-
公开(公告)号:US20190103347A1
公开(公告)日:2019-04-04
申请号:US15720606
申请日:2017-09-29
IPC分类号: H01L23/498 , H01L23/538 , H01L23/13 , H01L25/065 , H05K3/32 , H05K3/00
摘要: A system and method for aligning components is disclosed. A system arranges a plurality of components in a first component alignment. The system places two L-shaped fine placement tools in a position surrounding the plurality of components, wherein the L-shaped fine placement tools include a plurality of pins. The system applies a force to the pins included in the two L-shaped fine placement tools to shift the plurality of components from the first component alignment to a second component alignment, wherein the second component alignment has less unused space than the first component alignment. The system removes the two L-shaped fine placement tools. The system attaches the plurality of components to a carrier arranged in the second component alignment.
-
公开(公告)号:US20180277512A1
公开(公告)日:2018-09-27
申请号:US15464920
申请日:2017-03-21
申请人: Bernd Waidhas , Georg Seidemann , Andreas Wolter , Thomas Wagner , Stephan Stoeckl , Laurent Millou
发明人: Bernd Waidhas , Georg Seidemann , Andreas Wolter , Thomas Wagner , Stephan Stoeckl , Laurent Millou
IPC分类号: H01L25/065 , H01L23/538 , H01L23/498 , H01L23/00 , H01L21/56 , H01L25/00
摘要: An embedded-bridge substrate connector apparatus includes a patterned reference layer to which a first module and a subsequent module are aligned and the two modules are mated at the patterned reference layer. At least one module includes a silicon bridge connector that bridges to two devices, through the patterned reference layer, to the mated module.
-
公开(公告)号:US20180190589A1
公开(公告)日:2018-07-05
申请号:US15394388
申请日:2016-12-29
申请人: Bernd Waidhas , Stephan Stoeckl , Andreas Wolter , Reinhard Mahnkopf , Georg Seidemann , Thomas Wagner , Laurent Millou
发明人: Bernd Waidhas , Stephan Stoeckl , Andreas Wolter , Reinhard Mahnkopf , Georg Seidemann , Thomas Wagner , Laurent Millou
IPC分类号: H01L23/538 , H01L25/065 , H01L23/00 , H01L21/48 , H01L23/053
CPC分类号: H01L23/5386 , H01L21/4846 , H01L23/053 , H01L23/5387 , H01L24/14 , H01L24/16 , H01L24/48 , H01L25/0655 , H01L2224/13024 , H01L2224/16145 , H01L2224/16227 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014 , H01L2924/01014 , H01L2924/1431 , H01L2924/1434 , H01L2924/15159 , H01L2924/15311 , H01L2924/15738 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2224/45099 , H01L2924/00012 , H01L2224/13099
摘要: A bent-bridge semiconductive apparatus includes a silicon bridge that is integral to a semiconductive device and the silicon bridge is deflected out of planarity. The silicon bridge may couple two semiconductive devices, all of which are from an integral processed die.
-
公开(公告)号:US20180284851A1
公开(公告)日:2018-10-04
申请号:US15475368
申请日:2017-03-31
申请人: Georg Seidemann , Bernd Waidhas , Thomas Wagner , Andreas Wolter , Sonja Koller , Vishnu Prasad
发明人: Georg Seidemann , Bernd Waidhas , Thomas Wagner , Andreas Wolter , Sonja Koller , Vishnu Prasad
摘要: An electronic component assembly includes a substrate having a first face and an opposed second face. One or more electronic components are coupled with either or both of the first and second faces. A filler interface heat transfer system is coupled with the substrate. The filler interface heat transfer system includes at least one enclosure shell coupled with one of the first or second faces. The at least one enclosure shell surrounds a filler cavity including the one or more electronic components therein. A heat transfer filler is within the filler cavity, the heat transfer filler includes a contoured filler profile conforming to at least the one or more electronic components.
-
5.
