公开(公告)号：US06638631B2

公开(公告)日：2003-10-28

申请号：US10188961

申请日：2002-07-05

申请人： Yuichi Satsu ,  Morimichi Umino ,  Takumi Ueno ,  Akio Takahashi ,  Akira Nagai ,  Toshiya Satoh ,  Shinji Yamada ,  Kazuhiro Suzuki

发明人： Yuichi Satsu ,  Morimichi Umino ,  Takumi Ueno ,  Akio Takahashi ,  Akira Nagai ,  Toshiya Satoh ,  Shinji Yamada ,  Kazuhiro Suzuki

IPC分类号： B32B904

CPC分类号： H01L24/10 ,  C08L79/08 ,  C08L83/10 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/49894 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/351 ,  H05K1/0271 ,  Y10T428/31663 ,  C08L83/00 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same. The present invention also provides a thermal stable low elastic modulus resin composition obtained by heat-curing a mixture containing a polyimide, polyamide-imide or polyamide resin or resin precursor, whose cured product has an elastic modulus measured at −50° C. of 2-0.01 GPa, and an oligomer of an organosilicon compound having a functional group capable of causing addition reaction with an NH and/or COOH group.

公开(公告)号：US06638352B2

公开(公告)日：2003-10-28

申请号：US10097664

申请日：2002-03-15

申请人： Yuichi Satsu ,  Morimichi Umino ,  Takumi Ueno ,  Akio Takahashi ,  Akira Nagai ,  Toshiya Satoh ,  Shinji Yamada ,  Kazuhiro Suzuki

发明人： Yuichi Satsu ,  Morimichi Umino ,  Takumi Ueno ,  Akio Takahashi ,  Akira Nagai ,  Toshiya Satoh ,  Shinji Yamada ,  Kazuhiro Suzuki

IPC分类号： C08L8300

CPC分类号： H01L24/10 ,  C08L79/08 ,  C08L83/10 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/49894 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/351 ,  H05K1/0271 ,  Y10T428/31663 ,  C08L83/00 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same. The present invention also provides a thermal stable low elastic modulus resin composition obtained by heat-curing a mixture containing a polyimide, polyamide-imide or polyamide resin or resin precursor, whose cured product has an elastic modulus measured at −50° C. of 2-0.01 GPa, and an oligomer of an organosilicon compound having a functional group capable of causing addition reaction with an NH and/or COOH group.

摘要翻译： 本发明提供一种热稳定性低的弹性模量材料，它具有高的热稳定性，在-50℃至300℃的温度范围内的动态特性如热膨胀系数和弹性模量的变化很小，具有 在室温下为2-0.01GPa的弹性模量，并且电绝缘的可靠性高，而不管温度波动如何，并且提供了使用其的半导体器件。本发明还提供一种通过热量获得的热稳定性低弹性模量树脂组合物 固化含有聚酰亚胺，聚酰胺 - 酰亚胺或聚酰胺树脂或树脂前体的混合物，其固化产物在-50℃下测量的2-0.01GPa的弹性模量和具有官能团的有机硅化合物的低聚物 引起与NH和/或COOH基团的加成反应。

公开(公告)号：US07193009B2

公开(公告)日：2007-03-20

申请号：US10434118

申请日：2003-05-09

申请人： Satoru Amou ,  Akira Nagai ,  Shinji Yamada ,  Takao Ishikawa ,  Akio Takahashi

发明人： Satoru Amou ,  Akira Nagai ,  Shinji Yamada ,  Takao Ishikawa ,  Akio Takahashi

IPC分类号： C08L9/00

CPC分类号： H01L23/49894 ,  C08K3/01 ,  H01B3/441 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H03B5/18 ,  H05K1/024 ,  H05K3/4676 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2224/0401

摘要： An electronic device for high frequency signals having a small dielectric loss and a high efficiency is provided, in which a low dielectric loss tangent resin composition is used, for coping with high frequency signals, as an insulating layer. The electronic device is fabricated using an insulating layer containing a crosslinked structure of a crosslinking ingredient represented by the following general formula (I): (where R represents a hydrocarbon skeleton, R1, which may be identical or different from each other, represents a hydrogen atom or a hydrocarbon group of 1 to 20 carbon atoms, R2, R3 and R4, which may be identical or different from each other, each represents a hydrogen atom or a hydrocarbon group of 1 to 6 carbon atoms, m is an integer of 1 to 4 and n is an integer of 2 or greater).

