公开(公告)号：US06236108B1

公开(公告)日：2001-05-22

申请号：US09541041

申请日：2000-03-31

申请人： Yoshiki Sota ,  Koji Miyata ,  Toshio Yamazaki ,  Fumio Inoue ,  Hidehiro Nakamura ,  Yoshiaki Tsubomatsu ,  Yasuhiko Awano ,  Shigeki Ichimura ,  Masami Yusa ,  Yorio Iwasaki

发明人： Yoshiki Sota ,  Koji Miyata ,  Toshio Yamazaki ,  Fumio Inoue ,  Hidehiro Nakamura ,  Yoshiaki Tsubomatsu ,  Yasuhiko Awano ,  Shigeki Ichimura ,  Masami Yusa ,  Yorio Iwasaki

IPC分类号： H01L23495

CPC分类号： H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.

摘要翻译： 本发明的半导体封装芯片支撑基板包括绝缘支撑基板，设置在基板上的布线和设置在布线上的绝缘膜。 布线各自具有i）连接到半导体芯片电极的内部连接，以及ii）半导体芯片安装区域。 在绝缘支撑基板的一部分上还设置有开口，其中每个布线形成在绝缘支撑基板上，绝缘支撑基板是设置有内部连接的外部连接的部分。 绝缘膜形成在安装有半导体芯片的部分，覆盖布线的半导体芯片安装区域。

公开(公告)号：US6064111A

公开(公告)日：2000-05-16

申请号：US903996

申请日：1997-07-31

申请人： Yoshiki Sota ,  Koji Miyata ,  Toshio Yamazaki ,  Fumio Inoue ,  Hidehiro Nakamura ,  Yoshiaki Tsubomatsu ,  Yasuhiko Awano ,  Shigeki Ichimura ,  Masami Yusa ,  Yorio Iwasaki

发明人： Yoshiki Sota ,  Koji Miyata ,  Toshio Yamazaki ,  Fumio Inoue ,  Hidehiro Nakamura ,  Yoshiaki Tsubomatsu ,  Yasuhiko Awano ,  Shigeki Ichimura ,  Masami Yusa ,  Yorio Iwasaki

IPC分类号： H01L23/02 ,  H01L23/498 ,  H01L23/495 ,  H01L21/44

CPC分类号： H01L23/4985 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181

摘要： A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting a substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.

摘要翻译： 本发明的半导体封装芯片支撑基板包括绝缘支撑基板，设置在基板上的布线和设置在布线上的绝缘膜。 布线各自具有i）连接到半导体芯片电极的内部连接，以及ii）半导体芯片安装区域。 在绝缘支撑基板上的绝缘性支撑基板上形成有各自的配线的绝缘物的绝缘体上设置开口部，绝缘性支撑基板是设置有内部连接部的外部连接部的部分。 绝缘膜形成在安装有半导体芯片的部分，覆盖布线的半导体芯片安装区域。

公开(公告)号：US06331729B1

公开(公告)日：2001-12-18

申请号：US09297296

申请日：1999-08-10

申请人： Masami Yusa ,  Toshihiko Kato ,  Fumio Inoue ,  Shigeki Ichimura

发明人： Masami Yusa ,  Toshihiko Kato ,  Fumio Inoue ,  Shigeki Ichimura

IPC分类号： H01L2340

CPC分类号： H01L23/3121 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： In the present invention, an insulating film adhesive material is attached onto the wirings in the form of a tent so that an empty space communicating with a vent hole is provided. Use of this chip-supporting substrate makes it possible to produce small-sized semiconductor packages preventive of package cracking and having a high reliability, because the function of the vent hole is not damaged and also gases and water vapor which are generated from the insulating film adhesive material at the time of reflowing can be driven off surely outside the package.

