公开(公告)号：US20070093058A1

公开(公告)日：2007-04-26

申请号：US11551444

申请日：2006-10-20

申请人： Tomonari Ohtsuki ,  Yasue Yamazaki

发明人： Tomonari Ohtsuki ,  Yasue Yamazaki

IPC分类号： H01L21/44

CPC分类号： H05K3/243 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09845 ,  H05K2203/0577 ,  H05K2203/1476

摘要： A method for producing an electric contact extending from a copper foil, comprises steps of fixing a cover lay having a hole of a diameter smaller than that of the copper foil of a predetermined size to the copper foil, and plating the hole of the cover lay so as to reach the upper surface of the cover lay as a first step; installing a dry film having a hole of a diameter smaller than that of the hole of the cover lay onto the cover lay, and plating the hole of the dry film so as to reach the upper surface of the dry film as a second step; and after removal of the dry film, as a third step further plating the plate layers obtained in the first and second steps. The electric contacts produced by the method have a predetermined height which is as high as possible and uniform without causing any defective connection between them. In a method for producing an electrical connector, diameters of the holes of the dry film in plating are changed depending upon positions of the electric contacts.

摘要翻译： 一种从铜箔延伸的电触点的制造方法，其特征在于，包括以下步骤：将具有比规定尺寸的铜箔的直径小的孔的覆盖层固定在铜箔上， 作为第一步骤到达盖的上表面; 安装具有直径小于盖的孔直径的孔的干膜放置在覆盖层上，并且将干膜的孔电镀以到达干膜的上表面作为第二步骤; 并且在去除干膜之后，作为第三步骤，进一步镀覆在第一和第二步骤中获得的板层。 通过该方法制造的电触头具有尽可能高且均匀的预定高度，而不会造成它们之间的任何不良连接。 在电连接器的制造方法中，电镀中的干膜的孔的直径根据电接点的位置而变化。

公开(公告)号：US07503769B2

公开(公告)日：2009-03-17

申请号：US11762671

申请日：2007-06-13

申请人： Tomonari Ohtsuki ,  Yasue Yamazaki

发明人： Tomonari Ohtsuki ,  Yasue Yamazaki

IPC分类号： H01R12/00

CPC分类号： H01R12/62 ,  H01R12/52 ,  H01R43/007

摘要： A connector includes contact conductors each having two contact portions and a conductor connecting the two contact portions arranged on a flexible printed circuit board folded back so that the contact portions arranged its front and rear faces can be connected to contacts of connecting objects, pushing device provided on the circuit board, and an elastic member arranged between the contact portions on the front and rear faces. Another connector includes a flexible printed circuit board not being folded back, an elastic member held on the side of the circuit board opposite from the contact portions, and at least one pushing member for pushing the circuit board and the connecting objects. A pushing jig includes pushing portions provided on a base material to be pushed against connecting objects, an elastic member held on the base material opposite side of the pushing portions, and at least one pushing member for pushing the base material and the connecting objects. With these constructions, a reduced overall distance between the substrates is possible, and a narrower pitch and stable connection can be obtained.

摘要翻译： 连接器包括各自具有两个接触部分的接触导体和连接布置在折叠的柔性印刷电路板上的两个接触部分的导体，使得其前后面布置的接触部分可以连接到连接物体的触点，所提供的推动装置 以及布置在前表面和后表面之间的接触部之间的弹性构件。 另一连接器包括不被折回的柔性印刷电路板，保持在电路板与接触部分相对的一侧的弹性构件，以及用于推动电路板和连接对象的至少一个推动构件。 推动夹具包括：设置在基材上的推动部件，以被推靠在连接对象上;弹性构件，其保持在与推动部分相对侧的基材上;以及至少一个推动构件，用于推动基材和连接物体。 利用这些结构，可以减小基板之间的总距离，并且可以获得更窄的间距和稳定的连接。

