公开(公告)号：US06772515B2

公开(公告)日：2004-08-10

申请号：US09960919

申请日：2001-09-25

申请人： Tokihito Suwa ,  Atsushi Tanaka ,  Satoshi Tanigawa ,  Hirofumi Fujii ,  Kazunori Mune

发明人： Tokihito Suwa ,  Atsushi Tanaka ,  Satoshi Tanigawa ,  Hirofumi Fujii ,  Kazunori Mune

IPC分类号： H05K302

CPC分类号： H05K3/4644 ,  H05K1/09 ,  H05K3/108 ,  H05K3/388 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0344 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09563 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： To provide a method of producing a multilayer printed wiring board that can be intended to have low-profile, light-weight and high-density wiring of a printed wiring board, and a multilayer printed wiring board produced by the method of producing a multilayer printed wiring board, the double-sided substrate is produced by the steps of forming an insulating resin layer on a metal foil; of forming a via hole in the insulating resin layer; of forming a first circuit pattern on the insulating resin layer and forming a conductive layer in the via hole, by plating; and of etching the metal foil to form it into a second circuit pattern. The produced double-sided substrate is used as a core substrate for producing multilayer printed wiring board by a laminate-en-bloc or a build-up method.

摘要翻译： 本发明提供一种制造多层印刷电路板的方法，所述多层印刷电路板可以用于印刷电路板的薄型，重量轻和高密度布线，以及通过制造多层印刷方法制造的多层印刷线路板 通过在金属箔上形成绝缘树脂层的步骤制造双面基板; 在所述绝缘树脂层中形成通孔; 在所述绝缘树脂层上形成第一电路图案，并在所述通孔中形成导电层，通过电镀; 并蚀刻金属箔以形成第二电路图案。 将生产的双面基板用作通过层叠体或堆积方法制造多层印刷线路板的核心基板。

公开(公告)号：US06904674B2

公开(公告)日：2005-06-14

申请号：US10119695

申请日：2002-04-11

申请人： Kazunori Mune ,  Hirofumi Fujii ,  Satoshi Tanigawa

发明人： Kazunori Mune ,  Hirofumi Fujii ,  Satoshi Tanigawa

IPC分类号： H05K1/11 ,  H01L21/48 ,  H01L23/12 ,  H05K3/20 ,  H05K3/24 ,  H05K3/40 ,  H05K3/42 ,  H01K3/10

CPC分类号： H01L21/486 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/205 ,  H05K3/423 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A printed wiring board, particularly, an interposer 20 for a chip scale package, comprising an outer insulator layer 22 having outer electrodes 31, a conductor layer 21, and an inner insulator layer 23 having inner electrodes 27, the electrodes 31 and/or 27 having been formed by electroplating using, as a negative electrode, a metal plate 32 that has been provided on the outer insulator layer 22 and removed after the electroplating. Having no plating leads, the printed wiring board has the electrodes in an orderly array at a fine pitch and a high density.

摘要翻译： 一种印刷电路板，特别是用于芯片级封装的插入件20，包括具有外部电极31，导体层21和具有内部电极27，电极31和/或27的内部绝缘体层23的外部绝缘体层22 通过使用已经设置在外绝缘体层22上并在电镀之后去除的金属板32作为负极来进行电镀而形成。 没有电镀引线，印刷线路板具有以细间距和高密度有序排列的电极。

公开(公告)号：US06379159B1

公开(公告)日：2002-04-30

申请号：US09541898

申请日：2000-04-03

申请人： Kazunori Mune ,  Kazuo Ouchi ,  Satoshi Tanigawa ,  Hirofumi Fujii

发明人： Kazunori Mune ,  Kazuo Ouchi ,  Satoshi Tanigawa ,  Hirofumi Fujii

IPC分类号： H05G336

CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/205 ,  H05K3/423 ,  H05K2201/09354 ,  H05K2201/10378 ,  H05K2203/0733 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655

摘要： In a method for manufacturing an interposer for CSP and its intermediate body, a first insulating layer is formed on a cathode substrate. An opening is formed at a position in the insulating layer where a contact is to be formed so that the surface of the substrate is exposed to the inner bottom of the opening. The opening is filled with metal by the electroplating using the cathode substrate as a cathode to form a conductive path. A circuit pattern which is contact with the conductive path is formed on the insulating layer. The cathode substrate is removed partially or entirely so that the end surface of the conductive path is exposed to form a contact. This permits a variation of the heights of a plurality of contacts to be reduced.