摘要翻译： 在本发明中，绝缘膜粘合剂材料以帐篷的形式附接到布线上，从而提供与通气孔连通的空的空间。 使用该芯片支撑基板使得可以生产小型半导体封装，防止封装开裂并具有高可靠性，因为通气孔的功能不被损坏，并且还产生从绝缘膜产生的气体和水蒸汽 在回流时的粘合剂材料可以在包装外确保地被驱除。

公开(公告)号：US08029911B2

公开(公告)日：2011-10-04

申请号：US12847819

申请日：2010-07-30

申请人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

发明人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

IPC分类号： H05K3/32 ,  H05K1/14 ,  H01L21/60 ,  H01L21/50 ,  C09J7/00

CPC分类号： C09J7/10 ,  C08L61/00 ,  C09J2201/36 ,  C09J2201/602 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29469 ,  H01L2224/83851 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/323 ,  H05K3/361 ,  Y10T428/12014 ,  Y10T428/2817 ,  Y10T428/31504 ,  Y10T428/31554 ,  Y10T428/31573 ,  Y10T428/31609 ,  Y10T428/31855 ,  Y10T428/31909 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

摘要： There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.

摘要翻译： 提供了一种用于连接电路的粘合剂，该电路将介于具有彼此相对的电路电极的基板之间，并且将彼此相对的基板上的电路电极与加压方向电压连接，其中粘合剂包含具有 酸当量为5至500KOHmg / g，以及用于连接待彼此相对的电路电极的基板之间的电路的粘合剂，并将彼此相对的基板上的电极与压力方向压力连接 其中所述粘合剂包括第一粘合剂层和第二粘合剂层，并且压力连接之后的第一粘合剂层的玻璃化转变温度高于压力连接之后的第二粘合剂层的玻璃化转变温度。

公开(公告)号：US20100294551A1

公开(公告)日：2010-11-25

申请号：US12847819

申请日：2010-07-30

申请人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

发明人： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

IPC分类号： H05K1/02 ,  B32B7/10 ,  B32B37/14

CPC分类号： C09J7/10 ,  C08L61/00 ,  C09J2201/36 ,  C09J2201/602 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29469 ,  H01L2224/83851 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/323 ,  H05K3/361 ,  Y10T428/12014 ,  Y10T428/2817 ,  Y10T428/31504 ,  Y10T428/31554 ,  Y10T428/31573 ,  Y10T428/31609 ,  Y10T428/31855 ,  Y10T428/31909 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

摘要： There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.

摘要翻译： 提供了一种用于连接电路的粘合剂，该电路将介于具有彼此相对的电路电极的基板之间，并且将彼此相对的基板上的电路电极与加压方向电压连接，其中粘合剂包含具有 酸当量为5至500KOHmg / g，以及用于连接待彼此相对的电路电极的基板之间的电路的粘合剂，并将彼此相对的基板上的电极与压力方向压力连接 其中所述粘合剂包括第一粘合剂层和第二粘合剂层，并且压力连接之后的第一粘合剂层的玻璃化转变温度高于压力连接之后的第二粘合剂层的玻璃化转变温度。

公开(公告)号：US07781896B2

公开(公告)日：2010-08-24

申请号：US12138637

申请日：2008-06-13

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

摘要翻译： 将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置 这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

公开(公告)号：US20060260744A1

公开(公告)日：2006-11-23

申请号：US11494709

申请日：2006-07-28

申请人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

发明人： Isao Tsukagoshi ,  Yasushi Gotou ,  Masami Yusa ,  Yasuo Miyadera

IPC分类号： C09J5/00

CPC分类号： H05K3/323 ,  B32B7/12 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/305 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0329 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/1189 ,  Y10T428/12569 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2891

摘要： The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.

