公开(公告)号：US10032952B2

公开(公告)日：2018-07-24

申请号：US12615244

申请日：2009-11-09

申请人： Naoki Fukushima ,  Isao Tsukagoshi ,  Takehiro Shimizu

发明人： Naoki Fukushima ,  Isao Tsukagoshi ,  Takehiro Shimizu

IPC分类号： H01L31/05 ,  H01L31/0236 ,  H01L31/18 ,  C09J5/06 ,  C09J9/02 ,  C09J7/35 ,  C09J7/22

CPC分类号： H01L31/186 ,  C09J5/06 ,  C09J7/22 ,  C09J7/35 ,  C09J9/02 ,  C09J2201/128 ,  C09J2201/602 ,  C09J2203/322 ,  C09J2400/163 ,  H01L31/0512 ,  Y02E10/50 ,  Y10T29/49194

摘要： The electric conductor connection method of the invention is a method for electrical connection between a mutually separated first electric conductor and second electric conductor, comprising a step of hot pressing a metal foil, a first adhesive layer formed on one side of the metal foil and a first electric conductor, arranged in that order, to electrically connect and bond the metal foil and first electric conductor, and hot pressing the metal foil, the first adhesive layer or second adhesive layer formed on the other side of the metal foil, and the second electric conductor, arranged in that order, to electrically connect and bond the metal foil and the second electric conductor.

公开(公告)号：US20100294329A1

公开(公告)日：2010-11-25

申请号：US12680258

申请日：2008-09-25

申请人： Naoki Fukushima ,  Isao Tsukagoshi

发明人： Naoki Fukushima ,  Isao Tsukagoshi

IPC分类号： H01L31/042 ,  H01B5/00 ,  H01B13/00

CPC分类号： H01L31/0508 ,  H01L31/0512 ,  Y02E10/50

摘要： The member for conductor connection of the invention is a member for conductor connection having an adhesive layer 3 formed on at least one side of a metal foil 1, wherein the metal foil 1 comprises a plurality of projections 2 of substantially equal height integrated with the metal foil 1, on the side on which the adhesive layer 3 is formed, and the adhesive layer 3 is formed to a substantially uniform thickness along the projections 2.

摘要翻译： 本发明的导体连接用构件是用于导体连接的构件，其具有形成在金属箔1的至少一侧上的粘合剂层3，其中金属箔1包括与金属一体化的基本相等高度的多个突起2 箔1，在其上形成有粘合剂层3的一侧，并且粘合剂层3沿着突起2形成为基本均匀的厚度。

公开(公告)号：US06841022B2

公开(公告)日：2005-01-11

申请号：US10260342

申请日：2002-10-01

申请人： Isao Tsukagoshi ,  Kouji Kobayashi ,  Kazuya Matsuda ,  Naoki Fukushima ,  Jyunichi Koide

发明人： Isao Tsukagoshi ,  Kouji Kobayashi ,  Kazuya Matsuda ,  Naoki Fukushima ,  Jyunichi Koide

IPC分类号： H01L25/18 ,  H01L21/52 ,  H01L21/60 ,  H01L21/603 ,  H01L21/68 ,  H01L25/04 ,  H05K3/32 ,  B32B31/18 ,  B05D5/12 ,  B32B31/20 ,  H01L21/50 ,  H01L21/58

CPC分类号： H05K3/323 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/743 ,  H01L2224/7511 ,  H01L2224/83191 ,  H01L2224/83209 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0338 ,  Y10S428/914 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T156/1054 ,  Y10T156/1066 ,  Y10T156/108 ,  Y10T428/2486 ,  Y10T428/287 ,  H01L2924/00

摘要： An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a predetermined temperature. Electronic parts each have an electrode surface and at least one electrode on the electrode surface. The electrode surface of each of the electronic parts is affixed to the adhesive film layer such that the adhesive film layer coats all exposed portions of the electrode surface and coats all exposed surfaces of the at least one electrode.