摘要翻译： 在制造CSP及其中间体用插入体的方法中，在阴极基板上形成第一绝缘层。 在要形成接触的绝缘层中的一个位置处形成开口，使得基板的表面暴露于开口的内底部。 通过使用阴极基板作为阴极的电镀，用金属填充开口以形成导电路径。 在绝缘层上形成与导电路径接触的电路图案。 部分或全部去除阴极基板，使得导电路径的端面暴露以形成接触。 这允许减少多个触点的高度的变化。

公开(公告)号：US06662442B1

公开(公告)日：2003-12-16

申请号：US09619502

申请日：2000-07-19

申请人： Kouji Matsui ,  Kazunori Mune ,  Hirofumi Fujii ,  Satoshi Tanigawa

发明人： Kouji Matsui ,  Kazunori Mune ,  Hirofumi Fujii ,  Satoshi Tanigawa

IPC分类号： H01K310

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68345 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/205 ,  H05K3/4007 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A process for producing a printed wiring board, particularly an interposer for a chip size package, which comprises the steps of (1) forming an outer insulator layer 22 having outer via-holes 24 on a substrate 32, (2) forming conducting passages 31 through the outer via-holes 24 by plating with metal up to substantially the same level as the upper surface of the outer insulator layer 22, (3) forming a thin metal film 29 on the outer insulator layer 22 and on the conducting passages 31, (4) forming a conductor layer 21 in a prescribed circuit pattern on the thin metal film 29 by plating, (5) removing the part of the thin metal film 29 on which the conductor layer 21 is not formed, (6) forming an inner insulator layer 23 on the conductor layer 21, and (7) removing the substrate 32. The outer insulator layer is formed with flatness to secure good adhesion to a semiconductor chip.

摘要翻译： 一种用于制造印刷线路板的方法，特别是用于芯片尺寸封装的插入件，其包括以下步骤：（1）在基板32上形成具有外部通孔24的外部绝缘体层22，（2）形成导电通路31 通过用外部绝缘体层22的上表面大致相同的金属镀覆外部通孔24，（3）在外绝缘体层22和导电路31上形成薄金属膜29， （4）通过电镀在薄金属膜29上形成规定的电路图案的导体层21，（5）除去未形成导体层21的金属薄膜29的一部分，（6）形成内部 导体层21上的绝缘体层23，以及（7）去除衬底32.外绝缘层形成为平坦度，以确保对半导体芯片的良好粘合性。

公开(公告)号：US07037637B2

公开(公告)日：2006-05-02

申请号：US10424772

申请日：2003-04-29

申请人： Kazunori Mune ,  Amane Mochizuki ,  Shunichi Hayashi ,  Hirofumi Fujii ,  Takahiro Fukuoka ,  Ryusuke Naitou

发明人： Kazunori Mune ,  Amane Mochizuki ,  Shunichi Hayashi ,  Hirofumi Fujii ,  Takahiro Fukuoka ,  Ryusuke Naitou

IPC分类号： G03F7/038 ,  G02B6/10

CPC分类号： G03F7/0387 ,  C08K5/06 ,  C08K5/3432 ,  C08L79/08 ,  G03F7/0005 ,  G03F7/001 ,  G03F7/0045 ,  C08L2666/22

摘要： A photosensitive polyimide resin precursor composition capable of providing a polyimide resin that is not substantially colored, is transparent and has heat resistance, an optical polyimide resin obtained from the composition, and an optical waveguide using the polyimide resin. The photosensitive polyimide resin precursor composition contains (a) 100 parts by weight of a polyamic acid obtained from a tetracarboxylic acid dianhydride and a diamine, (b) 0.01 parts by weight or more and less than 5 parts by weight of a 1,4-dihydropyridine derivative, (c) 5–50 parts by weight of a glycol (ether). The optical polyimide resin is obtained by irradiating the photosensitive resin precursor composition with UV light, followed by exposure, heating, development, and then heating. The optical waveguide comprises a core layer comprising the optical polyimide resin, and a cladding layer thereof.

