公开(公告)号：US20100080995A1

公开(公告)日：2010-04-01

申请号：US12631210

申请日：2009-12-04

申请人： Tomoyuki Ishimatsu ,  Daisuke Sato ,  Hiroki Ozeki

发明人： Tomoyuki Ishimatsu ,  Daisuke Sato ,  Hiroki Ozeki

IPC分类号： B32B37/14 ,  B32B37/12 ,  B32B37/06 ,  B32B37/10

CPC分类号： H05K3/323 ,  C08K7/00 ,  C09J9/02 ,  C09J11/00 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01R4/04 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/361 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0233 ,  Y10T156/10 ,  Y10T428/31504 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

摘要： A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.

摘要翻译： 一种连接电子部件的方法，其包括：将分散溶剂混合，溶解在分散溶剂中的粘合剂树脂，导电颗粒和具有比导电颗粒小的粒径的绝缘颗粒，以制备各向异性 导电胶; 将基板的端子和电子部件的端子通过各向异性导电粘合剂彼此面对，并且向基板和电子部件施加热和压力，以将导电颗粒夹在基板的端子之间 和电子部件的端子，使导电粒子的压力小于导电性粒子破坏的压力的导电性粒子变形，并且比导电粒子的粒径变得等于 绝缘颗粒。

公开(公告)号：US20110120767A1

公开(公告)日：2011-05-26

申请号：US12674987

申请日：2008-05-20

申请人： Daisuke Sato ,  Hiroki Ozeki ,  Tomoyuki Ishimatsu

发明人： Daisuke Sato ,  Hiroki Ozeki ,  Tomoyuki Ishimatsu

IPC分类号： H01B1/12 ,  H01R4/04 ,  H05K13/00

CPC分类号： H01R4/04 ,  C08G2650/56 ,  C08L47/00 ,  C08L63/00 ,  C08L71/00 ,  C08L2666/02 ,  C08L2666/22 ,  C09J163/00 ,  C09J171/00 ,  H01R12/62 ,  H01R13/03 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0212 ,  Y10T156/1089

摘要： An anisotropic conductive film that may give rise to high connection reliability, and a method for manufacturing a connection assembly with the use of the anisotropic conductive film, are disclosed. An anisotropic conductive film (2) is composes of an insulating adhesive resin containing polybutadiene particles, a cationic polymerizable resin and a cationic curing agent, and conductive particles dispersed in the insulating adhesive resin, with the lowest melt viscosity of the anisotropic conductive film being 300 to 1000 Pa·s. This anisotropic conductive film is placed in contact with terminal electrodes of a glass substrate (1). A flexible printed circuit board (3) is placed on top of the anisotropic conductive film so that terminal electrodes of the flexible printed circuit board (3) are in contact with the anisotropic conductive film (2). A heating tool is thrust onto the flexible printed circuit board side for electrically interconnecting the terminal electrodes.

摘要翻译： 公开了可以产生高连接可靠性的各向异性导电膜，以及使用各向异性导电膜制造连接组件的方法。 各向异性导电膜（2）由包含聚丁二烯颗粒，阳离子可聚合树脂和阳离子固化剂的绝缘粘合剂树脂和分散在绝缘粘合树脂中的导电颗粒组成，各向异性导电膜的熔体粘度最低为300 至1000Pa·s。 该各向异性导电膜与玻璃基板（1）的端子电极接触。 将柔性印刷电路板（3）放置在各向异性导电膜的顶部，使得柔性印刷电路板（3）的端子电极与各向异性导电膜（2）接触。 将加热工具推到柔性印刷电路板一侧上以电连接端子电极。

公开(公告)号：US08273207B2

公开(公告)日：2012-09-25

申请号：US12631210

申请日：2009-12-04

申请人： Tomoyuki Ishimatsu ,  Daisuke Sato ,  Hiroki Ozeki

发明人： Tomoyuki Ishimatsu ,  Daisuke Sato ,  Hiroki Ozeki

IPC分类号： B29C65/00 ,  B31B1/60 ,  B32B37/00 ,  B32B7/12 ,  B32B9/04 ,  A61F13/15 ,  B41J2/16

CPC分类号： H05K3/323 ,  C08K7/00 ,  C09J9/02 ,  C09J11/00 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01R4/04 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/361 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0233 ,  Y10T156/10 ,  Y10T428/31504 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

摘要： A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.

