公开(公告)号：US5818113A

公开(公告)日：1998-10-06

申请号：US713846

申请日：1996-09-12

申请人： Yuji Iseki ,  Yasushi Shizuki ,  Hiroshi Yamada ,  Takashi Togasaki ,  Kunio Yoshihara

发明人： Yuji Iseki ,  Yasushi Shizuki ,  Hiroshi Yamada ,  Takashi Togasaki ,  Kunio Yoshihara

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/13 ,  H01L24/28 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1423 ,  H01L2924/15151 ,  H01L2924/3011

摘要： A semiconductor device wherein a sealing resin is filled in a space between an interconnecting wiring board and a semiconductor chip after the semiconductor chip is flip chip-mounted on the wiring board in which at least a non-planar region consisting of a through hole, a concave portion or a convex portion, or a region exhibiting poor wettability to the sealing resin is formed on the surface of the wiring board or the semiconductor chip so as to provide a void in the sealed resin filled between the wiring board and the semiconductor chip for the purpose of minimizing any bad influence from the sealing resin on the interconnecting wirings or elements formed on the semiconductor chip.

摘要翻译： 一种半导体器件，其中在半导体芯片倒装芯片安装在布线板上之后，在互连线路板和半导体芯片之间的空间中填充密封树脂，其中至少由通孔， 在该布线板或半导体芯片的表面上形成凹部或凸部，或者对密封树脂具有差的润湿性的区域，以便在填充在布线板和半导体芯片之间的密封树脂中提供空隙 最小化密封树脂对形成在半导体芯片上的互连布线或元件的不良影响的目的。

公开(公告)号：US5914536A

公开(公告)日：1999-06-22

申请号：US678536

申请日：1996-07-05

申请人： Yasushi Shizuki ,  Yuji Iseki ,  Naoko Ono ,  Kunio Yoshihara ,  Masayuki Saito ,  Hiroshi Yamada ,  Kazuki Tateyama

发明人： Yasushi Shizuki ,  Yuji Iseki ,  Naoko Ono ,  Kunio Yoshihara ,  Masayuki Saito ,  Hiroshi Yamada ,  Kazuki Tateyama

IPC分类号： G01R31/04 ,  H01L21/60 ,  H01L21/66 ,  H01L23/485 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H01L23/48

CPC分类号： H01L24/13 ,  G01R31/048 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3452 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/171 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81801 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K1/0203 ,  H05K1/0269 ,  H05K2201/0367 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/0989 ,  H05K2201/10674 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2203/0465 ,  H05K3/3431 ,  H05K3/368 ,  Y02P70/613

摘要： A semiconductor device includes a wiring board having a main surface and a plurality of pad electrodes formed on the main surface, a rectangular semiconductor element having a main surface facing the main surface of the wiring board and mounted on the main surface of the wiring board, a solder resist formed to surround the semiconductor element with a preset distance therefrom on the main surface of the wiring board, a plurality of terminal electrodes formed on the end portion of the main surface of the semiconductor element, and a plurality of solder bumps for electrically connecting the plurality of pad electrodes to the plurality of terminal electrodes with a gap provided between the main surface of the wiring board and the main surface of the semiconductor element, wherein each of the plurality of pad electrodes includes at least a portion which extends from substantially under a corresponding one of the plurality of terminal electrodes of the semiconductor element to the solder resist lying outside the semiconductor element and each of the plurality of solder bumps includes a portion extending over part of a corresponding one of the plurality of pads which lies outside the semiconductor element.

摘要翻译： 半导体器件包括具有主表面和形成在主表面上的多个焊盘电极的布线板，具有面向布线板的主表面的主表面并且安装在布线板的主表面上的矩形半导体元件， 在该布线基板的主面上形成有围绕半导体元件与预定距离的阻焊剂，形成于该半导体元件的主面的端部的多个端子电极和多个用于电连接的焊料凸块 将所述多个焊盘电极连接到所述多个端子电极，所述间隙设置在所述布线板的主表面和所述半导体元件的主表面之间，其中所述多个焊盘电极中的每一个包括至少一部分， 在半导体元件的多个端子电极中的对应的一个到焊料re 位于半导体元件外侧的多个焊料块中的每一个包括在位于半导体元件外部的多个焊盘中相应的一个焊盘的一部分上延伸的部分。

公开(公告)号：US10859932B2

公开(公告)日：2020-12-08

申请号：US15522567

申请日：2015-10-08

申请人： Tsuyoshi Sugimoto ,  Shinya Nakayama ,  Hiroshi Yamada ,  Hideyuki Santo ,  Ryuta Chiba ,  Suzuka Amemori ,  Kohsuke Nagata

