公开(公告)号：US07370412B2

公开(公告)日：2008-05-13

申请号：US10611895

申请日：2003-07-03

申请人： Toshiro Hiraoka ,  Mitsuyoshi Endo ,  Naoko Yamaguchi ,  Yasuyuki Hotta ,  Shigeru Matake ,  Hideo Aoki ,  Misa Sawanobori

发明人： Toshiro Hiraoka ,  Mitsuyoshi Endo ,  Naoko Yamaguchi ,  Yasuyuki Hotta ,  Shigeru Matake ,  Hideo Aoki ,  Misa Sawanobori

IPC分类号： H01K3/10

CPC分类号： H01L24/24 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/82 ,  H01L24/96 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/2413 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/76155 ,  H01L2224/7665 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/185 ,  H05K3/185 ,  H05K3/422 ,  H05K2201/0116 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/4921 ,  H01L2924/00

摘要： An electronic device connecting method according to a first aspect of the present invention includes: mounting an electronic device having at least one electrode portion on a sheet-like porous member having a hole therein so that the electrode portion is close to the porous member; selectively irradiating a predetermined region of the porous member, on which the electronic device is mounted, with energy lines to form a latent image in an irradiated or non-irradiated portion of the porous member, the predetermined region including a portion close to the electrode portion; after irradiating with the energy lines, filling a conductive material in a hole of the latent image of the porous member to form a conductive portion; and bonding and integrating the porous member, in which the conductive portion is formed, to and with the electronic device.

摘要翻译： 根据本发明的第一方面的电子设备连接方法包括：将具有至少一个电极部分的电子设备安装在其中具有孔的片状多孔构件上，使得电极部分靠近多孔构件; 用能量线选择性地照射安装有电子装置的多孔构件的预定区域，以在多孔构件的照射或未照射部分中形成潜像，该预定区域包括靠近电极部分的部分 ; 在照射能量线之后，在多孔构件的潜像的孔中填充导电材料以形成导电部分; 并且将形成有导电部分的多孔构件与电子装置接合并整合。

公开(公告)号：US07312621B2

公开(公告)日：2007-12-25

申请号：US10401871

申请日：2003-03-31

申请人： Naoko Yamaguchi ,  Yoshiaki Sugizaki ,  Hideo Aoki ,  Toshiro Hiraoka ,  Yasuyuki Hotta ,  Shigeru Matake ,  Misa Sawanobori

发明人： Naoko Yamaguchi ,  Yoshiaki Sugizaki ,  Hideo Aoki ,  Toshiro Hiraoka ,  Yasuyuki Hotta ,  Shigeru Matake ,  Misa Sawanobori

IPC分类号： G01R31/02

CPC分类号： G01R31/2886 ,  G01R31/2863

摘要： A semiconductor test unit comprises a test circuit for inputting/outputting a test signal to/from an examined electronic product, a test signal wiring electrically connected to the test circuit, a contact board electrically connected to an electrode of the examined electronic product and provided with an electrically conductive via to which the test signal is transmitted, a multilayer circuit board electrically connected to the conductive via and the test signal wiring, located under the bottom face of the contact board, and provided with at least one through-hole, and a vacuum attachment mechanism for attaching thereto and holding the examined electronic product, the contact board, and the multilayer circuit board by vacuum. The contact board is made of an insulative material, has top and bottom faces, and is provided with at least one through-hole.

摘要翻译： 半导体测试单元包括用于向被检查的电子产品输入/输出测试信号的测试电路，电连接到测试电路的测试信号布线，与所检查的电子产品的电极电连接并提供 测试信号传输到的导电通孔，与导电通孔电连接的多层电路板和位于接触板底面下方的测试信号布线，并具有至少一个通孔，以及 用于附接到其上的真空附着机构，并通过真空保持所检查的电子产品，接触板和多层电路板。 接触板由绝缘材料制成，具有顶面和底面，并且设置有至少一个通孔。

公开(公告)号：US20050024067A1

公开(公告)日：2005-02-03

申请号：US10885777

申请日：2004-07-08

申请人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo ,  Toshiro Hiraoka ,  Yasuyuki Hotta ,  Shigeru Matake

发明人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo ,  Toshiro Hiraoka ,  Yasuyuki Hotta ,  Shigeru Matake

IPC分类号： G01R1/073 ,  G01R31/26

CPC分类号： G01R1/0735

摘要： According to one aspect of the invention, a contact sheet for testing electronic parts, comprising an insulating porous layer; and a connection electrode which is disposed on the insulating porous layer and electrically connect the electrode or terminal of the electronic parts and the terminal of a test apparatus; wherein the connection electrode is embedded below at least one main surface of the insulating porous layer.