公开(公告)号：US07078094B2

公开(公告)日：2006-07-18

申请号：US10891090

申请日：2004-07-15

申请人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

发明人： Shinji Takeda ,  Takashi Masuko ,  Masami Yusa ,  Tooru Kikuchi ,  Yasuo Miyadera ,  Iwao Maekawa ,  Mitsuo Yamasaki ,  Akira Kageyama ,  Aizou Kaneda

IPC分类号： B32B15/04 ,  H01L23/495

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

公开(公告)号：US06841628B2

公开(公告)日：2005-01-11

申请号：US10203408

申请日：2001-02-09

申请人： Satoru Oota ,  Masami Yusa ,  Akira Nagai

发明人： Satoru Oota ,  Masami Yusa ,  Akira Nagai

IPC分类号： C08F283/06 ,  C08L71/00 ,  C08L71/10 ,  C09J4/06 ,  C09J171/00 ,  H05K3/32 ,  H05K3/38 ,  H05K3/46 ,  C08L71/02

CPC分类号： C09J171/00 ,  C08F283/06 ,  C08G2650/56 ,  C08L63/00 ,  C08L71/00 ,  C08L2666/02 ,  C09J4/06 ,  H05K3/321 ,  H05K3/386 ,  H05K3/4626 ,  C08F222/1006

摘要： The present invention relates to a resin composition which gives a resin product with a low hygroscopic property, an adhesive for connecting a circuit member and a circuit board, and provides a resin composition, an adhesive for connecting a circuit member and a circuit board comprising (A) a polyhydroxy polyether resin represented by the formula (I): wherein R1 to R8 each represent H, C1-4 alkyl group, C2-5 alkenyl group, C1-4 hydroxyalkyl group or halogen atom; Ra represents H or C1-2 alkyl group; Rb represents C2-13 alkyl group; and n is a recurring number, or the following formula (II): wherein R9 to R12 each represent H, C1-6 alkyl group, C1-6 hydroxyalkyl group or halogen atom; Rc to Rf each represent H, C1-6 alkyl group, cyclohexyl group, aryl group, aralkyl group or halogen atom; and m is a recurring number, and (B) a three dimensionally cross-linkable resin.

摘要翻译： 本发明涉及一种树脂组合物，其具有低吸湿性的树脂产品，用于连接电路部件和电路板的粘合剂，并提供树脂组合物，用于连接电路部件的粘合剂和电路板，其包括（ A）由式（I）表示的多羟基聚醚树脂：其中R 1至R 8各自表示H，C 1-4烷基，C 2-5烯基，C 1-4羟烷基或卤素原子; Ra表示H或C 1-2烷基; Rb表示C2-13烷基; n为重复数，或下式（II）：其中R 9至R 12各自表示H，C 1-6烷基，C 1-6羟基烷基或卤素原子; Rc至Rf各自表示H，C 1-6烷基，环己基，芳基，芳烷基或卤素原子; m为重复数，（B）为三维交联树脂。

公开(公告)号：US06762249B1

公开(公告)日：2004-07-13

申请号：US10069053

申请日：2002-07-08

申请人： Tohru Fujinawa ,  Masami Yusa ,  Satoyuki Nomura ,  Hiroshi Ono ,  Itsuo Watanabe ,  Motohiro Arifuku ,  Hoko Kanazawa

发明人： Tohru Fujinawa ,  Masami Yusa ,  Satoyuki Nomura ,  Hiroshi Ono ,  Itsuo Watanabe ,  Motohiro Arifuku ,  Hoko Kanazawa

IPC分类号： C08G1862

CPC分类号： H05K3/323 ,  C08F283/006 ,  C08F290/067 ,  C08G18/4018 ,  C08G18/4238 ,  C08G18/4277 ,  C08G18/4854 ,  C08G18/6607 ,  C08G18/672 ,  C08G18/8175 ,  C08L51/08 ,  C08L75/04 ,  C09J4/06 ,  H01L24/29 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K2201/0154 ,  C08G18/42 ,  C08L2666/02 ,  H01L2924/00

摘要： The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.

摘要翻译： 本发明提供一种配线连接材料，其包含2至75重量份的聚氨酯树脂，30至60重量份的可自由基聚合的物质和0.1至30重量份的能产生 加热时的自由基，以及使用配线连接材料制造配线连接板的工序。 本发明的配线连接材料优选还可以含有成膜材料和/或导电性粒子。