公开(公告)号：US06662442B1

公开(公告)日：2003-12-16

申请号：US09619502

申请日：2000-07-19

申请人： Kouji Matsui ,  Kazunori Mune ,  Hirofumi Fujii ,  Satoshi Tanigawa

发明人： Kouji Matsui ,  Kazunori Mune ,  Hirofumi Fujii ,  Satoshi Tanigawa

IPC分类号： H01K310

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68345 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/205 ,  H05K3/4007 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A process for producing a printed wiring board, particularly an interposer for a chip size package, which comprises the steps of (1) forming an outer insulator layer 22 having outer via-holes 24 on a substrate 32, (2) forming conducting passages 31 through the outer via-holes 24 by plating with metal up to substantially the same level as the upper surface of the outer insulator layer 22, (3) forming a thin metal film 29 on the outer insulator layer 22 and on the conducting passages 31, (4) forming a conductor layer 21 in a prescribed circuit pattern on the thin metal film 29 by plating, (5) removing the part of the thin metal film 29 on which the conductor layer 21 is not formed, (6) forming an inner insulator layer 23 on the conductor layer 21, and (7) removing the substrate 32. The outer insulator layer is formed with flatness to secure good adhesion to a semiconductor chip.

摘要翻译： 一种用于制造印刷线路板的方法，特别是用于芯片尺寸封装的插入件，其包括以下步骤：（1）在基板32上形成具有外部通孔24的外部绝缘体层22，（2）形成导电通路31 通过用外部绝缘体层22的上表面大致相同的金属镀覆外部通孔24，（3）在外绝缘体层22和导电路31上形成薄金属膜29， （4）通过电镀在薄金属膜29上形成规定的电路图案的导体层21，（5）除去未形成导体层21的金属薄膜29的一部分，（6）形成内部 导体层21上的绝缘体层23，以及（7）去除衬底32.外绝缘层形成为平坦度，以确保对半导体芯片的良好粘合性。

公开(公告)号：US06772515B2

公开(公告)日：2004-08-10

申请号：US09960919

申请日：2001-09-25

申请人： Tokihito Suwa ,  Atsushi Tanaka ,  Satoshi Tanigawa ,  Hirofumi Fujii ,  Kazunori Mune

发明人： Tokihito Suwa ,  Atsushi Tanaka ,  Satoshi Tanigawa ,  Hirofumi Fujii ,  Kazunori Mune

IPC分类号： H05K302

CPC分类号： H05K3/4644 ,  H05K1/09 ,  H05K3/108 ,  H05K3/388 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0344 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09563 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： To provide a method of producing a multilayer printed wiring board that can be intended to have low-profile, light-weight and high-density wiring of a printed wiring board, and a multilayer printed wiring board produced by the method of producing a multilayer printed wiring board, the double-sided substrate is produced by the steps of forming an insulating resin layer on a metal foil; of forming a via hole in the insulating resin layer; of forming a first circuit pattern on the insulating resin layer and forming a conductive layer in the via hole, by plating; and of etching the metal foil to form it into a second circuit pattern. The produced double-sided substrate is used as a core substrate for producing multilayer printed wiring board by a laminate-en-bloc or a build-up method.

摘要翻译： 本发明提供一种制造多层印刷电路板的方法，所述多层印刷电路板可以用于印刷电路板的薄型，重量轻和高密度布线，以及通过制造多层印刷方法制造的多层印刷线路板 通过在金属箔上形成绝缘树脂层的步骤制造双面基板; 在所述绝缘树脂层中形成通孔; 在所述绝缘树脂层上形成第一电路图案，并在所述通孔中形成导电层，通过电镀; 并蚀刻金属箔以形成第二电路图案。 将生产的双面基板用作通过层叠体或堆积方法制造多层印刷线路板的核心基板。

公开(公告)号：US06904674B2

公开(公告)日：2005-06-14

申请号：US10119695

申请日：2002-04-11

申请人： Kazunori Mune ,  Hirofumi Fujii ,  Satoshi Tanigawa

发明人： Kazunori Mune ,  Hirofumi Fujii ,  Satoshi Tanigawa

IPC分类号： H05K1/11 ,  H01L21/48 ,  H01L23/12 ,  H05K3/20 ,  H05K3/24 ,  H05K3/40 ,  H05K3/42 ,  H01K3/10

CPC分类号： H01L21/486 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/205 ,  H05K3/423 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A printed wiring board, particularly, an interposer 20 for a chip scale package, comprising an outer insulator layer 22 having outer electrodes 31, a conductor layer 21, and an inner insulator layer 23 having inner electrodes 27, the electrodes 31 and/or 27 having been formed by electroplating using, as a negative electrode, a metal plate 32 that has been provided on the outer insulator layer 22 and removed after the electroplating. Having no plating leads, the printed wiring board has the electrodes in an orderly array at a fine pitch and a high density.

