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    Chemical Mechanical Planarization Pad With Surface Characteristics
    1.
    发明申请
    Chemical Mechanical Planarization Pad With Surface Characteristics 审中-公开
    具有表面特性的化学机械平面化垫

    公开(公告)号：US20110105000A1

    公开(公告)日：2011-05-05

    申请号：US12891612

    申请日：2010-09-27

    申请人： Yongqi Hu ,  Kadthala Ramaya Narendrnath ,  Ashish Bhatnagar

    发明人： Yongqi Hu ,  Kadthala Ramaya Narendrnath ,  Ashish Bhatnagar

    IPC分类号： B24B41/00 ,  B24D3/32 ,  B24D3/34

    CPC分类号： B24B37/24 ,  B24D3/32 ,  B24D3/344 ,  B24D3/346

    摘要： A polishing pad includes a polymer matrix and polyhedral oligomeric silsequioxane (“POSS”) molecules or soluble particles and a surfactant dispersed within the polymer matrix. A polishing pad can be formed by casting a liquid polymer on a conveyer belt having a casting surface with a set of projections and curing the liquid polymer on the conveyer belt such that a polymer matrix has a surface with a second set of projections complimentary to the first set of projections.

    摘要翻译： 抛光垫包括分散在聚合物基体内的聚合物基质和多面体低聚硅氧烷（“POSS”）分子或可溶性颗粒和表面活性剂。 可以通过在具有铸造表面的输送带上浇铸具有一组突起的液体聚合物并将液体聚合物固化在输送带上的方法来形成抛光垫，使得聚合物基质具有与第二组突起互补的表面 第一套预测。

    Method and apparatus for planarizing a substrate with low fluid consumption
    4.
    发明申请
    Method and apparatus for planarizing a substrate with low fluid consumption 审中-公开
    用于以低流体消耗平坦化基板的方法和装置

    公开(公告)号：US20070131562A1

    公开(公告)日：2007-06-14

    申请号：US11298643

    申请日：2005-12-08

    申请人： Zhihong Wang ,  Ming-Kuei Tseng ,  Yuan Tian ,  Yongqi Hu ,  Stan Tsai

    发明人： Zhihong Wang ,  Ming-Kuei Tseng ,  Yuan Tian ,  Yongqi Hu ,  Stan Tsai

    IPC分类号： B23H3/00

    CPC分类号： B23H5/08 ,  B24B37/04 ,  B24B57/02 ,  C25D5/06 ,  C25D5/08 ,  C25D7/12 ,  C25D17/001

    摘要： The embodiments of the invention generally relate to a method and apparatus for processing a substrate with reduced fluid consumption. Embodiments of the invention may be beneficially utilized in chemical mechanical and electrochemical mechanical polishing processes, among other processes where conservation of a processing fluid disposed on a rotating pad is desirable. In one embodiment, a processing fluid delivery arm assembly is provided that includes a nozzle assembly supported at a distal end of an arm. The nozzle assembly includes a nozzle that is adjustable to control the delivery of fluid exiting therefrom in two planes relative to the arm. In another embodiment, processing fluid in the form of electrolyte fills holes formed at least partially through the pad as they enter the wet zone, and a current is driven through the electrolyte, filling the holes between a substrate and an electrode disposed below the surface of the pad.

    摘要翻译： 本发明的实施例一般涉及用于处理具有减少的流体消耗的基板的方法和装置。 本发明的实施例可以有利地用于化学机械和电化学机械抛光工艺以及其它工艺中，其中设置在旋转焊盘上的处理流体的保护是期望的。 在一个实施例中，提供了一种处理流体输送臂组件，其包括支撑在臂的远端处的喷嘴组件。 喷嘴组件包括可调节的喷嘴，以控制从相对于臂的两个平面离开的流体的输送。 在另一个实施方案中，电解液形式的处理流体在其进入湿区时填充至少部分地通过焊盘形成的孔，并且电流驱动通过电解质，填充基板和设置在下表面之下的电极之间的孔 垫

    Method and apparatus for reduced wear polishing pad conditioning
    5.
    发明授权
    Method and apparatus for reduced wear polishing pad conditioning 失效
    降低磨损抛光垫调理的方法和装置

    公开(公告)号：US07210988B2

    公开(公告)日：2007-05-01

    申请号：US11209167

    申请日：2005-08-22

    申请人： Yan Wang ,  Stan D. Tsai ,  Yongqi Hu ,  Feng Q. Liu ,  Liang-Yuh Chen ,  Daxin Mao ,  Huyen Karen Tran ,  Martin S. Wohlert ,  Renhe Jia ,  Yuan A. Tian

    发明人： Yan Wang ,  Stan D. Tsai ,  Yongqi Hu ,  Feng Q. Liu ,  Liang-Yuh Chen ,  Daxin Mao ,  Huyen Karen Tran ,  Martin S. Wohlert ,  Renhe Jia ,  Yuan A. Tian

    IPC分类号： B24B53/00

    CPC分类号： B24B53/017 ,  B23H5/08

    摘要： Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head to a processing pad. The brush spins and moves laterally across the surface of the processing pad. The cleaning solution dispensed through the conditioning head dissolves by-products of the processing operation while the brush gently wipes the processing pad. A lip of the conditioning head retains the cleaning fluid and cleaning waste, thereby minimizing contamination of the area outside of the conditioning head. The cleaning waste is removed from the processing pad via passages formed near the outer periphery of the conditioning head.