摘要翻译： 一种装置包括具有隔离层和形成在隔离层上的粘合膜层的连接片，使得所述粘合剂膜层可以从隔离层剥离。 当粘合剂膜层被加热到预定温度时，粘合膜层的内聚强度降低。 电子部件各自具有电极表面和电极表面上的至少一个电极。 每个电子部件的电极表面固定到粘合膜层，使得粘合剂膜层涂覆电极表面的所有暴露部分并涂覆至少一个电极的所有暴露表面。

公开(公告)号：US20100288328A1

公开(公告)日：2010-11-18

申请号：US12680263

申请日：2008-09-25

申请人： Naoki Fukushima ,  Isao Tsukagoshi

发明人： Naoki Fukushima ,  Isao Tsukagoshi

IPC分类号： H01L31/042 ,  H01B5/00 ,  B32B37/24

CPC分类号： H01L31/022433 ,  C09J7/28 ,  C09J2201/32 ,  C09J2201/602 ,  C09J2203/322 ,  H01L31/0508 ,  H01L31/0512 ,  H01R4/04 ,  H01R12/62 ,  Y02E10/50 ,  Y10T156/1002

摘要： The conductor-connecting member of the invention is a conductor-connecting member comprising an adhesive layer 3 formed on at least one surface of a metal foil 1, wherein the metal foil 1 comprises a plurality of projections 2 of substantially equal height integrated with the metal foil 1, on the surface on which the adhesive layer 3 is formed, and the adhesive layer 3 fills in the projections 2 so that the surface formed on the side opposite the metal foil 1 is essentially smooth.

摘要翻译： 本发明的导体连接构件是导体连接构件，其包括形成在金属箔1的至少一个表面上的粘合剂层3，其中金属箔1包括与金属一体化的基本相等高度的多个突起2 箔1，在其上形成有粘合剂层3的表面上，并且粘合剂层3填充在突起2中，使得形成在与金属箔1相对的一侧上的表面基本上是平滑的。

公开(公告)号：US06479757B1

公开(公告)日：2002-11-12

申请号：US09685951

申请日：2000-10-12

申请人： Isao Tsukagoshi ,  Kouji Kobayashi ,  Kazuya Matsuda ,  Naoki Fukushima ,  Jyunichi Koide

发明人： Isao Tsukagoshi ,  Kouji Kobayashi ,  Kazuya Matsuda ,  Naoki Fukushima ,  Jyunichi Koide

IPC分类号： H05K102

CPC分类号： H05K3/323 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/743 ,  H01L2224/7511 ,  H01L2224/83191 ,  H01L2224/83209 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0338 ,  Y10S428/914 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T156/1054 ,  Y10T156/1066 ,  Y10T156/108 ,  Y10T428/2486 ,  Y10T428/287 ,  H01L2924/00

摘要： An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a predetermined temperature. Electronic parts each have an electrode surface and at least one electrode on the electrode surface. The electrode surface of each of the electronic parts is affixed to the adhesive film layer such that the adhesive film layer coats all exposed portions of the electrode surface and coats all exposed surfaces of the at least one electrode

摘要翻译： 一种装置包括具有隔离层和形成在隔离层上的粘合膜层的连接片，使得所述粘合剂膜层可以从隔离层剥离。 当粘合剂膜层被加热到预定温度时，粘合膜层的内聚强度降低。 电子部件各自具有电极表面和电极表面上的至少一个电极。 每个电子部件的电极表面固定到粘合剂膜层，使得粘合剂膜层涂覆电极表面的所有暴露部分并且涂覆至少一个电极的所有暴露表面

公开(公告)号：US6158115A

公开(公告)日：2000-12-12

申请号：US907017

申请日：1997-08-06

申请人： Isao Tsukagoshi ,  Kouji Kobayashi ,  Kazuya Matsuda ,  Naoki Fukushima ,  Jyunichi Koide

发明人： Isao Tsukagoshi ,  Kouji Kobayashi ,  Kazuya Matsuda ,  Naoki Fukushima ,  Jyunichi Koide

IPC分类号： H01L25/18 ,  H01L21/52 ,  H01L21/60 ,  H01L21/603 ,  H01L21/68 ,  H01L25/04 ,  H05K3/32 ,  H05K3/30

CPC分类号： H05K3/323 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/743 ,  H01L2224/7511 ,  H01L2224/83191 ,  H01L2224/83209 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0338 ,  Y10S428/914 ,  Y10T156/1054 ,  Y10T156/1066 ,  Y10T156/108 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T428/2486 ,  Y10T428/287

摘要： A method of mounting electronic parts on a circuit board comprises an adhesive layer formation step of forming, on an electrode surface of each electronic part on which electrodes are formed, a film-like thermosetting adhesive layer having an area substantially equal to that of the corresponding electrode surface so as to obtain adhesive-coated electronic parts. The electrodes on which the adhesive layer is formed are arranged so as to face corresponding electrodes of the circuit board, and the electrodes are positioned relative to each other. Heat and pressure are applied to the electrodes of the electronic parts and the electrodes of the circuit board to fix the electrodes to each other after the electrodes are positioned. Almost no adhesive superfluously comes out of the electrode surfaces. Accordingly, when mounting the electronic parts on the circuit board, it is unnecessary to remove superfluous adhesive, unlike conventional process, whereby the efficiency is improved and also the cost can be cut down.

