公开(公告)号：US20140213116A1

公开(公告)日：2014-07-31

申请号：US14162143

申请日：2014-01-23

申请人： Kazuta Yoshida ,  Yoshifumi Okabe ,  Hidehiro Nakamura

发明人： Kazuta Yoshida ,  Yoshifumi Okabe ,  Hidehiro Nakamura

IPC分类号： H01R12/72

CPC分类号： H01R12/714 ,  G06K7/0021 ,  H01R25/006

摘要： A memory card connector includes first and second connectors including first and second housings having first and second storage sections, respectively, and first and second contacts which connect with terminals of first and second memory cards removably-inserted into the first and second storage sections, respectively. The first and second connectors are superposed on each other in a direction of thickness thereof. Each first contact includes a first tail which is mountable to a circuit board and positioned on an outer peripheral side of a first side surface of the first housing. The second housing includes a second side surface located at a different position from the first side surface as viewed in the thickness direction. Each second contact includes a second tail which is mountable to the circuit board and positioned on an outer peripheral side of the second side surface.

摘要翻译： 存储卡连接器包括分别具有第一和第二存储部分的第一和第二壳体的第一和第二连接器，以及分别与可拆卸地插入到第一和第二存储部分中的第一和第二存储卡的端子连接的第一和第二触点 。 第一和第二连接器在其厚度方向上彼此叠置。 每个第一触点包括可安装到电路板并位于第一壳体的第一侧表面的外周侧上的第一尾部。 第二壳体包括位于距厚度方向观察时与第一侧面不同位置的第二侧面。 每个第二触点包括可安装到电路板并位于第二侧表面的外周侧上的第二尾部。

公开(公告)号：US08648605B2

公开(公告)日：2014-02-11

申请号：US12680447

申请日：2008-09-26

申请人： Hidehiro Nakamura ,  Tooru Nakamura ,  Yutaka Hayashi ,  Yuji Kawanishi

发明人： Hidehiro Nakamura ,  Tooru Nakamura ,  Yutaka Hayashi ,  Yuji Kawanishi

IPC分类号： G01N27/62

CPC分类号： G01N27/423 ,  G01N27/42

摘要： This invention provides a sensor having such a structure that the area in which a sensor electrode comes into contact with a liquid, a mist or a gas containing an analyte has been previously specified. The sensor comprises at least an electroconductive first electrode, an electroconductive second electrode, electroconductive first and second wirings connected to the first and second electrodes, and an insulating part for insulating the first and second wirings from each other and from a liquid, a mist or a gas containing the analyte. The insulating part is formed of an organic material. In the first and second electrodes, at least the surface, which comes into contact with a liquid, a mist or a gas containing the analyte, is formed of a material which is insoluble in a liquid or a mist containing the analyte, or is not attacked by a gas containing the analyte.

摘要翻译： 本发明提供了一种传感器，其具有以下结构：传感器电极与液体，雾或包含分析物的气体接触的区域已被预先规定。 传感器包括至少导电的第一电极，导电的第二电极，连接到第一和第二电极的导电的第一和第二布线，以及绝缘部分，用于将第一和第二布线彼此隔离，并与液体，雾或 含有分析物的气体。 绝缘部分由有机材料形成。 在第一和第二电极中，至少与液体接触的表面，雾或含有分析物的气体由不溶于液体或含有分析物的雾的材料形成，或不是 被含有分析物的气体攻击。

公开(公告)号：US08028402B2

公开(公告)日：2011-10-04

申请号：US11775294

申请日：2007-07-10

申请人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro Nakamura ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K3/36 ,  H01R9/00 ,  H01K3/10

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating resin composition layer and a conductor circuit formed on the insulating resin composition layer and connected to the connection conductor; aligning the connection boards; and laminating the aligned connection boards by heating and pressing, so that the connection conductors, or the connection conductor and the conductor circuit, are conductively connected with each other, and the connection boards are mechanically connected with each other by the insulating resin composition layer. The connection boards are formed by specified processing, including use of a three-layer composite metallic layer.