    摘要翻译： 提供了用于原位调理和/或清洁CMP，ECMP或其它处理系统的处理垫的调节头的实施例。 在一个实施例中，调节头包括设置在中心腔中的刷子。 清洁流体通过调节头的中心空腔设置到处理垫。 刷子旋转并横向移动到处理垫的表面上。 通过调节头分配的清洁溶液溶解处理操作的副产物，同时刷子轻轻擦拭处理垫。 调节头的唇缘保持清洁流体和清洁废物，从而最小化调节头外部区域的污染。 清洁废物通过在调节头的外周附近形成的通道从处理垫移除。

    Full Sequence Metal and Barrier Layer Electrochemical Mechanical Processing
    7.
    发明申请
    Full Sequence Metal and Barrier Layer Electrochemical Mechanical Processing 失效
    全序列金属和屏障层电化学机械加工

    公开(公告)号：US20060260951A1

    公开(公告)日：2006-11-23

    申请号：US11425682

    申请日：2006-06-21

    申请人： Feng Liu ,  Liang-Yuh Chen ,  Stan Tsai ,  Yongqi Hu

    发明人： Feng Liu ,  Liang-Yuh Chen ,  Stan Tsai ,  Yongqi Hu

    IPC分类号： B23H3/02

    CPC分类号： B23H5/08 ,  C25F7/00

    摘要： A method and apparatus for electrochemically processing metal and barrier materials is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of establishing an electrically-conductive path through an electrolyte between an exposed layer of barrier material on the substrate and an electrode, pressing the substrate against a processing pad assembly, providing motion between the substrate and pad assembly in contact therewith and electrochemically removing a portion of the exposed layer during a first electrochemical processing step in a barrier processing station.

    摘要翻译： 提供了一种用于电化学处理金属和阻隔材料的方法和装置。 在一个实施例中，用于电化学处理衬底的方法包括以下步骤：在衬底上的暴露的阻挡材料层与电极之间建立通过电解质的导电路径，将衬底压在处理衬垫组件上， 所述衬底和焊盘组件与其接触并且在屏障处理站中的第一电化学处理步骤期间电化学去除所述暴露层的一部分。

    Method and apparatus for reduced wear polishing pad conditioning
    8.
    发明申请
    Method and apparatus for reduced wear polishing pad conditioning 失效
    降低磨损抛光垫调理的方法和装置

    公开(公告)号：US20060046623A1

    公开(公告)日：2006-03-02

    申请号：US11209167

    申请日：2005-08-22

    申请人： Yan Wang ,  Stan Tsai ,  Yongqi Hu ,  Feng Liu ,  Liang-Yuh Chen ,  Daxin Mao ,  Huyen Tran ,  Martin Wohlert ,  Renhe Jia ,  Yuan Tian

    发明人： Yan Wang ,  Stan Tsai ,  Yongqi Hu ,  Feng Liu ,  Liang-Yuh Chen ,  Daxin Mao ,  Huyen Tran ,  Martin Wohlert ,  Renhe Jia ,  Yuan Tian

    IPC分类号： B24B1/00

    CPC分类号： B24B53/017 ,  B23H5/08

    摘要： Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head to a processing pad. The brush spins and moves laterally across the surface of the processing pad. The cleaning solution dispensed through the conditioning head dissolves by-products of the processing operation while the brush gently wipes the processing pad. A lip of the conditioning head retains the cleaning fluid and cleaning waste, thereby minimizing contamination of the area outside of the conditioning head. The cleaning waste is removed from the processing pad via passages formed near the outer periphery of the conditioning head.

    摘要翻译： 提供了用于原位调理和/或清洁CMP，ECMP或其它处理系统的处理垫的调节头的实施例。 在一个实施例中，调节头包括设置在中心腔中的刷子。 清洁流体通过调节头的中心空腔设置到处理垫。 刷子旋转并横向移动到处理垫的表面上。 通过调节头分配的清洁溶液溶解处理操作的副产物，同时刷子轻轻地擦拭处理垫。 调节头的唇缘保持清洁流体和清洁废物，从而最小化调节头外部区域的污染。 清洁废物通过在调节头的外周附近形成的通道从处理垫移除。

    Method and apparatus for evaluating polishing pad conditioning
    10.
    发明授权
    Method and apparatus for evaluating polishing pad conditioning 失效
    评估抛光垫调理的方法和装置

    公开(公告)号：US07699972B2

    公开(公告)日：2010-04-20

    申请号：US11370474

    申请日：2006-03-08

    申请人： Zhihong Wang ,  Yongqi Hu ,  Stan D. Tsai

    发明人： Zhihong Wang ,  Yongqi Hu ,  Stan D. Tsai

    IPC分类号： C25F3/02 ,  B23H5/06

    CPC分类号： B23H5/08 ,  B24B53/017 ,  C25F3/02 ,  C25F7/00

    摘要： A method and apparatus for evaluating a conditioned electrochemical mechanical polishing pad are provided. A polishing pad is conditioned using a first set of process conditions. A sheet wafer and a residue wafer are polished on the polishing pad. The removal rates of one or more materials from the sheet wafer and the residue wafer are measured. A normalized removal rate is calculated. The polishing pad is further conditioned if the normalized removal rate is not within a minimum value and a maximum value. In one embodiment, the normalized removal rate comprises a ratio of the removal rate of the residue wafer to the removal rate of the sheet wafer.

    摘要翻译： 提供了一种评价调理电化学机械抛光垫的方法和装置。 使用第一组工艺条件对抛光垫进行调理。 在抛光垫上抛光片状晶片和残留晶片。 测量来自片状晶片和残留晶片的一种或多种材料的去除速率。 计算归一化的去除率。 如果归一化的去除速率不在最小值和最大值内，抛光垫被进一步调节。 在一个实施例中，归一化去除速率包括残余晶片的去除速率与片晶片的去除速率的比率。