摘要翻译： 一种将电子部件安装在电路板上的方法包括：粘附层形成步骤，在其上形成有电极的每个电子部件的电极表面上形成具有基本上等于相应的面积的膜状热固性粘合剂层 电极表面，以获得粘合剂涂覆的电子部件。 其上形成有粘合剂层的电极被布置成面对电路板的相应电极，并且电极相对于彼此定位。 在电极定位后，将电压和电压施加到电子部件的电极和电路板的电极上以将电极彼此固定。 几乎没有粘合剂从电极表面多余地出来。 因此，当将电子部件安装在电路板上时，与常规方法不同，不需要去除多余的粘合剂，从而提高效率并且还可以降低成本。

公开(公告)号：US20070273342A1

公开(公告)日：2007-11-29

申请号：US11753283

申请日：2007-05-24

申请人： Tadashi Kataoka ,  Shigeru Sakata ,  Takahide Ozawa ,  Isao Tsukagoshi ,  Zheng Dai

发明人： Tadashi Kataoka ,  Shigeru Sakata ,  Takahide Ozawa ,  Isao Tsukagoshi ,  Zheng Dai

IPC分类号： G05F1/10 ,  H02J3/12

CPC分类号： H02P9/006 ,  H02P2101/10

摘要： An electric power supply apparatus includes a distributed power generator such as a gas turbine generator and a power converter such as an inverter apparatus for converting electric power generated by the distributed power generator into AC electric power (alternating-current power) having a required frequency and a required voltage and supplying the AC electric power to a load. The electric power supply apparatus further includes a control unit having output voltage vs. output current characteristics for determining an output voltage corresponding to an output current of the power converter. The output voltage vs. output current characteristics has a first dropping characteristic for causing output electric power of the electric generator to be limited, between a first output current exceeding a power generation capability of the electric generator and a second output current exceeding a power converting capability of the power converter.

摘要翻译： 电力供给装置包括燃气轮机发电机等分布式发电机和用于将由分散发电机产生的电力转换为具有所需频率的交流电力（交流电力）的逆变器装置的功率转换器，以及 所需的电压并将AC电力提供给负载。 电力供给装置还包括具有用于确定与功率转换器的输出电流对应的输出电压的输出电压与输出电流特性的控制单元。 输出电压与输出电流特性之间具有第一下降特性，用于在超过发电机的发电能力的第一输出电流与超过功率转换能力的第二输出电流之间限制发电机的输出功率 的功率转换器。

公开(公告)号：US20070148985A1

公开(公告)日：2007-06-28

申请号：US11648561

申请日：2007-01-03

申请人： Nobutaka Mizutani ,  Fitrianto . ,  Isao Tsukagoshi ,  Keizo Hirose ,  Satohiko Hoshino

发明人： Nobutaka Mizutani ,  Fitrianto . ,  Isao Tsukagoshi ,  Keizo Hirose ,  Satohiko Hoshino

IPC分类号： C23F1/00 ,  B44C1/22 ,  H01L21/311

CPC分类号： H01L21/76808 ,  H01L21/67178

摘要： A porous low-k film, a sacrificial film that can be dissolved in a pure water, an antireflection film and a resist film are successively formed on a dielectric film on a wafer and subsequently exposing the resist film to light in a prescribed pattern and developing the resist film so as to form a prescribed circuit pattern in the resist film. Then, the wafer W is etched so as to form a via hole in the porous low-k film, followed by processing the wafer with a hydrogen peroxide solution so as to denature the resist film. Further, the sacrificial film is dissolved in a pure water so as to strip the resist film and the antireflection film from the water. As a result, a via hole excellent in the accuracy of the shape is formed without doing damage to the dielectric film.

公开(公告)号：US20060260744A1

公开(公告)日：2006-11-23

申请号：US11494709

申请日：2006-07-28

申请人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

发明人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： C09J5/00

CPC分类号： H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.

公开(公告)号：US5001542A

公开(公告)日：1991-03-19

申请号：US443169

申请日：1989-11-30

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC分类号： H01R4/04 ,  C09J163/00 ,  G06K19/077 ,  H01B1/00 ,  H01B1/20 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/482 ,  H01L23/498 ,  H05K3/32

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/82365 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321

摘要： A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.