摘要翻译： 提供一种低介电损耗角正切树脂组合物作为绝缘层用于应对高频信号的具有小介电损耗和高效率的高频信号的电子装置。 电子器件使用含有交联成分的交联结构的绝缘层制造，所述交联结构由以下通式（I）表示：（其中R表示烃骨架，R 1可以相同或相同） 彼此不同，表示氢原子或1-20个碳原子的烃基，R 2，R 3和R 4， 各自表示氢原子或碳原子数为1〜6的烃基，m为1〜4的整数，n为2以上的整数）。

公开(公告)号：US20050020781A1

公开(公告)日：2005-01-27

申请号：US10785978

申请日：2004-02-26

申请人： Masatoshi Sugimasa ,  Akira Nagai ,  Shinji Yamada ,  Satoru Amou

发明人： Masatoshi Sugimasa ,  Akira Nagai ,  Shinji Yamada ,  Satoru Amou

IPC分类号： B32B15/082 ,  B32B15/08 ,  C08F279/02 ,  C08F283/08 ,  C08F287/00 ,  C08L9/06 ,  C08L25/02 ,  C08L101/00 ,  H05K1/03 ,  C08F10/00

CPC分类号： C08F283/08 ,  C08F279/02 ,  C08F287/00 ,  H05K1/032 ,  H05K1/0353 ,  C08F212/34

摘要： There is provided a resin composition suitable for insulating materials for use in electronic parts for handling high frequency signals, low in dielectric constant and low in dielectric dissipation factor, capable of forming thin film by low temperature curing, excellent in the adhesiveness to conductive foil and excellent in flexibility; a cured product derived from the composition; and a film substrate and an electronic part using the composition. A resin composition, low in dielectric dissipation factor, comprising: a crosslinking component having a weight averaged molecular weight of 1,000 or less and a plurality of styrene groups represented by the following general formula: wherein R represents a hydrocarbon moiety; each R1, which may be the same or different, represents a hydrogen atom or a C1-20 hydrocarbon group; R2, R3 and R4, which may be the same or different, represent a hydrogen atom or a C1-6 alkyl group; and m is an integer of 1 to 4, and n is an integer of 2 or more; and a rubber component having a weight averaged molecular weight of 5,000 or more and styrene units; a cured product; and a film substrate and an electronic part using the composition.

摘要翻译： 提供一种适用于电子部件用绝缘材料的树脂组合物，用于处理高频信号，介电常数低，介电损耗因数低，能够通过低温固化形成薄膜，对导电箔的粘合性优异， 优良的灵活性; 衍生自组合物的固化产物; 以及使用该组合物的薄膜基板和电子部件。 一种低介电损耗因子的树脂组合物，其包含：重均分子量为1,000以下的交联组分和由以下通式表示的多个苯乙烯基团：其中R表示烃部分; 每个R 1可以相同或不同，表示氢原子或C1-20烃基; R 2，R 3和R 4可以相同或不同，表示氢原子或C 1-6烷基; m为1〜4的整数，n为2以上的整数。 和重均分子量为5000以上的橡胶成分和苯乙烯单元; 固化产品; 以及使用该组合物的薄膜基板和电子部件。

公开(公告)号：US07112627B2

公开(公告)日：2006-09-26

申请号：US10385720

申请日：2003-03-12

申请人： Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Akira Nagai ,  Masatoshi Sugimasa

发明人： Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Akira Nagai ,  Masatoshi Sugimasa

IPC分类号： C08L9/00

CPC分类号： H05K1/032 ,  Y10T428/31721 ,  Y10T428/31855 ,  Y10T428/31909 ,  Y10T442/2861 ,  Y10T442/3854 ,  Y10T442/3862 ,  Y10T442/3886 ,  Y10T442/3902 ,  Y10T442/3911 ,  Y10T442/678

摘要： A curing low dielectric loss tangent film using a low dielectric loss tangent composition containing a polyfunctional styrene compound having excellent dielectric characteristics, and a wiring film using the same as an insulating layer are provided. The low dielectric loss tangent film contains a high molecular weight material and a crosslinking ingredient with a weight average molecular weight of 1000 or less having a plurality of styrene groups shown by the following general formula: (where R represents a hydrocarbon skeleton, R1, which may be identical or different with each other, represents a hydrogen atom or a hydrocarbon group of 1 to 20 carbon atoms, R2, R3 and R4, which may be identical or different with each other, each represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, m represents an integer of 1 to 4, and n represents an integer of 2 or greater).

