公开(公告)号：US20150333022A1

公开(公告)日：2015-11-19

申请号：US14280110

申请日：2014-05-16

申请人： Sven Albers ,  Georg Seidemann ,  Sonja Koller ,  Stephan Stoeckl ,  Shubhada H. Sahasrabudhe ,  Sandeep B. Sane

发明人： Sven Albers ,  Georg Seidemann ,  Sonja Koller ,  Stephan Stoeckl ,  Shubhada H. Sahasrabudhe ,  Sandeep B. Sane

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/05 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/141 ,  H01L2224/16238 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/0373

摘要： Disclosed herein are contact pads for use with integrated circuit (IC) packages. In some embodiments, a contact pad disclosed herein may be disposed on a substrate of an IC package, and may include a metal projection portion and a metal recess portion. Each of the metal projection portion and the metal recess portion may have a solder contact surface. The solder contact surface of the metal recess portion may be spaced away from the solder contact surface of the metal projection portion. Related devices and techniques are also disclosed herein, and other embodiments may be claimed.

摘要翻译： 这里公开了与集成电路（IC）封装一起使用的接触焊盘。 在一些实施例中，本文公开的接触垫可以设置在IC封装的基板上，并且可以包括金属突出部分和金属凹部。 金属突出部和金属凹部中的每一个可以具有焊料接触表面。 金属凹部的焊接接触表面可以与金属突出部的焊接接触表面间隔开。 本文还公开了相关的设备和技术，并且可以要求保护其他实施例。

公开(公告)号：US20150243572A1

公开(公告)日：2015-08-27

申请号：US14189938

申请日：2014-02-25

申请人： Sven Albers ,  Sonja Koller ,  Thorsten Meyer ,  Georg Seidemann ,  Christian Geissler ,  Andreas Wolter

发明人： Sven Albers ,  Sonja Koller ,  Thorsten Meyer ,  Georg Seidemann ,  Christian Geissler ,  Andreas Wolter

IPC分类号： H01L23/31 ,  H01L21/56

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed towards an integrated circuit (IC) package including a die having a first side and a second side disposed opposite to the first side. The IC package may further include an encapsulation material encapsulating at least a portion of the die and having a first surface that is adjacent to the first side of the die and a second surface disposed opposite to the first surface. In embodiments, the second surface may be shaped such that one or more cross-section areas of the IC package are thinner than one or more other cross-section areas of the IC package. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及集成电路（IC）封装，其包括具有与第一侧相对设置的第一侧和第二侧的管芯。 IC封装还可以包括封装模具的至少一部分并且具有与模具的第一侧相邻的第一表面的封装材料和与第一表面相对设置的第二表面。 在实施例中，第二表面可以被成形为使得IC封装的一个或多个横截面积比IC封装的一个或多个其它横截面积更薄。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20180286798A1

公开(公告)日：2018-10-04

申请号：US15476270

申请日：2017-03-31

申请人： Bernd Waidhas ,  Sonja Koller ,  Georg Seidemann

发明人： Bernd Waidhas ,  Sonja Koller ,  Georg Seidemann

IPC分类号： H01L23/498 ,  H01L23/00

CPC分类号： H01L29/7835 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/06 ,  H01L29/66659

摘要： A power mesh-on-die apparatus includes a solder trace that enhances current flow for a power source trace between adjacent power bumps. The solder trace is also applied between power drain bumps on a power drain trace.

公开(公告)号：US20180177037A1

公开(公告)日：2018-06-21

申请号：US15386905

申请日：2016-12-21

申请人： Sonja Koller ,  Georg Seidemann ,  Vishnu Prasad

发明人： Sonja Koller ,  Georg Seidemann ,  Vishnu Prasad

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K5/02 ,  H05K7/20 ,  H05K9/00 ,  G06F1/20

CPC分类号： H05K1/0203 ,  G06F1/203 ,  G06F1/206 ,  H05K1/181 ,  H05K5/0217 ,  H05K7/20218 ,  H05K9/0024 ,  H05K2201/062 ,  H05K2201/10151

摘要： Discussed generally herein are devices that include a switchable heat path. A device can include a device skin, a circuit board, a plurality of components on the circuit board, and a switchable heat path situated between the components and the device skin, the switchable heat path configured to be switched between an on state and an off state, the switchable heat path configured to conduct a first amount of heat from the components to the device skin when in the on state and configured to conduct a second, lesser amount of heat from the components to the device skin when in an off state.

公开(公告)号：US20180284851A1

公开(公告)日：2018-10-04

申请号：US15475368

申请日：2017-03-31

申请人： Georg Seidemann ,  Bernd Waidhas ,  Thomas Wagner ,  Andreas Wolter ,  Sonja Koller ,  Vishnu Prasad

发明人： Georg Seidemann ,  Bernd Waidhas ,  Thomas Wagner ,  Andreas Wolter ,  Sonja Koller ,  Vishnu Prasad

IPC分类号： G06F1/20 ,  H05K7/20 ,  G06F1/18

摘要： An electronic component assembly includes a substrate having a first face and an opposed second face. One or more electronic components are coupled with either or both of the first and second faces. A filler interface heat transfer system is coupled with the substrate. The filler interface heat transfer system includes at least one enclosure shell coupled with one of the first or second faces. The at least one enclosure shell surrounds a filler cavity including the one or more electronic components therein. A heat transfer filler is within the filler cavity, the heat transfer filler includes a contoured filler profile conforming to at least the one or more electronic components.