摘要翻译： 一种印刷电路板，特别是用于芯片级封装的插入件20，包括具有外部电极31，导体层21和具有内部电极27，电极31和/或27的内部绝缘体层23的外部绝缘体层22 通过使用已经设置在外绝缘体层22上并在电镀之后去除的金属板32作为负极来进行电镀而形成。 没有电镀引线，印刷线路板具有以细间距和高密度有序排列的电极。

公开(公告)号：US06379159B1

公开(公告)日：2002-04-30

申请号：US09541898

申请日：2000-04-03

申请人： Kazunori Mune ,  Kazuo Ouchi ,  Satoshi Tanigawa ,  Hirofumi Fujii

发明人： Kazunori Mune ,  Kazuo Ouchi ,  Satoshi Tanigawa ,  Hirofumi Fujii

IPC分类号： H05G336

CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/205 ,  H05K3/423 ,  H05K2201/09354 ,  H05K2201/10378 ,  H05K2203/0733 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655

摘要： In a method for manufacturing an interposer for CSP and its intermediate body, a first insulating layer is formed on a cathode substrate. An opening is formed at a position in the insulating layer where a contact is to be formed so that the surface of the substrate is exposed to the inner bottom of the opening. The opening is filled with metal by the electroplating using the cathode substrate as a cathode to form a conductive path. A circuit pattern which is contact with the conductive path is formed on the insulating layer. The cathode substrate is removed partially or entirely so that the end surface of the conductive path is exposed to form a contact. This permits a variation of the heights of a plurality of contacts to be reduced.

摘要翻译： 在制造CSP及其中间体用插入体的方法中，在阴极基板上形成第一绝缘层。 在要形成接触的绝缘层中的一个位置处形成开口，使得基板的表面暴露于开口的内底部。 通过使用阴极基板作为阴极的电镀，用金属填充开口以形成导电路径。 在绝缘层上形成与导电路径接触的电路图案。 部分或全部去除阴极基板，使得导电路径的端面暴露以形成接触。 这允许减少多个触点的高度的变化。

公开(公告)号：US20050208421A1

公开(公告)日：2005-09-22

申请号：US11081516

申请日：2005-03-17

申请人： Hirofumi Fujii ,  Yasuhito Funada ,  Satoshi Tanigawa

发明人： Hirofumi Fujii ,  Yasuhito Funada ,  Satoshi Tanigawa

IPC分类号： G03F7/031 ,  C08F2/44 ,  C08F283/04 ,  C08G73/10 ,  G03C1/492 ,  G03F7/004 ,  G03F7/027 ,  G03F7/037 ,  G03F7/20 ,  H01L21/027

CPC分类号： G03F7/031 ,  C08K5/3432 ,  C08L79/08 ,  G03F7/037 ,  C08L79/04

摘要： A photosensitive resin composition which, when exposed to light through a photomask and then developed, can form a pattern comprising a polyimide film having a thickness of 20 μm or larger with high resolution; and a use of the composition, in particular, a method of forming a pattern comprising the polyimide film. The photosensitive resin composition comprises (a) a poly(amic acid), (b) a specific 1,4-dihydropyridine derivative, and (c) a specific imide acrylate compound.

摘要翻译： 一种光敏树脂组合物，当通过光掩模曝光然后显影时，可以以高分辨率形成包含厚度为20μm或更大的聚酰亚胺膜的图案; 以及组合物的使用，特别是形成包含聚酰亚胺膜的图案的方法。 感光性树脂组合物包含（a）聚（酰胺酸），（b）特定的1,4-二氢吡啶衍生物和（c）特定的酰亚胺丙烯酸酯化合物。

公开(公告)号：US06591491B2

公开(公告)日：2003-07-15

申请号：US09799684

申请日：2001-03-07

申请人： Hirofumi Fujii ,  Satoshi Tanigawa

发明人： Hirofumi Fujii ,  Satoshi Tanigawa

IPC分类号： H05K336

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L23/3107 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/0023 ,  H05K3/007 ,  H05K3/108 ,  H05K3/20 ,  H05K3/388 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4658 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2203/0152 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/4981 ,  H01L2924/00

摘要： A producing method of a multilayer circuit board for ensuring that a circuit board, such as an interposer, is provided on the multilayer circuit board. The method includes the steps forming the interposer on a support board; forming a multilayer circuit board separately from the interposer; joining the interposer formed on the support board to the multilayer circuit board; and then removing the support board. According to this method, even if the production of the interposer fails after the production of the multilayer circuit board, it is possible to scrap the interposer only and there is no need to scrap it together with the multilayer circuit board. Besides, although the interposer is thin and limp, since it is formed on the support board, the interposer can surely and readily be joined to the multilayer circuit board.