公开(公告)号：US20050067472A1

公开(公告)日：2005-03-31

申请号：US10996152

申请日：2004-11-23

申请人： Tomonari Ohtsuki ,  Yasue Yamazaki

发明人： Tomonari Ohtsuki ,  Yasue Yamazaki

IPC分类号： B23K1/00 ,  B23K3/08 ,  H05K1/00 ,  H05K3/34 ,  H05K3/36 ,  B23K31/02

CPC分类号： B23K3/087 ,  B23K1/0016 ,  H05K1/0393 ,  H05K3/3447 ,  H05K3/3484 ,  H05K3/368 ,  H05K2201/0949 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2203/0165

摘要： A method for connecting connection members to through-holes of a board by soldering is disclosed. The board is press holded on its one side by a jig, and paste solder or solder in paste form is forced to flow into each of the through-holes of the board from the opposite side by a paste solder printing method using a printing mask. The printing mask is then removed under the condition of the paste solder being filled in the through-holes. After the connection members have been inserted in the through-holes of the board or have been urged against the board on the opposite side, the connection members are further connected to the board by reflow soldering, while the board is still continuously restrained or press holded on the one side by the jig. In this manner, it become possible to form any desired shapes of a plurality of solder connection portions connected to the board on the one side. As a result, the solder connection portions can be formed to be a predetermined height to prevent them from interfering deformation of contacts to provide a constant contact pressure of the contacts, thereby eliminating defective or failed connection.

摘要翻译： 公开了一种通过焊接将连接构件连接到电路板的通孔的方法。 板通过夹具被压在其一侧，并且通过使用印刷掩模的糊焊料印刷方法，从相对侧迫使浆料形式的焊料或焊料粘贴到板的每个通孔中。 然后在糊状焊料填充在通孔中的状态下去除印刷掩模。 在连接构件已经插入板的通孔中或者已经相对侧的板上被推压之后，连接构件通过回流焊接进一步连接到板，同时板仍被连续地限制或按压 在一边用夹具。 以这种方式，可以形成在一侧连接到板的多个焊接连接部分的任何期望的形状。 结果，可以将焊料连接部分形成为预定的高度，以防止它们阻碍触点的变形，从而提供触头的恒定的接触压力，从而消除连接不良或失败。

公开(公告)号：US07384270B2

公开(公告)日：2008-06-10

申请号：US09975114

申请日：2001-10-11

申请人： Tomonari Ohtsuki ,  Yasue Yamazaki

发明人： Tomonari Ohtsuki ,  Yasue Yamazaki

IPC分类号： H01R12/00

CPC分类号： H05K3/4007 ,  H01R4/02 ,  H05K3/326 ,  H05K2201/0373 ,  H05K2201/09909

摘要： An electrical connector for connecting oppositely arranged first and second mating electrical devices includes a support member, a first circuit having a plurality of electric contact elements arranged on one surface of the support member to contact electric contacts of the first mating electrical device, a second circuit having a plurality of electric contact elements arranged on the other surface of the support member to contact electric contacts of the second mating electrical device, and conductors connecting the first and second circuits. The electric contact elements of the first and second circuits are formed in the most suitable manner to meet the shapes of the mating electric contacts, respectively. The support member is formed through its thickness with slits closely around the electric contact elements, respectively. As a result, when the electric contacts of the first mating electrical device urge the electric contact elements arranged on the support member to deform the support member, the electric contacts slide on the electric contact elements, thereby removing solders adhered on the electric contact elements. The slits are arranged at random to be directed substantially in different directions so that horizontal forces caused by the urging forces of the electric contacts of the first mating electrical device are canceled out each other, thereby maintaining the axial alignment of the first mating electrical device with the electrical connector.