摘要翻译： 能够提供基本不着色的聚酰亚胺树脂的光敏聚酰亚胺树脂前体组合物是透明的并且具有耐热性，由该组合物获得的光学聚酰亚胺树脂和使用该聚酰亚胺树脂的光波导。 感光性聚酰亚胺树脂前体组合物含有（a）100重量份由四羧酸二酐和二胺获得的聚酰胺酸，（b）0.01重量份以上且小于5重量份的1,4-二 二氢吡啶衍生物，（c）5-50重量份二醇（醚）。 通过用紫外光照射感光性树脂前体组合物，然后曝光，加热，显影，然后加热，得到光学聚酰亚胺树脂。 光波导包括包含光学聚酰亚胺树脂的芯层及其包覆层。

公开(公告)号：US08744220B2

公开(公告)日：2014-06-03

申请号：US12761612

申请日：2010-04-16

申请人： Sazzadur Rahman Khan ,  Kazunori Mune

发明人： Sazzadur Rahman Khan ,  Kazunori Mune

IPC分类号： G02B6/12 ,  G02B6/26 ,  G02B6/42 ,  G02B6/36

CPC分类号： G02B6/42 ,  G02B6/1221 ,  G02B6/4214 ,  G02B2006/12104

摘要： An optical waveguide device which is free from interference with an optical path between a light emitting element and an optical waveguide thereof, and to provide a method of manufacturing the optical waveguide device. A light emitting element (5) is provided on an upper surface of a first under-cladding layer (21), and a second under-cladding layer (22) is provided on the upper surface of the first under-cladding layer (21), covering the light emitting element (5). A core 3 which receives light emitted from the light emitting element (5) through the second under-cladding layer (22) is provided on an upper surface of the second under-cladding layer (22). The core (3) is located in a position such that the light emitted from the light emitting element (5) is incident on the core (3).

摘要翻译： 一种光波导器件，其不受干涉发光元件与其光波导之间的光路的影响，并提供制造光波导器件的方法。 在第一下包层21的上表面设置有发光元件（5），在第一下包层21的上表面设置第二下敷层22， ，覆盖发光元件（5）。 在第二下敷层（22）的上表面设置有通过第二下敷层（22）从发光元件（5）射出的光的芯体3。 芯（3）位于使得从发光元件（5）发射的光入射到芯（3）上的位置。

公开(公告)号：US08644662B2

公开(公告)日：2014-02-04

申请号：US13074690

申请日：2011-03-29

申请人： Kazunori Mune ,  Junichi Fujisawa ,  Yuichi Tsujita

发明人： Kazunori Mune ,  Junichi Fujisawa ,  Yuichi Tsujita

IPC分类号： G02B6/30 ,  G02B6/26 ,  G02B6/32 ,  G02B6/02 ,  G02B6/10 ,  B05D5/06

CPC分类号： G02B6/30

摘要： An optical connection structure which permits easy and automatic alignment between the optical axes of optical fibers and the optical axes of cores of an optical waveguide, and a production method which ensures that an optical waveguide for the optical connection structure can be efficiently produced with higher dimensional accuracy are provided. An over-cladding layer of the optical waveguide includes an extension portion provided in a longitudinal end portion thereof, and optical fiber fixing grooves are provided in the extension portion as extending along extension lines of cores coaxially with the cores and each having opposite ends, one of which is open in an end face of the extension portion and the other of which is closed. Optical fibers are fitted and fixed in the respective optical fiber fixing grooves. The over-cladding layer further includes a boundary portion (6) provided between the other closed ends of the optical fiber fixing grooves and the cores.

摘要翻译： 一种光学连接结构，其允许光纤的光轴和光波导的芯的光轴之间的容易且自动的对准，以及确保用于光学连接结构的光波导可以以更高的尺寸有效地产生的制造方法 提供准确性。 光波导的上包层包括设置在其纵向端部的延伸部分，并且光纤固定槽设置在延伸部分中，沿着与芯同轴的芯的延伸线延伸，并且每个具有相对端，一个 其在延伸部分的端面处是敞开的，另一个是封闭的。 光纤固定在相应的光纤固定槽中。 上包层还包括设置在光纤固定槽的其它封闭端和芯之间的边界部分（6）。