摘要翻译： 提供了使用包含具有优异介电特性的多官能苯乙烯化合物的低介电损耗角正切组合物的固化低介电损耗角正切薄膜和使用其的绝缘层的布线膜。 低介电损耗角正切膜含有高分子量材料和重均分子量为1000以下的具有多个苯乙烯基团的交联成分，所述苯乙烯基团由以下通式表示：（其中R表示烃骨架，R ^{1可以相同或不同，表示氢原子或1-20个碳原子的烃基，R 2，R 3 O， 和R 4彼此可以相同或不同，各自表示氢原子或1〜6个碳原子的烷基，m表示1〜4的整数，n表示 2以上的整数）。}

公开(公告)号：US06855952B2

公开(公告)日：2005-02-15

申请号：US10400647

申请日：2003-03-28

申请人： Akira Nagai ,  Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Hiroshi Nakano

发明人： Akira Nagai ,  Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Hiroshi Nakano

IPC分类号： C08K5/01 ,  C08L101/00 ,  H01L21/312 ,  H01L23/31 ,  H01L23/36 ,  H01L23/532 ,  B32B27/00 ,  H01L35/24

CPC分类号： H01L23/3114 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T428/12528 ,  Y10T428/24917 ,  Y10T428/249958 ,  Y10T428/249988 ,  Y10T428/249991 ,  Y10T428/249993 ,  Y10T428/31855 ,  Y10T428/31931 ,  H01L2924/00

摘要： A semiconductor device wherein a resin containing as a cross-linking component a compound having a plurality of styrene group and represented by chemical formula [1] is used as an insulating material: where R is a hydrocarbon structure which may have a substituent group or groups, R1 is hydrogen, methyl, or ethyl, m is and integer of 1 to 4, and n is an integer of not less than 2. With this, a semiconductor device and a semiconductor package which show excellent transmission characteristics and less power consumption are provided.

摘要翻译： 使用含有作为交联成分的具有多个苯乙烯基并由化学式[1]表示的化合物的树脂作为绝缘材料的半导体器件：其中R为可具有取代基或烃基的烃结构 R 1为氢，甲基或乙基，m为1〜4的整数，n为2以上的整数。由此，具有优异的透射特性和较少的半导体器件和半导体封装 提供功耗。

公开(公告)号：US20050029515A1

公开(公告)日：2005-02-10

申请号：US10912108

申请日：2004-08-06

申请人： Akira Nagai ,  Toshiyuki Ohno ,  Fusao Hojo ,  Shinji Yamada ,  Mikio Konno ,  Yomokazu Tanase ,  Daisuke Naga

发明人： Akira Nagai ,  Toshiyuki Ohno ,  Fusao Hojo ,  Shinji Yamada ,  Mikio Konno ,  Yomokazu Tanase ,  Daisuke Naga

IPC分类号： C01G23/00 ,  C01G23/053 ,  C08K7/18 ,  C08L101/00 ,  H01B3/00 ,  H01G4/20 ,  H01G4/33 ,  H01L35/24 ,  H05K1/16 ,  H05K3/46

CPC分类号： H05K1/162 ,  H01G4/206 ,  H05K3/4611 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0355 ,  H05K2201/09309

摘要： An organic/inorganic oxide mixture has high capacitance density so as to realize a capacitor material that can be self-contained in a substrate. The mixture film made of inorganic oxide particle has a mean particle size of less than 90 nm dispersed in organic polymer, of which relative dielectric constant is more than 10 and thickness is less than 900 nm.

摘要翻译： 有机/无机氧化物混合物具有高的电容密度，以便实现可以独立于衬底中的电容器材料。 由无机氧化物颗粒制成的混合物膜具有分散在有机聚合物中的小于90nm的平均粒度，其相对介电常数大于10，厚度小于900nm。

公开(公告)号：US09130127B2

公开(公告)日：2015-09-08

申请号：US13204082

申请日：2011-08-05

申请人： Hiroshi Katsuno ,  Yasuo Ohba ,  Satoshi Mitsugi ,  Shinji Yamada ,  Mitsuhiro Kushibe ,  Kei Kaneko

发明人： Hiroshi Katsuno ,  Yasuo Ohba ,  Satoshi Mitsugi ,  Shinji Yamada ,  Mitsuhiro Kushibe ,  Kei Kaneko

IPC分类号： H01L33/38 ,  H01L33/22

CPC分类号： H01L33/382 ,  H01L33/20 ,  H01L33/22 ,  H01L33/32 ,  H01L33/385 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0091 ,  H01L2924/00014

摘要： According to one embodiment, a semiconductor light emitting device includes a stacked structure body, first and second electrodes. The stacked structure body includes first and second semiconductor layers and a light emitting layer provided between the second and first semiconductor layers, and has first and second major surfaces. The first electrode has a first contact part coming into contact with the first semiconductor layer. The second electrode has a part coming into contact with the second semiconductor layer. A surface of the first semiconductor layer on a side of the first major surface has a first part having a part overlapping a contact surface with the first semiconductor layer and a second part having a part overlapping the second semiconductor layer. The second part has irregularity. A pitch of the irregularity is longer than a peak wavelength of emission light. The first part has smaller irregularity than the second part.