摘要翻译： 用于连接相对布置的第一和第二匹配电气装置的电连接器包括支撑构件，第一电路具有布置在支撑构件的一个表面上的多个电接触元件，以接触第一配合电气装置的电触点，第二电路 具有布置在所述支撑构件的另一表面上的多个电接触元件以接触所述第二配合电气设备的电触点，以及连接所述第一和第二电路的导体。 第一和第二电路的电接触元件分别以适合的方式形成以满足配合电触头的形状。 支撑构件通过其厚度分别形成有紧密地围绕电接触元件的狭缝。 结果，当第一配合电气装置的电触点促使布置在支撑构件上的电接触元件使支撑构件变形时，电触点在电接触元件上滑动，从而去除附着在电接触元件上的焊料。 狭缝被布置成随机地被引导以基本上在不同的方向上被引导，使得由第一配合电气装置的电接触件的作用力引起的水平力彼此抵消，从而保持第一配合电气装置的轴向对准 电连接器。

公开(公告)号：US20070068700A1

公开(公告)日：2007-03-29

申请号：US11527852

申请日：2006-09-26

申请人： Tomonari Ohtsuki ,  Yasue Yamazaki ,  Hirofumi Daimon ,  Kozo Matsuo ,  Sachi Takami

发明人： Tomonari Ohtsuki ,  Yasue Yamazaki ,  Hirofumi Daimon ,  Kozo Matsuo ,  Sachi Takami

IPC分类号： H05K1/11 ,  B23K26/16 ,  H01K3/10 ,  H05K1/00 ,  C25D5/02

CPC分类号： C25D5/022 ,  B23K26/0661 ,  C25D5/10 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05552 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/061 ,  H05K3/321 ,  H05K3/326 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2203/0554 ,  H05K2203/0557 ,  H05K2203/0789 ,  H05K2203/0793 ,  Y10T29/49165 ,  Y10T29/49224 ,  H01L2924/00012

摘要： A board consisting of a polyimide layer and copper foils is worked from one direction by etching to form through-holes, and the copper foils and inside of the through-holes are plated with copper, or the board is worked by etching or laser machining to form blind holes to expose the copper foils on the other side and through-holes simultaneously, and copper foils and insides of the blind holes and the through-holes are plated with copper. A metal ball plated with a noble metal is fixed on the copper foil by solidification of a metal paste to form an electric contact. Two superimposed plastic sheets are formed with holes each having a projection on inner wall of the hole, thereby vertically holding conductors by the projections of the holes of the superimposed plastic sheets. A laser beam machining method fabricates grooves or slits in a workpiece.

摘要翻译： 由聚酰亚胺层和铜箔构成的板通过蚀刻从一个方向加工形成通孔，铜箔和通孔内部镀有铜，或者通过蚀刻或激光加工对板进行加工 形成盲孔以同时露出另一侧的铜箔和通孔，盲孔和铜箔的铜箔和通孔用铜电镀。 镀有贵金属的金属球通过金属糊固化形成电接触而固定在铜箔上。 两个叠加的塑料片形成有孔，每个孔在孔的内壁上具有突起，由此通过叠加的塑料片的孔的突起垂直地保持导体。 激光束加工方法在工件中制造槽或狭缝。

公开(公告)号：US06322373B1

公开(公告)日：2001-11-27

申请号：US09630916

申请日：2000-08-02

申请人： Tomonari Ohtsuki ,  Yasue Yamazaki

发明人： Tomonari Ohtsuki ,  Yasue Yamazaki

IPC分类号： H01R1200

CPC分类号： H01R12/79 ,  H01R12/88 ,  H05K3/326

摘要： A contact structure of an electrical connector including a first connector having a plurality of electric contacts and a second connector having a plurality of electric contact elements elastically and independently supported by forming slits close about the electric contact elements. When the first connector is first urged against the second connector, the electric contact elements are inclined at an angle &agr; by the electric contacts. When the urging force of the first connector is then reduced, the electric contact elements are returned through an angle &bgr; which is less than the angle &agr; to accomplish the electrical connection between the electric contacts and the electric contact elements. An inspecting device for such an electrical connector includes a housing having a fitting opening for the first connector, a cover pivotally connected to the housing and having an anchoring portion engageable with an engaging portion of the housing, and a block for mounting the second connector thereon. The engagement of the anchoring portion and the engaging portion with a clearance corresponds to the inclination of the electric contacts elements of the second connector at the angle &agr;, and the engagement without the clearance corresponds to the inclination of the electric contact elements which has been returned through the angle &bgr; from the inclination at the angle &agr;.