摘要翻译： 公开了一种多层布线板的制造方法，该方法包括：准备连接板，连接板分别具有绝缘树脂组合物层，形成为穿过绝缘树脂组合物层的连接导体和导体电路 形成在绝缘树脂组合物层上并连接到连接导体; 对准连接板; 并且通过加热和压制层叠对准的连接板，使得连接导体或连接导体和导体电路彼此导电连接，并且连接板通过绝缘树脂组合物层彼此机械连接。 连接板通过特定的加工形成，包括使用三层复合金属层。

公开(公告)号：US07205645B2

公开(公告)日：2007-04-17

申请号：US10203652

申请日：2001-02-21

申请人： Hidehiro Nakamura ,  Tetsuya Enomoto ,  Toshio Yamazaki ,  Hiroshi Kawazoe

发明人： Hidehiro Nakamura ,  Tetsuya Enomoto ,  Toshio Yamazaki ,  Hiroshi Kawazoe

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L21/568 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/4007 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A wiring substrate (1) comprises an insulating base (10) with connection holes (11), buried conductors (12) provided in the connection holes (11) without reaching a rear surface of the insulating base (10), and wiring layers 14 connected to the buried conductors (12). The buried conductors (12) thicken the wiring layers (14), and can form aligning parts (110) on the rear surface of the connection holes (11) to be used for three-dimensional mounting structure. Each wiring layer (14) includes thin terminals (14A), wirings (14B) and thick electrodes (14C). Not only the terminals (14A) and wirings (14B) but also the buried conductors (12) are raised by the same manufacturing process. A semiconductor element (2) is attached to the electrodes (14C) of the wiring substrate (1).

摘要翻译： 布线基板（1）包括具有连接孔（11）的绝缘基座（10），设置在连接孔（11）中的埋入导体（12），而不到达绝缘基座（10）的后表面，并且布线层14 连接到埋地导体（12）。 掩埋导体（12）使布线层（14）变厚，并且可以在用于三维安装结构的连接孔（11）的后表面上形成对准部分（110）。 每个布线层（14）包括薄端子（14A），布线（14B）和厚电极（14C）。 不仅端子（14A）和布线（14B）以及埋地导体（12）都通过相同的制造工艺升高。 半导体元件（2）附着到布线基板（1）的电极（14C）上。

公开(公告)号：US6015309A

公开(公告)日：2000-01-18

申请号：US38614

申请日：1998-03-11

申请人： Hidehiro Nakamura ,  Kazuki Satou ,  Wataru Oguchi

发明人： Hidehiro Nakamura ,  Kazuki Satou ,  Wataru Oguchi

IPC分类号： H01R13/629 ,  H01R13/633 ,  H01R13/62

CPC分类号： H01R13/633 ,  H01R23/70

摘要： In a PC card connector, first and second support shafts are mounted upright on a pin housing, and each provided with a pair of fall-preventive sections at the leading end thereof. A first turn arm is provided with a circular hole, a protrusion, a tongue, a concave section on the rim of the circular hole, and a pair of cutouts that cross the concave section, and the circular hole is fitted on the first support shaft through the cutouts so that the first turn arm can move pivotally. A second turn arm is formed similarly to the first turn arm, and a circular hole thereof is fitted on the second support shaft so that the second turn arm can move pivotally. A drive lever is provided with a circular hole, an engaging section, a coupling hole, a thin concave section formed on the rim of the circular hole, and a pair of cutouts that cross the concave section. The circular hole is fitted on the first support shaft through the cutouts so that the drive lever can move pivotally, and the drive lever and the first turn arm are prevented from falling off by the fall-preventive sections of the first support shaft. The tongues of the turn arms are engaged with the coupling hole of the drive lever, and the engaging section is engaged with a push-rod.

摘要翻译： 在PC卡连接器中，第一和第二支撑轴直立地安装在销壳体上，并且每个在其前端设置有一对防坠落部分。 第一转臂在圆形孔的边缘设置有圆形孔，突出部，舌部，凹部，以及与凹部交叉的一对切口，圆形孔安装在第一支撑轴上 通过切口使得第一转臂可以枢转地移动。 第二转臂与第一转动臂类似地形成，并且其圆形孔装配在第二支撑轴上，使得第二转臂能够枢转地移动。 驱动杆设置有圆形孔，接合部，联接孔，形成在圆形孔的边缘上的薄凹部和与凹部交叉的一对切口。 通过切口将圆形孔安装在第一支撑轴上，使得驱动杆可以枢转地移动，并且防止驱动杆和第一转动臂被第一支撑轴的防止部分脱落。 转臂的舌片与驱动杆的联接孔接合，并且接合部与推杆接合。