发明人： Tsuyoshi Sugimoto ,  Shinya Nakayama ,  Hiroshi Yamada ,  Hideyuki Santo ,  Ryuta Chiba ,  Suzuka Amemori ,  Kohsuke Nagata

IPC分类号： G03G9/087

摘要： A toner, including: a polyester resin, wherein the polyester resin has a structure represented by any one of formulas 1) to 3) below: 1) R1-(NHCONH-R2)n-, 2) R1-(NHCOO-R2)n-, and 3) R1-(OCONH-R2)n-, where n is 3 or more, R1 represents an aromatic organic group or an aliphatic organic group, and R2 represents a group derived from a resin that is polyester formed of polycarboxylic acid, polyol, or both thereof; or that is a modified polyester obtained by modifying polyester with isocyanate.

公开(公告)号：US10303072B2

公开(公告)日：2019-05-28

申请号：US15889461

申请日：2018-02-06

申请人： Akira Tanaka ,  Hiroyuki Takeda ,  Junichi Awamura ,  Hiroshi Yamada ,  Daichi Hisakuni ,  Yasuo Kamada

发明人： Akira Tanaka ,  Hiroyuki Takeda ,  Junichi Awamura ,  Hiroshi Yamada ,  Daichi Hisakuni ,  Yasuo Kamada

IPC分类号： G03G9/087 ,  C08G63/42 ,  C08G63/20 ,  G03G15/00 ,  C08G63/195 ,  C08G63/16 ,  C08G63/66 ,  C08G18/75 ,  C08G18/42

摘要： A toner is provided. The toner contains a polyester resin. The toner has a glass transition temperature (Tg1st) at first temperature rising of differential scanning calorimetry (DSC) of from 45° C. to 65° C. The toner includes a component insoluble in tetrahydrofuran (THF) having two glass transition temperatures (Tga1st and Tgb1st) at the first temperature rising of DSC, where Tga1st is in a range of −45° C. to 5° C. and Tgb1st is in a range of 45° C. to 70° C. The toner includes a component soluble in THF having a glass transition temperature (Tg2nd) at second temperature rising of DSC of from 40° C. to 65° C.

公开(公告)号：US09785074B2

公开(公告)日：2017-10-10

申请号：US15116478

申请日：2015-01-06

申请人： Kohsuke Nagata ,  Shinya Nakayama ,  Tsuyoshi Sugimoto ,  Hiroshi Yamada ,  Susumu Chiba ,  Shinsuke Nagai ,  Suzuka Amemori

发明人： Kohsuke Nagata ,  Shinya Nakayama ,  Tsuyoshi Sugimoto ,  Hiroshi Yamada ,  Susumu Chiba ,  Shinsuke Nagai ,  Suzuka Amemori

IPC分类号： G03G9/08 ,  G03G9/087 ,  C08G63/12 ,  C08G63/133 ,  G03G15/08

CPC分类号： G03G9/08755 ,  C08G63/12 ,  C08G63/133 ,  G03G9/08793 ,  G03G9/08795 ,  G03G9/08797 ,  G03G15/08

摘要： A polyester resin for a toner, the polyester resin including: a segment derived from an alcohol component; and a segment derived from a carboxylic acid component, wherein the alcohol component includes a trivalent or higher aliphatic alcohol, and wherein the polyester resin satisfies Expressions (1) to (3) below: 500 ≤ Weight ⁢ ⁢ average ⁢ ⁢ molecular ⁢ ⁢ weight ⁢ ⁢ ( Mw ) ( Valence ⁢ ⁢ of ⁢ ⁢ the ⁢ ⁢ trivalent ⁢ ⁢ or higher ⁢ ⁢ aliphatic ⁢ ⁢ alcohol ) × ( Amount ⁢ ⁢ of ⁢ ⁢ the ⁢ ⁢ trivalent ⁢ ⁢ or higher ⁢ ⁢ aliphatic ⁢ ⁢ alcohol ) ≤ 4 , 000 ; Expression ⁢ ⁢ ( 1 ) 4,000≦Weight average molecular weight (Mw)≦25,000   Expression (2); and 0.5≦(Amount of the trivalent or higher aliphatic alcohol)≦6.5   Expression (3), where, in the Expressions (1) and (3), the Amount of the trivalent or higher aliphatic alcohol denotes a percent by mole of the trivalent or higher aliphatic alcohol relative to the alcohol component.