摘要翻译： 一种电连接器的接触结构，包括具有多个电触头的第一连接器和具有多个电接触元件的第二连接器，所述第二连接器通过在电接触元件附近形成狭缝而弹性且独立地支撑。 当第一连接器首先被推靠在第二连接器上时，电接触元件由电触点倾斜成α角。 当第一连接器的推动力减小时，电接触元件通过小于角度α的角度β返回，以实现电触点和电接触元件之间的电连接。 用于这种电连接器的检查装置包括具有用于第一连接器的装配开口的壳体，可枢转地连接到壳体并具有可与壳体的接合部分接合的锚定部分的盖以及用于将第二连接器安装在其上的块 。 锚定部分和接合部分与间隙的接合对应于角度α处的第二连接器的电接触元件的倾斜度，并且没有间隙的接合对应于已经返回的电接触元件的倾斜度 通过角度β从倾斜角度α。

公开(公告)号：US20100096168A1

公开(公告)日：2010-04-22

申请号：US12626293

申请日：2009-11-25

申请人： Tomonari Ohtsuki ,  Yasue Yamazaki ,  Hirofumi Daimon ,  Kozo Matsuo ,  Sachi Takami

发明人： Tomonari Ohtsuki ,  Yasue Yamazaki ,  Hirofumi Daimon ,  Kozo Matsuo ,  Sachi Takami

IPC分类号： H05K1/00

CPC分类号： C25D5/022 ,  B23K26/0661 ,  C25D5/10 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05552 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/061 ,  H05K3/321 ,  H05K3/326 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2203/0554 ,  H05K2203/0557 ,  H05K2203/0789 ,  H05K2203/0793 ,  Y10T29/49165 ,  Y10T29/49224 ,  H01L2924/00012

摘要： A board consisting of a polyimide layer and copper foils is worked from one direction by etching to form through-holes, and the copper foils and inside of the through-holes are plated with copper, or the board is worked by etching or laser machining to form blind holes to expose the copper foils on the other side and through-holes simultaneously, and copper foils and insides of the blind holes and the through-holes are plated with copper. A metal ball plated with a noble metal is fixed on the copper foil by solidification of a metal paste to form an electric contact. Two superimposed plastic sheets are formed with holes each having a projection on inner wall of the hole, thereby vertically holding conductors by the projections of the holes of the superimposed plastic sheets. A laser beam machining method fabricates grooves or slits in a workpiece.

摘要翻译： 由聚酰亚胺层和铜箔构成的板通过蚀刻从一个方向加工形成通孔，铜箔和通孔内部镀有铜，或者通过蚀刻或激光加工对板进行加工 形成盲孔以同时露出另一侧的铜箔和通孔，盲孔和铜箔的铜箔和通孔用铜电镀。 镀有贵金属的金属球通过金属糊固化形成电接触而固定在铜箔上。 两个叠加的塑料片形成有孔，每个孔在孔的内壁上具有突起，由此通过叠加的塑料片的孔的突起垂直地保持导体。 激光束加工方法在工件中制造槽或狭缝。

公开(公告)号：US20060278684A1

公开(公告)日：2006-12-14

申请号：US11481375

申请日：2006-07-05

申请人： Tomonari Ohtsuki ,  Yasue Yamazaki

发明人： Tomonari Ohtsuki ,  Yasue Yamazaki

IPC分类号： B23K37/04

CPC分类号： B23K3/087

摘要： A jig to be in contact with solder in reflow soldering is coated with diamond-like-carbon on at least a portion which is to be in contact with the solder. In this manner the solder is prevented from adhering to the jig. The diamond-like-carbon coating is preferably provided on the whole surface of the jig facing to the molten solder. In a method for connecting connection members using a jig which can be in contact with solder in reflow soldering, the jig is coated with the diamond-like-carbon on its surface which is likely to contact the solder.