公开(公告)号：US20110286701A1

公开(公告)日：2011-11-24

申请号：US13074690

申请日：2011-03-29

申请人： Kazunori Mune ,  Junichi Fujisawa ,  Yuichi Tsujita

发明人： Kazunori Mune ,  Junichi Fujisawa ,  Yuichi Tsujita

IPC分类号： G02B6/38 ,  G02B6/02

CPC分类号： G02B6/30

摘要： An optical connection structure which permits easy and automatic alignment between the optical axes of optical fibers and the optical axes of cores of an optical waveguide, and a production method which ensures that an optical waveguide for the optical connection structure can be efficiently produced with higher dimensional accuracy are provided. An over-cladding layer of the optical waveguide includes an extension portion provided in a longitudinal end portion thereof, and optical fiber fixing grooves are provided in the extension portion as extending along extension lines of cores coaxially with the cores and each having opposite ends, one of which is open in an end face of the extension portion and the other of which is closed. Optical fibers are fitted and fixed in the respective optical fiber fixing grooves. The over-cladding layer further includes a boundary portion (6) provided between the other closed ends of the optical fiber fixing grooves and the cores.

摘要翻译： 一种光学连接结构，其允许光纤的光轴和光波导的芯的光轴之间的容易且自动的对准，以及确保用于光学连接结构的光波导可以以更高的尺寸有效地产生的制造方法 提供准确性。 光波导的上包层包括设置在其纵向端部的延伸部分，并且光纤固定槽设置在延伸部分中，沿着与芯同轴的芯的延长线延伸，并且每个具有相对端，一个 其在延伸部分的端面处是敞开的，另一个是封闭的。 光纤固定在相应的光纤固定槽中。 上包层还包括设置在光纤固定槽的其它封闭端和芯之间的边界部分（6）。

公开(公告)号：US07759503B2

公开(公告)日：2010-07-20

申请号：US11713682

申请日：2007-03-05

申请人： Takami Hikita ,  Yusuke Shimizu ,  Kazunori Mune

发明人： Takami Hikita ,  Yusuke Shimizu ,  Kazunori Mune

IPC分类号： C07D493/00

CPC分类号： C07D305/06 ,  G02B6/1221 ,  G02B6/138

摘要： The present invention relates to a trisoxetane compound represented by the following formula (1): wherein each of R1 and R3's represents a hydrogen atom or an alkyl group having 1 to 6 carbon atom(s); R2 represents a divalent aliphatic chained organic group having 0 to 16 carbon atom(s); and A represents a carbon atom or a trivalent organic group derived from a cycloalkane having 3 to 12 carbon atoms; a process for producing the same; and an optical waveguide including the same.

摘要翻译： 本发明涉及由下式（1）表示的三氧杂环丁烷化合物：其中R 1和R 3各自表示氢原子或具有1至6个碳原子的烷基; R2表示碳原子数为0〜16的二价脂肪族链状有机基团。 A表示碳原子或衍生自碳原子数3〜12的环烷烃的三价有机基团， 其制造方法; 以及包括该光波导的光波导。

公开(公告)号：US20050129377A1

公开(公告)日：2005-06-16

申请号：US11006674

申请日：2004-12-08

申请人： Ryusuke Naitou ,  Amane Mochizuki ,  Kazunori Mune ,  Kenichi Tagawa

发明人： Ryusuke Naitou ,  Amane Mochizuki ,  Kazunori Mune ,  Kenichi Tagawa

IPC分类号： G02B6/13 ,  C08G73/10 ,  C08L79/04 ,  C08L79/08 ,  G02B1/04 ,  G02B6/132 ,  G02B6/138 ,  G02B6/10

CPC分类号： G02B6/138 ,  C08L79/04 ,  C08L79/08 ,  C08L2205/02 ,  G02B1/046 ,  G02B1/048 ,  G02B6/132 ,  C08L2666/14

摘要： The invention provides a process for producing an optical waveguide, which comprises the steps of: forming a substrate adhesion layer on a surface of a substrate from a layer-forming material containing a coupling agent; forming an undercladding layer on the substrate adhesion layer; and forming a core layer having a predetermined pattern on the undercladding layer through a wet process with a developing solution.

摘要翻译： 本发明提供了一种制造光波导的方法，其包括以下步骤：从包含偶联剂的层形成材料在基板的表面上形成基板粘合层; 在所述基板粘合层上形成下包层; 并通过使用显影液的湿法在底层上形成具有预定图案的芯层。