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    Manufacturing method of piezoelectric/electrostrictive film type device
    1.
    发明授权
    Manufacturing method of piezoelectric/electrostrictive film type device 失效
    压电/电致伸缩薄膜型器件的制造方法

    公开(公告)号：US07267840B2

    公开(公告)日：2007-09-11

    申请号：US10630887

    申请日：2003-07-30

    申请人： Takao Ohnishi ,  Masahiro Murasato ,  Yuki Bessho ,  Nobuo Takahashi

    发明人： Takao Ohnishi ,  Masahiro Murasato ,  Yuki Bessho ,  Nobuo Takahashi

    IPC分类号： B05D5/12

    CPC分类号： H01L41/314 ,  H01L41/0973 ,  H01L41/273

    摘要： A method is provided for manufacturing a piezoelectric/electrostrictive film device including a ceramic substrate and a piezoelectric/electrostrictive operation portion including a lower electrode, a piezoelectric/electrostrictive layer, and upper electrode stacked on the substrate. The piezoelectric/electrostrictive layer is formed to extend beyond at least one of electrodes to form projected portions at its ends. The method includes the steps of forming the piezoelectric/electrostrictive layer so that ends of the piezoelectric/electrostrictive layer are projected to extend beyond ends of at least one electrode, applying a coating liquid in a sufficient amount so that the coating liquid permeates through a gap between at least the projected end portion of the piezoelectric/electrostrictive layer and the substrate, and so as to coat a predetermined portion of the at least one electrode, and drying the applied coating liquid to form a coupling member to couple the projected end portions of the piezoelectric/electrostrictive layer to the substrate.

    摘要翻译： 提供一种用于制造包括陶瓷基板和压电/电致伸缩操作部分的压电/电致伸缩膜装置的方法，该压电/电致伸缩操作部分包括堆叠在基板上的下电极，压电/电致伸缩层和上电极。 压电/电致伸缩层被形成为延伸超过至少一个电极以在其端部处形成突出部分。 该方法包括以下步骤：形成压电/电致伸缩层，使得压电/电致伸缩层的端部突出延伸超过至少一个电极的端部，施加足够量的涂覆液体，使得涂布液体渗透通过间隙 在压电/电致伸缩层的至少突出的端部与基板之间，并且涂覆至少一个电极的预定部分，并干燥所施加的涂覆液体以形成耦合部件，以将突出的端部 压电/电致伸缩层到基板。

    Diaphragm structure
    3.
    发明授权
    Diaphragm structure 失效
    隔膜结构

    公开(公告)号：US5965970A

    公开(公告)日：1999-10-12

    申请号：US639609

    申请日：1996-04-29

    申请人： Yukihisa Takeuchi ,  Keizo Miyata ,  Takao Ohnishi ,  Nobuo Takahashi

    发明人： Yukihisa Takeuchi ,  Keizo Miyata ,  Takao Ohnishi ,  Nobuo Takahashi

    IPC分类号： G01L7/08 ,  G01L9/00 ,  G01L9/04 ,  H01L41/09 ,  H01L41/08

    CPC分类号： H01L41/0973

    摘要： A diaphragm structure includes a ceramic substrate having at least one window portion and a thin diaphragm laminated onto the ceramic substrate so as to cover the window portion, wherein only a part of an interface between the ceramic substrate and the thin diaphragm is joined to form a joint of the diaphragm. A diaphragm structure is free from instability caused by a breakage or deformation of a partition wall between window portions upon punching or laminating even if a diaphragm structure employs a design in which dimensions of a diaphragm portion is maintained and simultaneously a distance between diaphragm portions is made narrow to restrain a surface area excluding a diaphragm portion of a diaphragm structure or a design in which a plurality of diaphragm portion having various configurations and dimensions are disposed.