摘要翻译： 一种多层电路板的制造方法，用于确保在多层电路板上设置诸如插入件的电路板。 该方法包括在支撑板上形成插入件的步骤; 与所述插入件分开形成多层电路板; 将形成在所述支撑板上的所述插入件接合到所述多层电路板; 然后卸下支撑板。 根据该方法，即使在制造多层电路板之后插入件的制造失败，也可以仅仅拆卸插入件，并且不需要与多层电路板一起将其废弃。 此外，虽然插入件薄且跛脚，但是由于其形成在支撑板上，所以插入器可以可靠地容易地接合到多层电路板。

公开(公告)号：US07008752B2

公开(公告)日：2006-03-07

申请号：US11081516

申请日：2005-03-17

申请人： Hirofumi Fujii ,  Yasuhito Funada ,  Satoshi Tanigawa

发明人： Hirofumi Fujii ,  Yasuhito Funada ,  Satoshi Tanigawa

IPC分类号： G03F7/004 ,  C08F2/46

CPC分类号： G03F7/031 ,  C08K5/3432 ,  C08L79/08 ,  G03F7/037 ,  C08L79/04

摘要： A photosensitive resin composition which, when exposed to light through a photomask and then developed, can form a pattern comprising a polyimide film having a thickness of 20 μm or larger with high resolution; and a use of the composition, in particular, a method of forming a pattern comprising the polyimide film. The photosensitive resin composition comprises (a) a poly(amic acid), (b) a specific 1,4-dihydropyridine derivative, and (c) a specific imide acrylate compound.

摘要翻译： 一种光敏树脂组合物，当通过光掩模曝光然后显影时，可以以高分辨率形成包含厚度为20μm或更大的聚酰亚胺膜的图案; 以及组合物的使用，特别是形成包含聚酰亚胺膜的图案的方法。 感光性树脂组合物包含（a）聚（酰胺酸），（b）特定的1,4-二氢吡啶衍生物和（c）特定的酰亚胺丙烯酸酯化合物。

公开(公告)号：US06300037B1

公开(公告)日：2001-10-09

申请号：US09437232

申请日：1999-11-10

申请人： Hirofumi Fujii ,  Satoshi Tanigawa

发明人： Hirofumi Fujii ,  Satoshi Tanigawa

IPC分类号： G03F7004

CPC分类号： C08G73/1025 ,  C08G73/1039 ,  C08G73/106 ,  C09J7/10 ,  C09J2479/08 ,  G03F7/0045 ,  G03F7/023

摘要： An adhesive in the form of a patterned film is disclosed, which is obtained from a photositive resin composition and exhibits satisfactory adhesive properties even when used for electronic parts of various shapes having a rugged surface. The adhesive is obtained from a photosensitive polyimide resin precursor which, after pattern formation, melts upon heating. The adhesive has a melt viscosity at 250 ° C. from 1,000 to 1,000,000 Pa·s.

摘要翻译： 公开了一种图案化膜形式的粘合剂，其由光树脂组合物获得并且即使用于具有粗糙表面的各种形状的电子部件也显示令人满意的粘合性能。 粘合剂由光敏聚酰亚胺树脂前体获得，其在图案形成之后在加热时熔融。 粘合剂在250℃下的熔融粘度为1,000至1,000,000Pa.s。

公开(公告)号：US20130014988A1

公开(公告)日：2013-01-17

申请号：US13521899

申请日：2011-04-26

申请人： Osamu Sato ,  Atsushi Murata ,  Makoto Kamiya ,  Satoshi Tanigawa ,  Shinichi Igarashi ,  Nobumasa Takihara ,  Yukihiro Shirafuji ,  Masamichi Yamagiwa ,  Yutaka Takata ,  Hiroto Ueno

发明人： Osamu Sato ,  Atsushi Murata ,  Makoto Kamiya ,  Satoshi Tanigawa ,  Shinichi Igarashi ,  Nobumasa Takihara ,  Yukihiro Shirafuji ,  Masamichi Yamagiwa ,  Yutaka Takata ,  Hiroto Ueno

IPC分类号： H02G3/04

CPC分类号： H02G3/0481 ,  D04H1/435 ,  D04H1/541

摘要： A wire harness has an exterior component (11a) that covers a certain part of at least one wires (12). The exterior component (11a) has parts having different hardness, including a relatively hard first part (111a), a relatively soft second part (112a), and a third part (113a) having an intermediate hardness between that of the first parts (111a, 112a). The first part is formed on a surface of the exterior component and functions as a shape keeping member and a protector. The second and third parts (112a, 113a) surround the certain part of the at least one wire 12 and each functions as a cushioning material and a muffler/soundproofing material. The first part (111a), the second part (112a), and the third part (113a) are formed integrally from a non-woven fabric (2) with thermo plasticity.

摘要翻译： 线束具有覆盖至少一根线（12）的某一部分的外部部件（11a）。 外部部件（11a）具有不同硬度的部件，包括比较硬的第一部分（111a），相对较软的第二部分（112a）和第三部分（113a），第三部分（113a）具有在第一部分 ，112a）。 第一部分形成在外部部件的表面上并用作形状保持部件和保护件。 第二和第三部分（112a，113a）围绕至少一根线12的某一部分，并且各自用作缓冲材料和消声器/隔音材料。 第一部分（111a），第二部分（112a）和第三部分（113a）由热塑性的无纺布（2）整体形成。

公开(公告)号：USD532386S1

公开(公告)日：2006-11-21

申请号：US29203145

申请日：2004-04-08

申请人： Yutaka Negishi ,  Mitsunari Fujii ,  Tatsuyoshi Asawa ,  Satoshi Tanigawa

设计人： Yutaka Negishi ,  Mitsunari Fujii ,  Tatsuyoshi Asawa ,  Satoshi Tanigawa