摘要:
A wireless communication device includes an RF module, an audio-processing module, a receiving/transmitting module and a housing. The RF module connected wireless with a notebook computer is used for receiving/transmitting an RF data signal and converting the RF data signal into a respective digital audio signal. The audio-processing module is used to perform bi-directional conversion between digital audio signals and analog audio signals. The receiving/transmitting module is used to input or output the analog audio signals. The housing is used to integrate structurally the RF module, the audio-processing module and the receiving/transmitting module so as to appear the wireless communication device a size as a typical computer memory cartridge that can be accommodated inside a memory extension slot of the notebook computer.
摘要:
According to an embodiment of the invention, a chip package is provided. The chip package includes a semiconductor substrate having an upper surface and an opposite lower surface, a through-hole penetrating the upper surface and the lower surface of the semiconductor substrate, a chip disposed overlying the upper surface of the semiconductor substrate, a conducting layer overlying a sidewall of the through-hole and electrically connecting the chip, a first insulating layer overlying the upper surface of the semiconductor substrate, a second insulating layer overlying the lower surface of the semiconductor substrate, and a bonding structure disposed overlying the lower surface of the semiconductor substrate, wherein a material of the second insulating layer is different from that of the first insulating layer.
摘要:
A semiconductor substrate includes a substrate, at least a semiconductor layer, a first anti-reflection layer, and a second anti-reflection layer. The semiconductor layer is disposed on the substrate. The first anti-reflection layer is disposed on the semiconductor layer. The second anti-reflection layer is disposed on the first anti-reflection layer. The second anti-reflection layer is a discontinuous layer with the capability of photon conversion.
摘要:
An electrical fuse and a process of programming the same are presented. An electrical fuse comprises a lower level silicide layer on a non-doped or lightly-doped polysilicon layer, an upper level conductive layer, and a tungsten contact coupled between the lower level silicide layer and the upper level conductive layer. The tungsten contact and a neck portion of the silicide layer are the programmable portion of the electrical fuse. High post-programming resistance is achieved by a first programming phase that depletes silicide in the silicide layer, followed by a second programming phase that depletes tungsten in the tungsten contact.
摘要:
An electrical fuse and a process of programming the same are presented. An electrical fuse comprises a lower level silicide layer on a non-doped or lightly-doped polysilicon layer, an upper level conductive layer, and a tungsten contact coupled between the lower level silicide layer and the upper level conductive layer. The tungsten contact and a neck portion of the silicide layer are the programmable portion of the electrical fuse. High post-programming resistance is achieved by a first programming phase that depletes silicide in the silicide layer, followed by a second programming phase that depletes tungsten in the tungsten contact.
摘要:
A magnetic random access memory (MRAM) device disclosed herein includes an array of magnetic memory cells having magnetoresistive (MR) stacks. The MRAM array also includes a series of bit lines and word lines coupled to the MR stacks. The array layout provides for reduced crosstalk between neighboring memory cells by increasing a distance between neighboring MR stacks along a common conductor without increasing the overall layout area of the MRAM array. Several embodiments are disclosed where neighboring MR stacks are offset such that the MR stacks are staggered. For example, groups of MR stacks coupled to a common word line or to a common bit line can be staggered. The staggered layout provides for increased distance between neighboring MR stacks for a given MRAM array area, thereby resulting in a reduction of crosstalk, for example during write operations.
摘要:
A method of manufacturing, programming and reading a non-volatile memory is provided. First, a to-be-coded memory having a plurality of to-be-coded cells arranged in a array is provided. Next, an implanting resist layer is formed on the to-be-coded memory. Then, a mask is disposed on the to-be-coded memory, wherein the number of the partial to-be-coded cells under the openings of the mask is less than the number of remaining to-be-coded cells. Afterwards, a patterned implanting resist layer is formed according to the mask. Next, the exposed to-be-coded cells are ion-implanted to define a plurality of first cells and second cells, wherein each first cell and each second cell record a second bit state and a first bit state respectively. Then, the to-be-coded memory is inversely defined, such that the first cells and the second cells record the first bit state and the second bit state respectively.
摘要:
The present invention provides a method of producing an added defect count for monitoring the property of chambers or wafers. First, a proper pre-process sensitivity is determined with map to map process by maximizing the summation of a mapping rate and a catching rate. Second, a wafer is scanned with the proper pre-process sensitivity and a pre-process particle number P1 is recorded. Third, a manufacturing step is processed on the wafer. Fourth, the wafer is scanned with the most sensitive scale of the post-process sensitivities and a post-process particle number P2 is recorded. Finally, the post-process particle number P2 is subtracted from the pre-process particle number P1.
摘要:
A method is disclosed to form a plurality of oxides of different thicknesses with one step oxidation. In a first embodiment, a substrate is provided having a high-voltage cell area and a peripheral low-voltage logic area separated by a trench isolation region. The substrate is first nitrided. Then the nitride layer over the high-voltage area is removed, and the substrate is wet cleaned with HF solution. The substrate surface is next oxidized to form a tunnel oxide of desired thickness over the high-voltage. In a second embodiment, a sacrificial oxide is used over the substrate for patterning the high voltage cell area and the low-voltage logic area. The sacrificial oxide is removed from the low-voltage area and the substrate is nitrided after cleaning with a solution not containing HF, thus forming a nitride layer over the low-voltage area. Then, the sacrificial oxide is removed from the high-voltage area with an HF dip, and tunnel oxide of desired thickness is formed over the same area. In this manner, oxides of multiple thicknesses are provided for the high-voltage cell area and the low-voltage peripheral logic area with one oxidation step. At the same time, with a judicious use of cleaning and nitridation, any detrimental effects of the native oxide are circumvented.
摘要:
A non-volatile memory having a control gate (14) and a sidewall select gate (28) is illustrated. The sidewall select gate (28) is formed in conjunction with a semiconductor doped oxide (20) to form a non-volatile memory cell (7). The semiconductor element used to dope the oxide layer (20) will generally include silicon or germanium. The non-volatile memory cell (7) is programmed by storing electrons in the doped oxide (20), and is erased using band-to-band tunneling.