    摘要翻译： 膜片结构包括陶瓷基板，其具有至少一个窗口部分和层叠在陶瓷基板上以便覆盖窗口部分的薄隔膜，其中仅陶瓷基板和薄隔膜之间的界面的一部分接合形成 隔膜的关节。 即使膜片结构采用保持隔膜部分的尺寸同时设置隔膜部分之间的距离的设计，隔膜结构也不会因冲孔或层压时窗口部分之间的隔壁的断裂或变形而引起的不稳定性 狭窄以限制除隔膜结构的隔膜部分之外的表面积或其中设置有具有各种构造和尺寸的多个隔膜部分的设计。

    Process for film formation
    5.
    发明授权
    Process for film formation 失效
    成膜方法

    公开(公告)号：US5677014A

    公开(公告)日：1997-10-14

    申请号：US687933

    申请日：1996-07-29

    申请人： Takao Ohnishi ,  Natsumi Shimogawa ,  Yukihisa Takeuchi ,  Nobuo Takahashi

    发明人： Takao Ohnishi ,  Natsumi Shimogawa ,  Yukihisa Takeuchi ,  Nobuo Takahashi

    IPC分类号： B23K26/351 ,  B23K26/361 ,  C04B41/00 ,  C04B41/53 ,  C04B41/80 ,  C04B41/91 ,  H01C17/242 ,  H01L41/22 ,  H05K1/03 ,  H05K1/16 ,  H05K3/00 ,  H05K3/02 ,  H05K3/08 ,  B05D3/00

    CPC分类号： C04B41/009 ,  C04B41/0036 ,  C04B41/5346 ,  C04B41/80 ,  C04B41/91 ,  H05K1/0306 ,  H05K3/027

    摘要： A process for forming a film on a ceramic substrate or on a fired film formed thereon includes coating, on a ceramic substrate or on a fired film formed thereon, a material which becomes a metallic film or a ceramic film upon firing, to form an as-coated film, irradiating the as-coated film with an energy beam which does not damage the ceramic substrate or the fired film formed thereon to such an extent that it becomes useless and which can decompose and remove the as-coated film, to trim the unrequired portion(s) of the as-coated film, and firing the trimmed as-coated film to form a desired film. The film can be formed on a ceramic substrate or on a fired film formed thereon while the damage to the substrate or the fired film is minimized.

    摘要翻译： 在陶瓷基板或其上形成的烧成膜上形成膜的方法包括在陶瓷基板上或其上形成的烧成膜上涂覆在烧制时成为金属膜或陶瓷膜的材料，形成为 涂覆膜，用不会损坏陶瓷基板或其上形成的烧成膜的能量束照射到被涂膜，使得其变得无用并且可以分解和去除涂覆膜，从而修整 涂覆膜的不需要部分，并且烧制经修整的被涂膜以形成所需的膜。 该膜可以形成在陶瓷基板上或形成在其上的烧结膜上，同时对基板或烧制膜的损坏最小化。

    MANUFACTURING METHOD FOR THIN BOARD-SHAPED FIRED PIEZOELECTRIC BODY
    6.
    发明申请
    MANUFACTURING METHOD FOR THIN BOARD-SHAPED FIRED PIEZOELECTRIC BODY 有权
    薄板形激光压电体的制造方法

    公开(公告)号：US20120030916A1

    公开(公告)日：2012-02-09

    申请号：US13273608

    申请日：2011-10-14

    申请人： Nobuo Takahashi ,  Takao Ohnishi

    发明人： Nobuo Takahashi ,  Takao Ohnishi

    IPC分类号： H01L41/22

    CPC分类号： H01L41/273 ,  C04B35/62222 ,  C04B35/634 ,  H01L21/4807 ,  H01L21/481 ,  H01L41/053 ,  H01L41/29 ,  H01L41/33 ,  H01L41/338 ,  H01L41/35 ,  H01L41/43 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49126 ,  Y10T29/49165

    摘要： A manufacturing method for a thin board-shaped fired piezoelectric body has: a step of manufacturing, using a piezoelectric material, a green sheet having a ratio T/L of 0.000002 to 0.2, where T is the thickness and L is the maximum length within the surface after firing; and a step of obtaining the thin board-shaped fired piezoelectric body with reinforcing members for firing by performing firing after disposing the reinforcing members for firing by scattering at least on one surface of the green sheet so as to exclude the areas to be the thin board-shaped fired piezoelectric body later. The piezoelectric body which has excellent planarity and a thin board shape can be manufactured at low cost by the method.