公开(公告)号：US5880405A

公开(公告)日：1999-03-09

申请号：US762116

申请日：1996-12-10

申请人： Hidehiro Nakamura ,  Yasunari Takano ,  Tetsuya Furusawa

发明人： Hidehiro Nakamura ,  Yasunari Takano ,  Tetsuya Furusawa

IPC分类号： H01R4/02 ,  H05K1/18 ,  H05K3/34 ,  H05K13/04 ,  H02G3/08

CPC分类号： H05K13/046 ,  H05K3/3426 ,  H05K3/3421 ,  Y02P70/613

摘要： A terminal structure for a surface mount electronic part including a terminal holding member formed from a synthetic resin, and external terminal extending from the terminal holding member for soldering to soldering lands of a printed wiring board. Each of the external terminals is held on the terminal holding member such that a straight portion projects laterally from the terminal holding member and is restricted direction (i.e., in width and thickness directions). The outermost tip portion of each external terminal includes an offset portion which is stepped downwards relative to the straight portion of the external terminal includes an offset portion which is stepped downwards relative to the straight portion of the external terminal and which is formed by half punching. The offset portion is provided for soldering to a soldering land of the printed wiring board. A region of the lower surface of the offset portion of each external terminal, which is continuous with a front end surface of the offset portion, is beveled to form an inclined surface such that the thickness of the offset portion decreases toward the front end surface.

摘要翻译： 一种用于表面安装电子部件的端子结构，其包括由合成树脂形成的端子保持部件，以及从端子保持部件延伸到焊接到印刷线路板的焊接区域的外部端子。 每个外部端子被保持在端子保持构件上，使得直线部分从端子保持构件横向突出并且是限制方向（即，宽度和厚度方向）。 每个外部端子的最外端部包括相对于外部端子的直线部分向下台阶的偏移部分，其包括相对于外部端子的直线部分向下台阶并且通过半冲压形成的偏移部分。 偏移部分被设置用于焊接到印刷线路板的焊接区域。 每个外部端子的偏移部分的下表面的与偏移部分的前端表面连续的区域被倒角以形成倾斜表面，使得偏移部分的厚度朝向前端表面减小。

公开(公告)号：US5738532A

公开(公告)日：1998-04-14

申请号：US602201

申请日：1996-02-16

申请人： Yasunari Takano ,  Hidehiro Nakamura ,  Shin Yoshida ,  Akito Miura ,  Koichi Takahashi ,  Kazuki Satou

发明人： Yasunari Takano ,  Hidehiro Nakamura ,  Shin Yoshida ,  Akito Miura ,  Koichi Takahashi ,  Kazuki Satou

IPC分类号： H01R13/04 ,  H01R12/71 ,  H01R13/40 ,  H01R13/428 ,  H01R43/16 ,  H01R43/20 ,  H01R9/09

CPC分类号： H01R43/16 ,  H01R12/57 ,  H01R12/721 ,  H01R13/40 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

摘要： A pin contact of a connector and a method of fabricating the pin contact which enables a substantial decrease of manufacturing cost, and smooth installation of the pin connector without a change in the pitch of arrangement at the time of press-fitting into a pin housing. A flat metal sheet undergoes blanking and pressing to form a narrow piece including a strip portion of decreased area of a fracture. Then an approximately L-shaped connecting portion is bent at right angles to raise the narrow piece sideways. Thereafter the strip portion of the narrow piece is pressed along the direction of rising, to thereby form an approximately cylindrical contact section. A raised piece at the rear of the contact section is provided with a locking section which faces approximately at right angles with the direction of arrangement.

摘要翻译： 连接器的销触点和制造销触头的方法，其能够显着降低制造成本，并且平滑地安装销连接器，而不会在压配合到销壳体中时布置的间距变化。 平板金属板经受冲压和压制以形成包括断裂面积减小的带状部分的窄片。 然后将大致L形的连接部弯曲成直角，使窄片横向升高。 此后，窄片的条带部分沿着上升方向被按压，从而形成大致圆筒形的接触部分。 在接触部分的后部处的凸起部件设置有与安排方向大致成直角的锁定部。

公开(公告)号：US08535623B2

公开(公告)日：2013-09-17

申请号：US12762510

申请日：2010-04-19

申请人： Hidehiro Nakamura

发明人： Hidehiro Nakamura

IPC分类号： B01L99/00 ,  H01R13/15

CPC分类号： H05K13/00 ,  G01D1/00 ,  G01D15/00 ,  H05K1/028 ,  H05K1/118 ,  H05K3/3447 ,  H05K3/365 ,  H05K3/4602 ,  H05K3/4635 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/09127 ,  H05K2201/09163 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2203/061 ,  H05K2203/167

摘要： A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and a cut portion; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region.