摘要翻译： 根据本发明的一个方面，一种用于测试电子部件的接触片，包括绝缘多孔层; 以及连接电极，其设置在绝缘多孔层上并将电子部件的电极或端子与测试装置的端子电连接; 其中所述连接电极嵌入所述绝缘多孔层的至少一个主表面的下方。

公开(公告)号：US07414417B2

公开(公告)日：2008-08-19

申请号：US10885777

申请日：2004-07-08

申请人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo ,  Toshiro Hiraoka ,  Yasuyuki Hotta ,  Shigeru Matake

发明人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo ,  Toshiro Hiraoka ,  Yasuyuki Hotta ,  Shigeru Matake

IPC分类号： G01R31/02 ,  H01L21/66 ,  B23K31/02

CPC分类号： G01R1/0735

摘要： According to one aspect of the invention, a contact sheet for testing electronic parts, comprising an insulating porous layer; and a connection electrode which is disposed on the insulating porous layer and electrically connect the electrode or terminal of the electronic parts and the terminal of a test apparatus; wherein the connection electrode is embedded below at least one main surface of the insulating porous layer.

摘要翻译： 根据本发明的一个方面，一种用于测试电子部件的接触片，包括绝缘多孔层; 以及连接电极，其设置在绝缘多孔层上并将电子部件的电极或端子与测试装置的端子电连接; 其中所述连接电极嵌入所述绝缘多孔层的至少一个主表面的下方。

公开(公告)号：US06977130B2

公开(公告)日：2005-12-20

申请号：US10618631

申请日：2003-07-15

申请人： Hideo Aoki ,  Chiaki Takubo ,  Atsuko Iida ,  Yasuyuki Hotta ,  Naoko Yamaguchi

发明人： Hideo Aoki ,  Chiaki Takubo ,  Atsuko Iida ,  Yasuyuki Hotta ,  Naoko Yamaguchi

IPC分类号： H01L21/28 ,  G03G5/05 ,  G03G9/09 ,  G03G13/26 ,  H01L21/288 ,  H01L21/3205 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/46 ,  G03G13/16 ,  B05D1/04 ,  H05C1/00

CPC分类号： H05K3/4664 ,  G03G5/056 ,  G03G9/0926 ,  G03G13/26 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15787 ,  H05K3/1266 ,  H05K3/246 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2203/0425 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/0537 ,  H01L2924/00

摘要： A method of manufacturing an electronic circuit satisfying demands for cost reduction, diversified small-quantity production, and a shorter cycle of design, manufacture, evaluation, correction, and so on is provided. The method includes at least forming a first pattern or forming a second pattern. Forming the first pattern comprises: forming a visible image on an electrostatic latent image formed on a photosensitive base, by the adhesion of charged particles essentially made of a resin; transferring the visible image onto the intermediate transfer base by the contact and pressurization of the visible image; heating/softening on the intermediate transfer base; and transferring a heated/softened resin layer onto a base material by the contact and pressurization of the resin layer. In forming the second pattern, using charged particles containing conductive metal particulates, a conductor metal layer is formed by electroless plating after a metal-containing resin pattern is transferred similarly to the first pattern formation.

摘要翻译： 提供了一种制造满足成本降低，多样化的小批量生产和更短的设计，制造，评估和校正周期的电子电路的方法。 该方法包括至少形成第一图案或形成第二图案。 形成第一图案包括：通过基本上由树脂制成的带电粒子的粘附在形成在感光基底上的静电潜像上形成可见图像; 通过可见图像的接触和加压将可见图像转印到中间转印基底上; 在中间转移基体上加热/软化; 并通过树脂层的接触和加压将加热/软化的树脂层转移到基材上。 在形成第二图案时，使用含有导电金属微粒的带电粒子，在与第一图案形成类似地转移含金属的树脂图案之后，通过无电镀形成导体金属层。

公开(公告)号：US07877871B2

公开(公告)日：2011-02-01

申请号：US12230280

申请日：2008-08-27

申请人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

发明人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo ,  Toshiaki Yamauchi ,  Koji Imamiya ,  Hiroshi Hashizume

IPC分类号： H05K3/02 ,  G03G15/16

CPC分类号： H05K3/207 ,  G03G15/6591 ,  G03G2215/00523 ,  H05K1/095 ,  H05K3/1266 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2201/09781 ,  H05K2203/0517 ,  H05K2203/105 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： An image forming apparatus comprises an exposure unit forming an electrostatic latent image on a photo conductor based on image information, a developing unit developing the electrostatic latent image by toner made of formation material of a circuitry layer, and an electrostatic transferring unit transferring a toner image on the photo conductor onto a substrate. The toner image is transferred so as to cover at least a part of a conductor layer formed on the substrate. At this time, excessive charges caused in the conductor layer accompanying the start of the transfer of the toner image are removed. Alternatively, charges of which polarity is reverse to that of the toner are added to the conductor layer. These allow the circuitry layer to be formed to have a desired pattern favorably and securely on the conductor layer.