摘要翻译： 在回流焊接中与焊料接触的夹具在与焊料接触的至少一部分上涂覆有类金刚石碳。 以这种方式，防止焊料粘附到夹具上。 金刚石碳涂层优选设置在面向熔融焊料的夹具的整个表面上。 在通过回流焊接可以与焊料接触的夹具连接连接构件的方法中，夹具在其可能与焊料接触的表面上涂覆有类金刚石碳。

公开(公告)号：US06857880B2

公开(公告)日：2005-02-22

申请号：US10277539

申请日：2002-10-22

申请人： Tomonari Ohtsuki ,  Yasue Yamazaki

发明人： Tomonari Ohtsuki ,  Yasue Yamazaki

IPC分类号： H01R13/24 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H01R12/00 ,  H05K1/00

CPC分类号： H01R13/2414 ,  H01R12/52 ,  H05K3/326 ,  H05K3/3447 ,  H05K3/365

摘要： An electrical connector includes an elastomer layer or board and a plurality of fine lead wires embedded in the elastomer layer and extending rectilinearly therein at right angles to both the surfaces of the elastomer layer. Recesses are formed in the elastomer layer around peripheries of openings of through-holes in which the fine lead wires are embedded. The electrical connector further includes two flexible printed circuit boards on both the sides, each including electric contacts to be connected to mating contacts, connection portions each formed with a through-hole passing therethrough, and conductors each electrically connecting the connection portion to the electric contact. When the flexible printed circuit boards and the fine lead wires are electrically connected by vapor reflow soldering, the flexible printed circuit boards and the elastomer layer having the fine lead wires embedded therein are clamped by restraining jigs to prevent from the flexible printed circuit boards from moving away from the elastomer layer. With this arrangement, reliable connection between the fine lead wires and the flexible printed circuit boards can be achieved without need to control the length of the fine lead wires without any risk of the flexible boards being deflected or warped during soldering even if circumferences of portions to be electrically connected are covered by the insulator.

摘要翻译： 电连接器包括弹性体层或板和嵌入弹性体层中并与其弹性体层的两个表面成直角直线延伸的多个细导线。 围绕嵌入有细导线的通孔的开口周围的弹性体层形成凹部。 电连接器还包括两侧的两个柔性印刷电路板，每个包括要连接到配合触点的电触点，每个形成有穿过其中的通孔的连接部分以及将连接部分电连接到电触点 。 当柔性印刷电路板和细导线通过蒸汽回流焊接电连接时，具有嵌入其中的细导线的柔性印刷电路板和弹性体层被限制夹具夹紧以防止柔性印刷电路板移动 远离弹性体层。 利用这种布置，可以实现细导线和柔性印刷电路板之间的可靠连接，而不需要控制精细引线的长度，而不会在焊接期间柔性板被偏转或翘曲的风险，即使是部分到 电连接被绝缘体覆盖。

公开(公告)号：US06818987B2

公开(公告)日：2004-11-16

申请号：US10132557

申请日：2002-04-25

申请人： Tomonari Ohtsuki ,  Yasue Yamazaki

发明人： Tomonari Ohtsuki ,  Yasue Yamazaki

IPC分类号： H01L2348

CPC分类号： H01L23/49816 ,  H01L2924/0002 ,  H05K3/325 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/043 ,  Y02P70/613 ,  H01L2924/00

摘要： In an electronic component provided with an electric contact(s) producing an electric conduction by contacting with a contact(s) of a second electronic component, the electric contact comprises a lead-free alloy layer containing tin and silver, and a surface layer portion of the alloy layer at least contacting with the contact of the second electronic component is a tin-rich layer having a tin content higher than that of the other portion of the alloy layer.

摘要翻译： 在具有通过与第二电子部件的接触件接触而产生电导通的电接点的电子部件中，电接触包括含有锡和银的无铅合金层和表面层部分 与第二电子部件的接触部至少接触的合金层的锡含量比合金层的其他部分的锡含量高。