公开(公告)号:US20190006281A1
公开(公告)日:2019-01-03
申请号:US15637641
申请日:2017-06-29
IPC分类号: H01L23/538 , H01L23/498 , H01L25/065 , G11C16/18
CPC分类号: H01L23/5382 , G11C16/18 , H01L23/49861 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L2224/0401 , H01L2224/16227 , H01L2224/32245 , H01L2224/4826 , H01L2224/73253 , H01L2224/81005 , H01L2224/81191 , H01L2224/83191 , H01L2224/83192 , H01L2224/92225 , H01L2924/1434 , H01L2924/15311 , H01L2924/15313
摘要: A multi-chip module includes two silicon bridge interconnects and three components that are tied together by the bridges with one of the components in the center. At least one of the silicon bridge interconnects is bent to create a non-planar chip-module form factor. Cross-connected multi-chip silicon bent-bridge interconnect modules include the two silicon bridges contacting the center component at right angles to each other, plus a fourth component and a third silicon bridge interconnect contacting the fourth component and any one of the original three components.
-
公开(公告)号:US20180096970A1
公开(公告)日:2018-04-05
申请号:US15282855
申请日:2016-09-30
IPC分类号: H01L25/065 , H01L23/31 , H01L23/00
CPC分类号: H01L24/06 , H01L23/3128 , H01L24/13 , H01L24/14 , H01L24/17 , H01L25/117 , H01L25/50 , H01L2224/02311 , H01L2224/0237 , H01L2224/02379 , H01L2224/04105 , H01L2224/06132 , H01L2224/06134 , H01L2224/09177 , H01L2224/11334 , H01L2224/12105 , H01L2224/13024 , H01L2224/1403 , H01L2224/14051 , H01L2224/16145 , H01L2224/1703 , H01L2224/17051 , H01L2224/73204 , H01L2225/1058 , H01L2225/1064
摘要: A microelectronic package with two semiconductor die coupled on opposite sides of a redistribution layer 108, and at least partially overlapping with one another. At least a first of the semiconductor die includes two sets of contacts, the first group of contacts arranged at a lesser pitch relative to one another than are a second group of contacts. The first group of contacts at the larger pitch are placed to engage contacts in a redistribution layer 108. The second group of contacts at the lesser pitch are placed to engage respective contacts at the same pitch on the second semiconductor die.
-
公开(公告)号:US20150333022A1
公开(公告)日:2015-11-19
申请号:US14280110
申请日:2014-05-16
申请人: Sven Albers , Georg Seidemann , Sonja Koller , Stephan Stoeckl , Shubhada H. Sahasrabudhe , Sandeep B. Sane
发明人: Sven Albers , Georg Seidemann , Sonja Koller , Stephan Stoeckl , Shubhada H. Sahasrabudhe , Sandeep B. Sane
IPC分类号: H01L23/00 , H01L23/498
CPC分类号: H01L24/05 , H01L23/49811 , H01L23/49816 , H01L24/03 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/0401 , H01L2224/141 , H01L2224/16238 , H01L2924/15311 , H01L2924/3511 , H05K1/111 , H05K3/3436 , H05K2201/0373
摘要: Disclosed herein are contact pads for use with integrated circuit (IC) packages. In some embodiments, a contact pad disclosed herein may be disposed on a substrate of an IC package, and may include a metal projection portion and a metal recess portion. Each of the metal projection portion and the metal recess portion may have a solder contact surface. The solder contact surface of the metal recess portion may be spaced away from the solder contact surface of the metal projection portion. Related devices and techniques are also disclosed herein, and other embodiments may be claimed.