    摘要翻译： 薄板状烧结压电体的制造方法具有以下步骤：使用压电材料制造比例T / L为0.000002〜0.2的生片，其中T为厚度，L为最大长度 烧结后的表面; 以及在通过在生片的至少一个表面上散射而设置用于烧制的加强构件之后，通过进行烧制来获得具有用于烧制的加强构件的薄板状烧结压电体的步骤，以排除作为薄板的区域 形式的烧结压电体。 可以通过该方法以低成本制造具有优异的平面性和薄板形状的压电体。

    Piezoelectric/electrostriction element manufacturing method
    9.
    发明授权
    Piezoelectric/electrostriction element manufacturing method 失效
    压电/电致伸缩元件制造方法

    公开(公告)号：US08291558B2

    公开(公告)日：2012-10-23

    申请号：US11962863

    申请日：2007-12-21

    申请人： Takao Ohnishi ,  Takashi Wada ,  Tomohiro Yamada ,  Makoto Tani

    发明人： Takao Ohnishi ,  Takashi Wada ,  Tomohiro Yamada ,  Makoto Tani

    IPC分类号： H04R17/10 ,  C04B35/64

    CPC分类号： H01L41/0973 ,  H01L41/0475 ,  H01L41/257 ,  Y10T29/42 ,  Y10T29/49155 ,  Y10T29/49163

    摘要： A method for manufacturing a piezoelectric/electrostrictive element includes a step of subjecting the piezoelectric/electrostrictive film to a heat treatment and a polarization treatment after the film is allowed to stand until the value of an electric constant has converged after the heat treatment. The piezoelectric/electrostrictive element manufactured in this method has small stress remaining in the piezoelectric/electrostrictive film, and predetermined performance regarding, for example, a displacement amount, a displacement-generating force, and an electric power efficiency (consumed electric power) as a piezoelectric/electrostrictive element (piezoelectric/electrostrictive film) is never spoiled.

    摘要翻译： 压电/电致伸缩元件的制造方法包括在使膜静置直到电常数在热处理后收敛的状态下，对压电/电致伸缩薄膜进行热处理和极化处理的步骤。 通过该方法制造的压电/电致伸缩元件在压电/电致伸缩膜中残留的应力小，例如在位移量，位移产生力和电力效率（消耗电力）中作为 压电/电致伸缩元件（压电/电致伸缩膜）从未被破坏。

    PIEZOELECTRIC/ELECTROSTRICTIVE ELEMENT AND MANUFACTURING METHOD OF THE SAME
    10.
    发明申请
    PIEZOELECTRIC/ELECTROSTRICTIVE ELEMENT AND MANUFACTURING METHOD OF THE SAME 失效
    压电元件及其制造方法

    公开(公告)号：US20100187953A1

    公开(公告)日：2010-07-29

    申请号：US12693710

    申请日：2010-01-26

    申请人： Takao Ohnishi ,  Yuhji Umeda ,  Naoki Goto

    发明人： Takao Ohnishi ,  Yuhji Umeda ,  Naoki Goto

    IPC分类号： H01L41/047 ,  H01L41/22

    CPC分类号： H01L41/29 ,  H01L41/047 ,  H01L41/0477 ,  H01L41/0973 ,  H01L41/314 ,  Y10T29/42

    摘要： There is disclosed a piezoelectric/electrostrictive element which can be used as a sensor, even if a piezoelectric/electrostrictive layer cracks. Provided is a piezoelectric/electrostrictive element 10 comprising a substrate 11, a lower electrode layer 12 secured onto the substrate 11, and a piezoelectric/electrostrictive layer 13 secured onto the lower electrode layer 12, and the coverage of the lower electrode layer 12 with respect to the substrate 11 is 98% or less.

    摘要翻译： 公开了即使压电/电致伸缩层裂纹也可以用作传感器的压电/电致伸缩元件。 提供一种压电/电致伸缩元件10，其包括基板11，固定在基板11上的下电极层12和固定在下电极层12上的压电/电致伸缩层13和下电极层12的覆盖范围 相对于基板11为98％以下。