摘要翻译： 一种制造凹形连接器基板的方法包括：准备具有将板状连接器引导到连接位置和切割部分的引导/保持区域的引导基板的步骤; 在导向基板的两个表面上布置和对准两个布线基板，每个布线基板具有布线和与布线电连接的通孔连接部分，并且将粘合剂施加到引导基板的预定区域以键合 布线基板到引导基板; 将布线基板的一部分朝向引导基板的切断部的内侧弯曲并使配置在弯曲部的布线与切断部的内部压力接触的步骤; 以及去除切割部分内的部分以形成引导/保持区域的步骤。

公开(公告)号：US20100136803A1

公开(公告)日：2010-06-03

申请号：US12573979

申请日：2009-10-06

申请人： Hidehiro NAKAMURA

发明人： Hidehiro NAKAMURA

IPC分类号： H01R12/00 ,  B32B37/12

CPC分类号： H05K1/142 ,  H05K1/147 ,  H05K3/365 ,  H05K2201/09781 ,  H05K2201/10681 ,  Y10T156/10

摘要： There is provided a wiring board insertion connector having only a small restriction on the structure of a wiring board to be inserted to the connector, having high connection reliability such as high durability against repetitive insertion and pullout, and having a relatively simple structure.The wiring board insertion connector includes: a first substrate; a second substrate; a spacer layer that is located between the first substrate and the second substrate; and openings for accommodating a wiring board at predetermined positions in the spacer layer. The first substrate has a wiring layer, a deformable layer, a rigid layer, and a resin layer formed in this order from the side of the spacer layer. The rigid layer has window portions formed at the regions corresponding to the openings, when seen from a thickness direction of the connector. The wiring layer extends at least to the regions corresponding to the window portions when seen from the thickness direction of the connector, the wiring layer protruding toward opening regions at the window portions.

摘要翻译： 提供了一种布线板插入连接器，其对插入连接器的布线板的结构只有很小的限制，具有高的连续可靠性，例如对重复插入和拔出的高耐久性，并且具有相对简单的结构。 布线板插入连接器包括：第一基板; 第二基板; 位于所述第一基板和所述第二基板之间的间隔层; 以及用于将布线板容纳在间隔层中的预定位置的开口。 第一基板具有布线层，可变形层，刚性层和从间隔层的侧面依次形成的树脂层。 当从连接器的厚度方向看时，刚性层具有形成在与开口对应的区域处的窗口部分。 当从连接器的厚度方向看时，布线层至少延伸到对应于窗口部分的区域，布线层朝窗口部分的开口区域突出。

公开(公告)号：US6133534A

公开(公告)日：2000-10-17

申请号：US234215

申请日：1994-04-27

申请人： Naoki Fukutomi ,  Hidehiro Nakamura ,  Hajime Nakayama ,  Yoshiaki Tsubomatsu ,  Masanori Nakamura ,  Kouichi Kaitou ,  Atsushi Kuwano ,  Itsuo Watanabe ,  Masahiko Itabashi

发明人： Naoki Fukutomi ,  Hidehiro Nakamura ,  Hajime Nakayama ,  Yoshiaki Tsubomatsu ,  Masanori Nakamura ,  Kouichi Kaitou ,  Atsushi Kuwano ,  Itsuo Watanabe ,  Masahiko Itabashi

IPC分类号： G01R1/073 ,  H05K3/04 ,  H05K3/06 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  H05K1/09

CPC分类号： G01R1/07314 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4647 ,  H05K3/4658 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0367 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1476 ,  H05K3/04 ,  H05K3/062 ,  H05K3/20 ,  H05K3/4652 ,  Y10S439/931

摘要： A wiring board for electrical tests; having an insulating substrate, wiring of predetermined pattern which is embedded in the insulating substrate, and bump electrodes which are formed on the wiring and which are respectively brought into contact with corresponding electrodes of an article to-be-tested. Thus, even when the electrode pitch of the article to-be-tested such as a semiconductor device has become smaller(for example, less than 0.1 [mm]), the electrodes can be formed so as to cope with the electrical tests of the article.

摘要翻译： 用于电气测试的接线板; 具有绝缘基板，嵌入在绝缘基板中的预定图案的布线以及形成在布线上并且分别与要测试的物品的相应电极接触的突起电极。 因此，即使当诸如半导体器件的待测试物品的电极间距变得更小（例如，小于0.1 [mm]）时，也可以形成电极，以便应对电气测试 文章。