日：2008-08-12
申请号：US11409233
申请日：2006-04-21
IPC分类号： B23K31/02
CPC分类号： B23K3/0638 , B23K1/20 , B23K2101/40 , H01L24/11 , H01L24/742 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 公开了一种用于将导电接合材料注射成表面中的多个空腔的系统，方法和装置。 该方法包括将填充头与表面对准。 模具包括多个空腔。 该方法还包括将填充头与表面实质接触。 至少第一气体围绕填充头的第一区域引导。 所述至少第一气体具有高于位于储存器中的导电接合材料的熔点的温度，从而将导电接合材料保持在熔融状态。 导电接合材料从表面压出填料头。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。
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6.发明授权
公开(公告)号：US6020946A
公开(公告)日：2000-02-01
申请号：US28018
申请日：1998-02-23
申请人： Alessandro Cesare Callegari , Praveen Chaudhari , James Patrick Doyle , James Andrew Lacey , Shui-Chin Alan Lien , Sampath Purushothaman , Mahesh Govind Samant , James L. Speidell , Joachim Stohr
发明人： Alessandro Cesare Callegari , Praveen Chaudhari , James Patrick Doyle , James Andrew Lacey , Shui-Chin Alan Lien , Sampath Purushothaman , Mahesh Govind Samant , James L. Speidell , Joachim Stohr
IPC分类号： G02F1/1337 , C07C1/00
CPC分类号： G02F1/13378 , G02F1/133734 , G02F2001/133765
摘要： The present invention is a method for forming a liquid-crystal cell of a liquid-crystal display. Initially, a dry processed alignment film is deposited onto a first transparent substrate using a dry processing technique, such as plasma enhanced chemical vapor deposition (PECVD). The dry processed alignment film is then irradiated with a beam of atoms to arrange the atomic structure of the alignment film in at least one desired direction in order to orient the liquid-crystal molecules. Another dry processed alignment film is deposited on a second substrate using a dry processing technique and, likewise, irradiated with a beam of atoms. The first transparent substrate and the second substrate are then sandwiched together with their respective alignment films spaced adjacent to each other. The space between the films is then filled with a liquid-crystal material.
摘要翻译： 本发明是一种形成液晶显示器的液晶元件的方法。 首先，使用诸如等离子体增强化学气相沉积（PECVD）的干法处理技术将干燥处理的取向膜沉积到第一透明基板上。 然后用原子束照射干燥处理的取向膜，以将取向膜的原子结构设置在至少一个所需方向上，以便使液晶分子取向。 使用干法处理技术将另一干燥处理的取向膜沉积在第二基板上，并且同样用原子束照射。 然后将第一透明基板和第二基板夹在一起，并将它们各自的定向膜彼此间隔开。 然后用液晶材料填充膜之间的空间。
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公开(公告)号：US5756236A
公开(公告)日：1998-05-26
申请号：US789905
申请日：1997-01-29
CPC分类号： B23K26/06
摘要： A method of fabricating a high resolution ablation mask for use at laser fluences of greater than 200 mJ/cm.sup.2 is disclosed. The method comprises combining dry etching and chemical etching of an unetched ablation mask which comprises a transparent substrate, a layer of high UV light refractivity material, e.g. aluminum, deposited on said substrate, and a photoresist layer positioned on a predetermined area of said high UV light refractivity material layer leaving other areas of said high UV light refractivity material layer exposed.
摘要翻译： 公开了一种在大于200mJ / cm 2的激光能量密度下制造高分辨率消融掩模的方法。 该方法包括组合干蚀刻和未蚀刻消融掩模的化学蚀刻，其包括透明衬底，高UV光折射材料层， 铝，沉积在所述衬底上，以及光致抗蚀剂层，其定位在所述高UV光折射率材料层的预定区域上，留下所述高UV光折射率材料层的其它区域暴露。
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公开(公告)号：US5310967A
公开(公告)日：1994-05-10
申请号：US68036
申请日：1993-05-28
IPC分类号： H01L23/12 , G02F1/13 , H01L21/768 , H05K3/00 , H05K3/02 , H05K3/20 , H05K3/22 , H05K3/28 , H05K3/46 , H05K1/00
CPC分类号： H05K3/225 , H01L21/76886 , G02F1/1309 , H05K2201/0394 , H05K2201/1028 , H05K2203/0769 , H05K2203/107 , H05K2203/173 , H05K3/0017 , H05K3/027 , H05K3/20 , H05K3/28 , Y10T29/49124 , Y10T29/49155 , Y10T29/49742
摘要： A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
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公开(公告)号：US5289632A
公开(公告)日：1994-03-01
申请号：US981458
申请日：1992-11-25
IPC分类号： H01L23/12 , G02F1/13 , H01L21/768 , H05K3/00 , H05K3/02 , H05K3/20 , H05K3/22 , H05K3/28 , H05K3/46
CPC分类号： H05K3/225 , H01L21/76886 , G02F1/1309 , H05K2201/0394 , H05K2201/1028 , H05K2203/0769 , H05K2203/107 , H05K2203/173 , H05K3/0017 , H05K3/027 , H05K3/20 , H05K3/28 , Y10T29/49124 , Y10T29/49155 , Y10T29/49742
摘要： A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.
摘要翻译： 通过将导线与衬底的选定区域并置定位来将导线施加到衬底; 将导线接合到基板上; 以及将导线从其中悬挂有导线的载体分离。 载体具有由侧壁限定的载体开口，并且导电材料被载体开口的侧壁悬挂以嵌入载体开口中，并形成导电线。
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公开(公告)号：US20080315409A1
公开(公告)日：2008-12-25
申请号：US11765055
申请日：2007-06-19
申请人： Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
发明人： Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
IPC分类号： H01L23/48
CPC分类号： H01L21/6835 , H01L24/11 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2224/0401 , H01L2224/06183 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16137 , H01L2224/16238 , H01L2224/17183 , H01L2224/81005 , H01L2224/811 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81986 , H01L2224/97 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01054 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1532 , H01L2924/30105 , H01L2924/3025 , H01L2924/3512 , H01L2924/00 , H01L2224/83851 , H01L2224/81
摘要： The present invention allows for direct chip-to-chip connections using the shortest possible signal path.
摘要翻译： 本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。
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