公开(公告)号：US20180277512A1

公开(公告)日：2018-09-27

申请号：US15464920

申请日：2017-03-21

申请人： Bernd Waidhas ,  Georg Seidemann ,  Andreas Wolter ,  Thomas Wagner ,  Stephan Stoeckl ,  Laurent Millou

发明人： Bernd Waidhas ,  Georg Seidemann ,  Andreas Wolter ,  Thomas Wagner ,  Stephan Stoeckl ,  Laurent Millou

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00

摘要： An embedded-bridge substrate connector apparatus includes a patterned reference layer to which a first module and a subsequent module are aligned and the two modules are mated at the patterned reference layer. At least one module includes a silicon bridge connector that bridges to two devices, through the patterned reference layer, to the mated module.

公开(公告)号：US20180190589A1

公开(公告)日：2018-07-05

申请号：US15394388

申请日：2016-12-29

申请人： Bernd Waidhas ,  Stephan Stoeckl ,  Andreas Wolter ,  Reinhard Mahnkopf ,  Georg Seidemann ,  Thomas Wagner ,  Laurent Millou

发明人： Bernd Waidhas ,  Stephan Stoeckl ,  Andreas Wolter ,  Reinhard Mahnkopf ,  Georg Seidemann ,  Thomas Wagner ,  Laurent Millou

IPC分类号： H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L21/48 ,  H01L23/053

CPC分类号： H01L23/5386 ,  H01L21/4846 ,  H01L23/053 ,  H01L23/5387 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/13099

摘要： A bent-bridge semiconductive apparatus includes a silicon bridge that is integral to a semiconductive device and the silicon bridge is deflected out of planarity. The silicon bridge may couple two semiconductive devices, all of which are from an integral processed die.

公开(公告)号：US20190103347A1

公开(公告)日：2019-04-04

申请号：US15720606

申请日：2017-09-29

申请人： Georg Seidemann ,  Andreas Wolter ,  Stephan Stoeckl ,  Thomas Wagner

发明人： Georg Seidemann ,  Andreas Wolter ,  Stephan Stoeckl ,  Thomas Wagner

IPC分类号： H01L23/498 ,  H01L23/538 ,  H01L23/13 ,  H01L25/065 ,  H05K3/32 ,  H05K3/00

摘要： A system and method for aligning components is disclosed. A system arranges a plurality of components in a first component alignment. The system places two L-shaped fine placement tools in a position surrounding the plurality of components, wherein the L-shaped fine placement tools include a plurality of pins. The system applies a force to the pins included in the two L-shaped fine placement tools to shift the plurality of components from the first component alignment to a second component alignment, wherein the second component alignment has less unused space than the first component alignment. The system removes the two L-shaped fine placement tools. The system attaches the plurality of components to a carrier arranged in the second component alignment.

公开(公告)号：US20180095426A1

公开(公告)日：2018-04-05

申请号：US15282615

申请日：2016-09-30

申请人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

发明人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

IPC分类号： G04B37/14 ,  H04B1/3827 ,  A44C5/02 ,  A44C5/00 ,  A44C5/14

CPC分类号： G04B37/1486 ,  A44C5/0053 ,  A44C5/02 ,  A44C5/105 ,  A44C5/14 ,  G06F1/163 ,  H04B1/385 ,  H04B2001/3861 ,  H04W4/80

摘要： A flexible band wearable electronic device includes a plurality of rigid links. The flexible band wearable electronic device also includes a number of pivot joints coupling the plurality of rigid links together. The flexible band wearable electronic device further includes a first electronic device on a first of the plurality of rigid links, and a second electronic device on a second of the plurality of rigid links. The flexible band wearable electronic device still further includes an electrical communication pathway between first electronic device and the second electronic device and through at least a portion of one of the number of pivot joints.

公开(公告)号：US20150048520A1

公开(公告)日：2015-02-19

申请号：US13965746

申请日：2013-08-13

申请人： Michael P. Skinner ,  Teodora Ossiander ,  Sven Albers ,  Georg Seidemann

发明人： Michael P. Skinner ,  Teodora Ossiander ,  Sven Albers ,  Georg Seidemann

IPC分类号： H01L23/32 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01F7/04 ,  H01L23/32 ,  H01L23/49811 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/11332 ,  H01L2224/11522 ,  H01L2224/132 ,  H01L2224/13298 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13444 ,  H01L2224/13464 ,  H01L2224/13469 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/811 ,  H01L2224/81139 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06531 ,  H01L2225/06568 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/207 ,  H01L2924/00012

摘要： Embodiments of the present disclosure are directed to integrated circuit (IC) package assemblies with magnetic contacts, as well as corresponding fabrication methods and systems incorporating such magnetic contacts. A first IC substrate may have a first magnet coupled with a first electrical routing feature. A second IC substrate may have a second magnet coupled with a second electrical routing feature. The magnets may be embedded in the IC substrates and/or electrical routing features. The magnets may generate a magnetic field that extends across a gap between the first and second electrical routing features. Electrically conductive magnetic particles may be applied to one or both of the IC substrates to form a magnetic interconnect structure that extends across the gap. In some embodiments, magnetic contacts may be demagnetized by heating the magnets to a corresponding partial demagnetization temperature (PDT) or Curie temperature. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及具有磁性触点的集成电路（IC）封装组件，以及包含这种磁性触点的对应的制造方法和系统。 第一IC基板可以具有与第一电路径特征耦合的第一磁体。 第二IC基板可以具有与第二电路径特征耦合的第二磁体。 磁体可以嵌入在IC基板和/或电路径特征中。 磁体可以产生延伸穿过第一和第二电路由特征之间的间隙的磁场。 可以将导电磁性颗粒施加到IC基板中的一个或两个以形成跨越间隙延伸的磁互连结构。 在一些实施例中，通过将磁体加热到对应的部分退磁温度（PDT）或居里温度，磁接触件可以去磁。 可以描述和/或要求保护其他实施例。