公开(公告)号：US07709934B2

公开(公告)日：2010-05-04

申请号：US11647897

申请日：2006-12-28

Applicant: Xiang Yin Zeng ,  Jiangqi He ,  Guizhen Zheng

Inventor： Xiang Yin Zeng ,  Jiangqi He ,  Guizhen Zheng

IPC: H01L23/552 ,  H01L23/58 ,  H01L23/62 ,  H01L23/053 ,  H01L23/12 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/552 ,  H01L23/49827 ,  H01L23/66 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/0401

Abstract: A package may include a substrate provided with noise absorbing material. The noise absorbing material may absorb noise from a signal path in the substrate to prevent the noise from reaching other signals or signal paths.

Abstract translation: 包装可以包括设置有噪声吸收材料的基板。 噪声吸收材料可以从衬底中的信号路径吸收噪声，以防止噪声到达其他信号或信号路径。

公开(公告)号：US07477197B2

公开(公告)日：2009-01-13

申请号：US11618046

申请日：2006-12-29

Applicant: Xiang Yin Zeng ,  Jiangqi He ,  Guizhen Zheng

Inventor： Xiang Yin Zeng ,  Jiangqi He ,  Guizhen Zheng

IPC: H01Q1/38

CPC classification number: H01Q1/2283 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15321 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/141 ,  H05K1/16 ,  H05K3/3436 ,  H05K2201/0723 ,  H05K2201/10477 ,  H01L2924/00014

Abstract: Electronic devices and methods for their formation are described. One device relates to an electronic assembly including a substrate having a first surface and a second surface opposite the first surface. The electronic assembly also includes at least one RF front-end module coupled to the first surface of the substrate, and a ground plane layer positioned on the second surface of the substrate. The electronic assembly also includes an insulating layer on the ground plane layer, with the ground plane layer positioned between the second surface and the insulating layer. In addition, the electronic assembly also includes an antenna layer on the insulating layer, with the insulating layer positioned between the antenna layer and the ground plane layer.

Abstract translation: 描述了用于其形成的电子装置和方法。 一种装置涉及一种电子组件，其包括具有第一表面和与第一表面相对的第二表面的基底。 电子组件还包括耦合到衬底的第一表面的至少一个RF前端模块和位于衬底的第二表面上的接地平面层。 电子组件还包括在接地平面层上的绝缘层，其中接地平面层位于第二表面和绝缘层之间。 此外，电子组件还包括在绝缘层上的天线层，绝缘层位于天线层和接地平面层之间。

公开(公告)号：US20080157294A1

公开(公告)日：2008-07-03

申请号：US11647897

申请日：2006-12-28

Applicant: Xiang Yin Zeng ,  Jiangqi He ,  Guizhen Zheng

Inventor： Xiang Yin Zeng ,  Jiangqi He ,  Guizhen Zheng

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L23/49827 ,  H01L23/66 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/0401

Abstract: A package may comprise a substrate provided with noise absorbing material. The noise absorbing material may absorb noise from a signal path in the substrate to prevent the noise from reaching other signals or signal paths.

Abstract translation: 包装可以包括设置有噪声吸收材料的基板。 噪声吸收材料可以从衬底中的信号路径吸收噪声，以防止噪声到达其他信号或信号路径。

公开(公告)号：US20110058419A1

公开(公告)日：2011-03-10

申请号：US12938608

申请日：2010-11-03

Applicant: Qing A. Zhou ,  Daoqiang Lu ,  Jiangqi He ,  Wei Shi ,  Xiang Yin Zeng

Inventor： Qing A. Zhou ,  Daoqiang Lu ,  Jiangqi He ,  Wei Shi ,  Xiang Yin Zeng

IPC: G11C5/06 ,  G11C16/04

CPC classification number: H01L23/48 ,  H01L25/0652 ,  H01L2924/00014 ,  H01L2224/48

Abstract: Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed.

Abstract translation: 公开了包括光耦合管芯的多芯片组件的实施例。 多芯片组件可以包括两个相对的基板，并且在每个基板上安装多个管芯。 一个基板上的至少一个管芯与另一个基板上的至少一个相对的管芯光学连通。 描述和要求保护其他实施例。

公开(公告)号：US07564066B2

公开(公告)日：2009-07-21

申请号：US11270271

申请日：2005-11-09

Applicant: Qing A. Zhou ,  Daoqiang Lu ,  Jiangqi He ,  Wei Shi ,  Xiang Yin Zeng

Inventor： Qing A. Zhou ,  Daoqiang Lu ,  Jiangqi He ,  Wei Shi ,  Xiang Yin Zeng

IPC: H01L31/12

CPC classification number: H01L23/48 ,  H01L25/0652 ,  H01L2924/00014 ,  H01L2224/48

Abstract: Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed.