摘要翻译: 这里公开了与集成电路(IC)封装一起使用的接触焊盘。 在一些实施例中,本文公开的接触垫可以设置在IC封装的基板上,并且可以包括金属突出部分和金属凹部。 金属突出部和金属凹部中的每一个可以具有焊料接触表面。 金属凹部的焊接接触表面可以与金属突出部的焊接接触表面间隔开。 本文还公开了相关的设备和技术,并且可以要求保护其他实施例。
-
公开(公告)号:US20180095426A1
公开(公告)日:2018-04-05
申请号:US15282615
申请日:2016-09-30
申请人: Sven Albers , Klaus Reingruber , Andreas Wolter , Georg Seidemann , Christian Geissler , Thorsten Meyer , Gerald Ofner
发明人: Sven Albers , Klaus Reingruber , Andreas Wolter , Georg Seidemann , Christian Geissler , Thorsten Meyer , Gerald Ofner
IPC分类号: G04B37/14 , H04B1/3827 , A44C5/02 , A44C5/00 , A44C5/14
CPC分类号: G04B37/1486 , A44C5/0053 , A44C5/02 , A44C5/105 , A44C5/14 , G06F1/163 , H04B1/385 , H04B2001/3861 , H04W4/80
摘要: A flexible band wearable electronic device includes a plurality of rigid links. The flexible band wearable electronic device also includes a number of pivot joints coupling the plurality of rigid links together. The flexible band wearable electronic device further includes a first electronic device on a first of the plurality of rigid links, and a second electronic device on a second of the plurality of rigid links. The flexible band wearable electronic device still further includes an electrical communication pathway between first electronic device and the second electronic device and through at least a portion of one of the number of pivot joints.
-
公开(公告)号:US09819327B2
公开(公告)日:2017-11-14
申请号:US14398049
申请日:2013-06-26
申请人: Saravana Maruthamuthu , Thorsten Meyer , Pablo Herrero , Andreas Wolter , Georg Seidemann , Mikael Knudsen , Pauli Jaervinen
发明人: Saravana Maruthamuthu , Thorsten Meyer , Pablo Herrero , Andreas Wolter , Georg Seidemann , Mikael Knudsen , Pauli Jaervinen
CPC分类号: H03H9/0014 , H01Q5/335 , H03H7/40 , H04B1/0458
摘要: Techniques and configurations are disclosed for bulk acoustic wave resonator (BAWR) tuner circuits and their use in integrated circuit (IC) packages and mobile communication devices for radio frequency (RF) communication. In some embodiments, a mobile communication device may include an antenna; a transmitter circuit having an output port, a tuner circuit having one or more BAWRs, an antenna port coupled to the antenna, a transmitter port coupled to the output port of the transmitter circuit, and a control port; and a control circuit, coupled to the control port, configured to adjust an impedance of the tuner circuit, via adjustment of a BAWR or another component of the tuner circuit, based at least in part on an impedance of the antenna. Other embodiments may be described and/or claimed.
-
公开(公告)号:US20150243572A1
公开(公告)日:2015-08-27
申请号:US14189938
申请日:2014-02-25
申请人: Sven Albers , Sonja Koller , Thorsten Meyer , Georg Seidemann , Christian Geissler , Andreas Wolter
发明人: Sven Albers , Sonja Koller , Thorsten Meyer , Georg Seidemann , Christian Geissler , Andreas Wolter
CPC分类号: H01L21/56 , H01L21/568 , H01L21/78 , H01L23/3128 , H01L23/562 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H01L2924/00
摘要: Embodiments of the present disclosure are directed towards an integrated circuit (IC) package including a die having a first side and a second side disposed opposite to the first side. The IC package may further include an encapsulation material encapsulating at least a portion of the die and having a first surface that is adjacent to the first side of the die and a second surface disposed opposite to the first surface. In embodiments, the second surface may be shaped such that one or more cross-section areas of the IC package are thinner than one or more other cross-section areas of the IC package. Other embodiments may be described and/or claimed.
摘要翻译: 本公开的实施例涉及集成电路(IC)封装,其包括具有与第一侧相对设置的第一侧和第二侧的管芯。 IC封装还可以包括封装模具的至少一部分并且具有与模具的第一侧相邻的第一表面的封装材料和与第一表面相对设置的第二表面。 在实施例中,第二表面可以被成形为使得IC封装的一个或多个横截面积比IC封装的一个或多个其它横截面积更薄。 可以描述和/或要求保护其他实施例。
-
-
-
-
-
-
-
-
-