摘要翻译： 根据一个实施例，半导体发光器件包括堆叠结构体，第一和第二电极。 叠层结构体包括第一和第二半导体层以及设置在第二和第一半导体层之间的发光层，并且具有第一和第二主表面。 第一电极具有与第一半导体层接触的第一接触部分。 第二电极具有与第二半导体层接触的部分。 第一主表面一侧的第一半导体层的表面具有第一部分，其第一部分具有与第一半导体层的接触表面重叠的部分，第二部分具有与第二半导体层重叠的部分。 第二部分是不规律的。 不规则的间距比发光的峰值波长长。 第一部分具有比第二部分更小的不规则性。

公开(公告)号：US08770671B2

公开(公告)日：2014-07-08

申请号：US13326476

申请日：2011-12-15

申请人： Yoshiyuki Nyunoya ,  Shinji Yamada

发明人： Yoshiyuki Nyunoya ,  Shinji Yamada

IPC分类号： B60B3/04

CPC分类号： B60B3/007 ,  B60B3/04 ,  B60B2310/206 ,  B60B2360/102 ,  B60B2900/311 ,  B60Y2200/11

摘要： An automotive wheel includes a wheel disc in which a hat section is provided outside a hub mounting section. A hat inner inclined surrounding section of the hat section includes an inner convex surrounding section protruding to a surface side in a curved shape, and an inner lower concave surrounding section continuously formed with an inner peripheral edge of the inner convex surrounding section, continuously formed with an outer peripheral edge of a hub surface rounded section, and protruding to the back side in a curved shape.

摘要翻译： 汽车车轮包括车轮盘，其中帽部分设置在轮毂安装部分的外侧。 帽部的帽内侧倾斜周边部包括以弯曲形状突出到表面侧的内部凸起周围部分和连续形成有内部凸起周边部分的内周边缘的内部下部凹形周边部分，连续形成有 毂表面圆形部分的外周边缘，并且以弯曲的形状突出到后侧。

公开(公告)号：US08729583B2

公开(公告)日：2014-05-20

申请号：US12873670

申请日：2010-09-01

申请人： Hiroshi Katsuno ,  Yasuo Ohba ,  Mitsuhiro Kushibe ,  Kei Kaneko ,  Shinji Yamada

发明人： Hiroshi Katsuno ,  Yasuo Ohba ,  Mitsuhiro Kushibe ,  Kei Kaneko ,  Shinji Yamada

IPC分类号： H01L33/22

CPC分类号： H01L33/382 ,  H01L33/22 ,  H01L33/405 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/00014

摘要： According to one embodiment, a semiconductor light-emitting device includes a first semiconductor layer, a second semiconductor layer, a light-emitting layer, a third semiconductor layer and a first electrode. The first semiconductor layer of a first conductivity type has a first major surface provided with a first surface asperity. The second semiconductor layer of a second conductivity type is provided on an opposite side of the first semiconductor layer from the first major surface. The light-emitting layer is provided between the first and second semiconductor layers. The first semiconductor layer is disposed between a third semiconductor layer and the light-emitting layer. The third semiconductor layer has an impurity concentration lower than an impurity concentration of the first semiconductor layer, and includes an opening exposing the first surface asperity. The first electrode is in contact with the first surface asperity through the opening, and reflective to emission light emitted from the light-emitting layer.

摘要翻译： 根据一个实施例，半导体发光器件包括第一半导体层，第二半导体层，发光层，第三半导体层和第一电极。 第一导电类型的第一半导体层具有设置有第一表面粗糙度的第一主表面。 第二导电类型的第二半导体层设置在第一半导体层与第一主表面相对的一侧上。 发光层设置在第一和第二半导体层之间。 第一半导体层设置在第三半导体层和发光层之间。 第三半导体层的杂质浓度低于第一半导体层的杂质浓度，并且包括露出第一表面粗糙度的开口。 第一电极通过开口与第一表面凹凸接触，并且反射到从发光层发射的发射光。