摘要翻译： 一种连接电子部件的方法，其包括：将分散溶剂混合，溶解在分散溶剂中的粘合剂树脂，导电颗粒和具有比导电颗粒小的粒径的绝缘颗粒，以制备各向异性 导电胶; 将基板的端子和电子部件的端子通过各向异性导电粘合剂彼此面对，并且向基板和电子部件施加热和压力，以将导电颗粒夹在基板的端子之间 和电子部件的端子，使导电粒子的压力小于导电性粒子破坏的压力的导电性粒子变形，并且比导电粒子的粒径变得等于 绝缘颗粒。

公开(公告)号：US09253911B2

公开(公告)日：2016-02-02

申请号：US13702485

申请日：2011-11-30

申请人： Reiji Tsukao ,  Tomoyuki Ishimatsu ,  Hiroki Ozeki

发明人： Reiji Tsukao ,  Tomoyuki Ishimatsu ,  Hiroki Ozeki

IPC分类号： H05K7/04 ,  H01R43/00 ,  H01B1/10 ,  H01B1/08 ,  H01B1/20 ,  H01L23/00 ,  H01R4/04 ,  H05K3/32

CPC分类号： H05K7/04 ,  H01B1/08 ,  H01B1/10 ,  H01B1/20 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H01R4/04 ,  H01R43/00 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides an anisotropic conductive material in which lower continuity resistance and higher adhesive strength are obtained, and a method for manufacturing the same. When a glass substrate and a metal wiring material are thermally compressed and bonded, in an interface between the glass substrate and an anisotropic conductive material, Si on a surface of the glass substrate reacts on an alkoxyl group (OR) at an end of disulfide silane modified by hydrophobic silica, and chemically binds thereto. Furthermore, at an interface between the metal wiring material and the anisotropic conductive material, a part of S—S bonds (disulfide bonds) in disulfide silane dissociates due to the heat at the time of thermocompression bonding, and the dissociated sulfide silane chemically binds to metal Me.

摘要翻译： 本发明提供了一种各向异性导电材料及其制造方法，其中连续性较低，粘合强度较高。 当玻璃基板和金属布线材料被热压和粘合时，在玻璃基板和各向异性导电材料之间的界面中，玻璃基板的表面上的Si与二硫化硅烷末端的烷氧基（OR）反应 通过疏水性二氧化硅改性，并与其化学结合。 此外，在金属配线材料和各向异性导电材料之间的界面处，二硫化硅烷中的一部分S-S键（二硫键）由于热压接合时的热量而解离，并且解离的硫化硅化合物与 金属我。

公开(公告)号：US20130135838A1

公开(公告)日：2013-05-30

申请号：US13702485

申请日：2011-11-30

申请人： Reiji Tsukao ,  Tomoyuki Ishimatsu ,  Hiroki Ozeki

发明人： Reiji Tsukao ,  Tomoyuki Ishimatsu ,  Hiroki Ozeki

IPC分类号： H05K7/04 ,  H01R43/00

CPC分类号： H05K7/04 ,  H01B1/08 ,  H01B1/10 ,  H01B1/20 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H01R4/04 ,  H01R43/00 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides an anisotropic conductive material in which lower continuity resistance and higher adhesive strength are obtained, and a method for manufacturing the same. When a glass substrate and a metal wiring material are thermally compressed and bonded, in an interface between the glass substrate and an anisotropic conductive material, Si on a surface of the glass substrate reacts on an alkoxyl group (OR) at an end of disulfide silane modified by hydrophobic silica, and chemically binds thereto. Furthermore, at an interface between the metal wiring material and the anisotropic conductive material, a part of S—S bonds (disulfide bonds) in disulfide silane dissociates due to the heat at the time of thermocompression bonding, and the dissociated sulfide silane chemically binds to metal Me.

摘要翻译： 本发明提供了一种各向异性导电材料及其制造方法，其中连续性较低，粘合强度较高。 当玻璃基板和金属布线材料被热压和粘合时，在玻璃基板和各向异性导电材料之间的界面中，玻璃基板的表面上的Si与二硫化硅烷末端的烷氧基（OR）反应 通过疏水性二氧化硅改性，并与其化学结合。 此外，在金属配线材料和各向异性导电材料之间的界面处，二硫化硅烷中的一部分SS键（二硫键）由于热压接合时的热量而解离，并且解离的硫化硅化合物与金属Me化学结合 。

公开(公告)号：US20120279781A1

公开(公告)日：2012-11-08

申请号：US13552858

申请日：2012-07-19

申请人： Hiroki Ozeki ,  Tomoyuki Ishimatsu ,  Reiji Tsukao

发明人： Hiroki Ozeki ,  Tomoyuki Ishimatsu ,  Reiji Tsukao

IPC分类号： H01B1/12 ,  H05K3/46 ,  H01B1/22 ,  H01R4/00 ,  H01B1/02 ,  H01B1/24

CPC分类号： H01B1/22 ,  H01R4/04 ,  H01R13/03

摘要： To provide a conductive particle, which contains a core particle, and a conductive layer formed on a surface of the core particle, where the core particle is formed of a resin, or a metal, or both thereof, and the conductive layer contains a phosphorus-containing hydrophobic group at a surface thereof.