公开(公告)号：US20090039482A1

公开(公告)日：2009-02-12

申请号：US10581755

申请日：2005-08-31

Applicant: Jiangqi He ,  Bao Shu Xu ,  Xiang Yin Zeng

Inventor： Jiangqi He ,  Bao Shu Xu ,  Xiang Yin Zeng

IPC: H01L23/495 ,  H01L23/50 ,  H01L21/60

CPC classification number: H01L25/18 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01012 ,  H01L2924/01068 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00014

Abstract: A method, apparatus and system with a package including an integrated circuit disposed between die including a microprocessor and a die including a fourth level cache.

Abstract translation: 一种具有封装的方法，装置和系统，包括设置在包括微处理器的管芯和包括第四级缓存的管芯之间的集成电路。

公开(公告)号：US07255573B2

公开(公告)日：2007-08-14

申请号：US11324040

申请日：2005-12-30

Applicant: Jiangqi He ,  BaoShu Xu ,  Xiang Yin Zeng

Inventor： Jiangqi He ,  BaoShu Xu ,  Xiang Yin Zeng

IPC: H01R12/00

CPC classification number: H01R13/6461 ,  H01R13/6477 ,  Y10S439/941

Abstract: Data signal interconnections are described that offer reduced cross talk particularly with high speed differential signaling. In one example, the invention includes a plurality of interconnects to carry data signals between a first component and a second component, the plurality of interconnects including a first set of interconnects oriented in a first direction and a second set of interconnects oriented in a second direction, different from the first direction.

Abstract translation: 描述了数据信号互连，其提供减少的串扰，特别是与高速差分信号。 在一个示例中，本发明包括在第一组件和第二组件之间承载数据信号的多个互连，所述多个互连包括在第一方向上定向的第一组互连和在第二方向上定向的第二组互连 ，不同于第一个方向。

公开(公告)号：US07852189B2

公开(公告)日：2010-12-14

申请号：US11323339

申请日：2005-12-30

Applicant: Jiangqi He ,  Robert L. Sankman ,  BaoShu Xu ,  Xiang Yin Zeng

Inventor： Jiangqi He ,  Robert L. Sankman ,  BaoShu Xu ,  Xiang Yin Zeng

IPC: H01F27/28

CPC classification number: H01F17/0006 ,  H01F27/323 ,  H01F41/041 ,  H01F2017/0046 ,  H01L23/5227 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A spiral inductor is disposed above a substrate that includes two different materials. A dielectric film is the first material that provides structural integrity for the substrate. A second dielectric is the second material that provides a low dielectric-constant (low-K) material closest to the spiral inductor coil. A process of forming the spiral inductor includes patterning the substrate to allow a recess as a receptacle for the second dielectric, followed by forming the spiral inductor mostly above the second dielectric.

Abstract translation: 螺旋电感器设置在包括两种不同材料的衬底之上。 电介质膜是为衬底提供结构完整性的第一种材料。 第二介质是提供最接近螺旋电感线圈的低介电常数（低K）材料的第二材料。 形成螺旋电感器的过程包括图案化衬底以允许凹槽作为用于第二电介质的插座，随后形成主要位于第二电介质上方的螺旋电感器。

公开(公告)号：US07714430B2

公开(公告)日：2010-05-11

申请号：US11529011

申请日：2006-09-28

Applicant: Xiang Yin Zeng ,  Daoqiang (Daniel) Lu ,  Jiangqi He ,  Jiamiao(John) Tang

Inventor： Xiang Yin Zeng ,  Daoqiang (Daniel) Lu ,  Jiangqi He ,  Jiamiao(John) Tang

IPC: H01L23/12

CPC classification number: H05K1/0234 ,  H01L23/49827 ,  H01L23/552 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0373 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2201/10378 ,  Y10T428/24917 ,  H01L2224/0401

Abstract: In one embodiment, the present invention includes a semiconductor package with lossy material inserts. The lossy material inserts may reduce electronic noise such as package resonance. Other embodiments are described and claimed.

Abstract translation: 在一个实施例中，本发明包括具有有损材料插入物的半导体封装。 有损耗的材料插入物可以减少诸如封装谐振的电子噪声。 描述和要求保护其他实施例。

公开(公告)号：US20100059858A1

公开(公告)日：2010-03-11

申请号：US12590547

申请日：2009-11-10

Applicant: John J. Tang ,  Xiang Yin Zeng ,  Jiangqi He ,  Ding Hai

Inventor： John J. Tang ,  Xiang Yin Zeng ,  Jiangqi He ,  Ding Hai

IPC: H01L29/92

CPC classification number: H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48472 ,  H01L2224/49 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H05K1/111 ,  H05K1/113 ,  H05K1/162 ,  H05K3/28 ,  H05K2201/0187 ,  H05K2201/09436 ,  H05K2201/09763 ,  H05K2201/10674 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: An article includes a top electrode that is embedded in a solder mask. An article includes a top electrode that is on a core structure. A process of forming the top electrode includes reducing the solder mask thickness and forming the top electrode on the reduced-thickness solder mask. A process of forming the top electrode includes forming the top electrode over a high-K dielectric that is in a patterned portion of the core structure.