摘要翻译： 图像形成装置包括基于图像信息在光导体上形成静电潜像的曝光单元，通过电路层的形成材料制成的调色剂来显影静电潜像的显影单元和传送调色剂图像的静电转印单元 在光导体上的基片上。 转印调色剂图像以覆盖形成在基板上的导体层的至少一部分。 此时，伴随着调色剂图像的转印开始导致的导体层中引起的过多的电荷被去除。 或者，将与该调色剂相反极性的电荷加到导体层中。 这些允许电路层形成为在导体层上有利地并且牢固地具有期望的图案。

公开(公告)号：US20100000083A1

公开(公告)日：2010-01-07

申请号：US12541568

申请日：2009-08-14

申请人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo

发明人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo

IPC分类号： H05K3/10 ,  H05K3/20

CPC分类号： H05K3/246 ,  G03G15/6585 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/1266 ,  H05K3/4664 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2203/0517 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T428/12097 ,  Y10T428/12104 ,  Y10T428/12111 ,  Y10T428/24917 ,  H01L2924/00

摘要： According to one mode of the present invention, metal-containing resin particles comprising a resin containing a thermosetting resin at 50 wt % or more and having a rate of moisture absorption from 500 to 14500 ppm, and fine metal particles contained in the resin, is provided.

摘要翻译： 根据本发明的一种模式，含有含有50重量％以上的热固性树脂的树脂含水率为500〜14500ppm的含金属的树脂粒子和树脂中含有的微细金属粒子是 提供。

公开(公告)号：US07939171B2

公开(公告)日：2011-05-10

申请号：US11018473

申请日：2004-12-22

申请人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo

发明人： Hideo Aoki ,  Naoko Yamaguchi ,  Chiaki Takubo

IPC分类号： B32B5/66

CPC分类号： H05K3/207 ,  H05K1/095 ,  H05K3/1266 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2203/0517 ,  Y10T428/12535 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/256 ,  Y10T428/2991 ,  Y10T428/2998

摘要： Provided is metal-containing resin particle for forming a conductor pattern in which the metal particles are dispersed in a resin matrix, and the content of the metal particles is 70 wt % or less.

摘要翻译： 本发明提供用于形成金属颗粒分散在树脂基体中的金属的树脂颗粒，并且金属颗粒的含量为70重量％以下。

公开(公告)号：US07486921B2

公开(公告)日：2009-02-03

申请号：US11017922

申请日：2004-12-22

申请人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo

发明人： Naoko Yamaguchi ,  Hideo Aoki ,  Chiaki Takubo

IPC分类号： G03G15/20

CPC分类号： H05K3/207 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  H05K3/1266 ,  H05K3/246 ,  H05K3/4664 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0347 ,  H05K2203/0517

摘要： According to one mode of the present invention, a method of producing an electronic circuit, comprising forming an integrated resin layer having a prescribed thickness by repeating a resin layer forming process a number of times so that resin layers are layered to be integrated with all the resin layers on a substrate, wherein the resin forming process comprises charging the surface of a photoconductor; forming an electrostatic latent image having a prescribed pattern on the surface of the charged photoconductor; forming a visible image by electrostatically attaching charged particles composed of resin on the surface of the photoconductor on which the electrostatic latent image is formed; transferring the visible image formed on the surface of the photoconductor and composed of the charged particles onto the substrate; and fixing said visible image transferred onto said substrate on said substrate to form the resin layer on said substrate, is provided.

摘要翻译： 根据本发明的一个方式，一种电子电路的制造方法，其特征在于，通过重复树脂层形成工序多次来形成具有规定厚度的一体化树脂层，使树脂层层叠成与所有的 树脂层，其中所述树脂形成工艺包括对光电导体的表面进行充电; 在带电的感光体的表面上形成具有规定图案的静电潜像; 通过在其上形成有静电潜像的感光体的表面上静电附着由树脂构成的带电粒子来形成可见图像; 将形成在感光体的表面上的由带电粒子构成的可见图像转印到基板上; 并且将所述转印到所述基板上的所述可见图像固定在所述基板上，以在所述基板上形成树脂层。

公开(公告)号：US07350297B2

公开(公告)日：2008-04-01

申请号：US11356215

申请日：2006-02-17

申请人： Naoko Yamaguchi ,  Hideo Aoki

发明人： Naoko Yamaguchi ,  Hideo Aoki

IPC分类号： H01K3/10

CPC分类号： H05K3/422 ,  H05K3/1266 ,  H05K3/182 ,  H05K3/4084 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2203/0221 ,  H05K2203/0517 ,  H05K2203/0709 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167 ,  Y10T428/24917

摘要： A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first plating foundation layer, a through hole is formed while leaving a piece having the plating foundation layer in the portion where the punch is inserted. A second plating foundation layer is formed by printing on a rear face of the sheet-shaped insulating substrate. A first and second wiring layers composed of a metal plating layer are formed by performing electroless plating, and at the same time, a metal plating layer connecting between the first and second wiring layers is formed in the through hole using the plating foundation layer on the piece.

摘要翻译： 通过在片状绝缘基板的正面上印刷形成第一电镀基础层。 通过在具有第一电镀基础层的片状绝缘基板上插入冲头，在将冲压件插入部分留下具有电镀基础层的部件的同时形成通孔。 通过在片状绝缘基板的背面上印刷形成第二电镀基础层。 通过进行无电解电镀形成由金属镀层构成的第一和第二配线层，同时，在通孔中形成连接在第一和第二布线层之间的金属镀层，使用电镀基底层 片。