摘要翻译： 为了提供含有芯颗粒的导电性粒子和在芯粒子的表面形成的导电层，其中核心粒子由树脂或金属形成，或者二者形成，并且导电层含有磷 在其表面具有疏水性基团。

公开(公告)号：US20130077266A1

公开(公告)日：2013-03-28

申请号：US13643891

申请日：2011-10-26

申请人： Reiji Tsukao ,  Tomoyuki Ishimatsu ,  Hiroki Ozeki

发明人： Reiji Tsukao ,  Tomoyuki Ishimatsu ,  Hiroki Ozeki

IPC分类号： H05K13/04 ,  B32B27/06 ,  B32B5/16 ,  H05K7/06

CPC分类号： H05K13/046 ,  B32B5/16 ,  B32B27/06 ,  B32B27/14 ,  B32B2457/00 ,  H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  H05K7/06 ,  Y10T29/4913 ,  Y10T428/31529

摘要： A connection method and a connection structure of electronic components by which high connection reliability can be obtained. An anisotropic conductive film is temporarily disposed, and thermally compressed and bonded, in such manner that a boundary of a circuit protection area and a terminal area of a second electronic component is positioned on a single layer area of the anisotropic conductive film; and the terminal area of the second electronic component is positioned on a double-layer area of the anisotropic conductive film.

摘要翻译： 可以获得高连接可靠性的电子部件的连接方法和连接结构。 以各向异性导电膜的单层区域的电路保护区域和第二电子部件的端子区域的边界的方式临时设置并热压缩和粘合各向异性导电膜; 并且第二电子部件的端子区域位于各向异性导电膜的双层区域上。

公开(公告)号：US08987607B2

公开(公告)日：2015-03-24

申请号：US13552858

申请日：2012-07-19

申请人： Hiroki Ozeki ,  Tomoyuki Ishimatsu ,  Reiji Tsukao

发明人： Hiroki Ozeki ,  Tomoyuki Ishimatsu ,  Reiji Tsukao

IPC分类号： B05D5/12 ,  H05K1/02 ,  H01B1/22 ,  H01R4/04 ,  H01R13/03

CPC分类号： H01B1/22 ,  H01R4/04 ,  H01R13/03

摘要： To provide a conductive particle, which contains a core particle, and a conductive layer formed on a surface of the core particle, where the core particle is formed of a resin, or a metal, or both thereof, and the conductive layer contains a phosphorus-containing hydrophobic group at a surface thereof.

摘要翻译： 为了提供含有芯颗粒的导电性粒子和在芯粒子的表面形成的导电层，其中核心粒子由树脂或金属形成，或者二者形成，并且导电层含有磷 在其表面具有疏水性基团。

公开(公告)号：US08796557B2

公开(公告)日：2014-08-05

申请号：US12645883

申请日：2009-12-23

申请人： Tomoyuki Ishimatsu ,  Hiroki Ozeki

发明人： Tomoyuki Ishimatsu ,  Hiroki Ozeki

IPC分类号： H05K1/02 ,  H05K1/00 ,  H05K1/03 ,  H05K1/09

CPC分类号： H01R4/04 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2203/326 ,  H01L24/29 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2203/1189 ,  Y10T428/28 ,  H01L2924/00

摘要： An adhesive film, containing a first adhesive layer in which conductive particles are dispersed, and a second adhesive layer adhered to the first adhesive layer, wherein the lowest viscosity of the first adhesive layer attained at or below the curing temperature is higher than that of the second adhesive layer attained at or below the curing temperature, where the curing temperature is a temperature at which the adhesive layer starts to cure, wherein the first and second adhesive layers are respectively disposed to a substrate side and an electronic part side, and the adhesive film is configured to join the electronic part and the substrate by heating and pressurizing the substrate and the electronic part with the adhesive layer being therebetween, and wherein the first adhesive layer has a thickness which is less than two times of an average particle diameter of the conductive particles.

摘要翻译： 一种粘合剂膜，其包含其中分散有导电颗粒的第一粘合剂层和粘附到第一粘合剂层的第二粘合剂层，其中在固化温度或低于固化温度下获得的第一粘合剂层的最低粘度高于 第二粘合剂层达到或低于固化温度，其中固化温度是粘合剂层开始固化的温度，其中第一和第二粘合剂层分别设置在基材侧和电子部件侧，并且粘合剂 膜被配置为通过对其中的粘合剂层进行加热和加压衬底和电子部件来接合电子部件和基板，并且其中第一粘合剂层的厚度小于平均粒径的两倍 导电颗粒。

公开(公告)号：US08395052B2

公开(公告)日：2013-03-12

申请号：US12975421

申请日：2010-12-22

申请人： Tomoyuki Ishimatsu ,  Hiroki Ozeki ,  Hiroshi Hamachi

发明人： Tomoyuki Ishimatsu ,  Hiroki Ozeki ,  Hiroshi Hamachi

IPC分类号： H05K1/09

CPC分类号： H05K3/323 ,  H05K2201/0212 ,  H05K2201/0218 ,  H05K2201/0221 ,  Y10T29/4913 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/2991 ,  Y10T428/31663

摘要： The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer.

摘要翻译： 本发明的目的在于提供能够降低应力同时保持高硬度的导电性粒子（即使在连接工序中被破碎的状态下也难以产生裂纹），并且能够确保不仅对于ITO基板的充分的导电性， 而且对于IZO基板，设置有导电颗粒的各向异性导电膜，设置有各向异性导电膜的接合结构以及使用各向异性导电膜的接合方法。 本发明的导电粒子包括聚合物细颗粒和形成在聚合物细颗粒的表面上的导电层，其中导电层的最外表面壳是镍 - 钯合金层。