公开(公告)号：US09492309B2

公开(公告)日：2016-11-15

申请号：US13582213

申请日：2011-03-01

申请人： Hiroshi Yamada ,  Yosuke Taniguchi ,  Yoshiki Hattori ,  Kenji Hioki ,  Kae Fujiwara

发明人： Hiroshi Yamada ,  Yosuke Taniguchi ,  Yoshiki Hattori ,  Kenji Hioki ,  Kae Fujiwara

IPC分类号： A61F5/56 ,  A61M16/04 ,  A61F2/94

CPC分类号： A61F5/56 ,  A61F2/94 ,  A61M16/0406 ,  A61M16/0461

摘要： A nasal cavity insertion device is provided that includes a tubular main body part, at least one elastically deforming part disposed on the outer peripheral surface of the tubular main body part, and a water soluble holding part. The water soluble holding part holds the elastically deforming part in a diameter-reduced state.

摘要翻译： 提供了一种鼻腔插入装置，其包括管状主体部，设置在管状主体部的外周面上的至少一个弹性变形部和水溶性保持部。 水溶性保持部将弹性变形部保持在直径缩小状态。

公开(公告)号：US09475430B2

公开(公告)日：2016-10-25

申请号：US12907314

申请日：2010-10-19

申请人： Asako Kitaura ,  Seiya Shimizu ,  Hiroshi Yamada

发明人： Asako Kitaura ,  Seiya Shimizu ,  Hiroshi Yamada

IPC分类号： H04N7/18 ,  B60R1/00 ,  G06T5/00 ,  G06T3/40

CPC分类号： B60R1/00 ,  B60K35/00 ,  B60K2350/106 ,  B60R2300/105 ,  B60R2300/602 ,  G06T3/005 ,  G06T3/0056 ,  G06T3/4038 ,  G06T5/006 ,  G06T2207/30252 ,  H04N7/18 ,  H04N7/181

摘要： A vehicle image processing apparatus includes: a group of cameras; a drawing unit that converts a captured image into an image viewed along a line of sight running from a predetermined position in a predetermined direction; a viewing-line-of-sight changing unit that detects whether a first line of sight is switched to a second line of sight; and a viewing-line-of-sight generation/updating unit that acquires parameters concerning the first and second lines of sight after detecting the switching and generates a parameter which is gradually changed from the parameter of the first line of sight to the parameter of the second line of sight. Moreover, the drawing unit generates, on the basis of the gradually changed parameter, an image which is gradually changed from an image viewed along the first line of sight to an image viewed along the second line of sight.

摘要翻译： 车辆图像处理装置包括：一组相机; 绘制单元，其将捕获的图像转换成沿着从预定方向的预定位置运行的视线观察的图像; 观察视线改变单元，其检测第一视线是否切换到第二视线; 以及观察视线生成/更新单元，其在检测到切换之后获取与第一和第二视线有关的参数，并生成从第一视线的参数逐渐变化为参数的参数 第二线视线 此外，绘图单元基于逐渐改变的参数生成从沿着第一视线观看的图像逐渐变为沿着第二视线观看的图像的图像。

公开(公告)号：US09195156B2

公开(公告)日：2015-11-24

申请号：US14143601

申请日：2013-12-30

申请人： Ryota Inoue ,  Yoshihiro Moriya ,  Hiroshi Yamada ,  Tatsuru Moritani ,  Minoru Masuda ,  Akinori Saito ,  Yasutada Shitara ,  Kiyotada Katoh ,  Satoshi Takahashi

发明人： Ryota Inoue ,  Yoshihiro Moriya ,  Hiroshi Yamada ,  Tatsuru Moritani ,  Minoru Masuda ,  Akinori Saito ,  Yasutada Shitara ,  Kiyotada Katoh ,  Satoshi Takahashi

IPC分类号： B01J2/04 ,  B01J2/18 ,  G03G9/08 ,  G03G9/087 ,  G03G9/09

CPC分类号： G03G9/0804 ,  B01J2/04 ,  B01J2/18 ,  G03G9/0802 ,  G03G9/0806 ,  G03G9/0817 ,  G03G9/08755 ,  G03G9/08795 ,  G03G9/08797 ,  G03G9/0904

摘要： A particulate material production method is provided. The particulate material production method includes ejecting a particulate material composition liquid, which includes an organic solvent and a particulate material composition including at least a resin and dissolved or dispersed in the organic solvent, from at least one nozzle to form droplets of the particulate material composition liquid in a gas phase; and solidifying the droplets of the particulate material composition liquid to prepare particles of the particulate material composition. The droplet solidifying step includes contacting the droplets with a poor solvent for the particulate material composition.

摘要翻译： 提供了一种颗粒材料生产方法。 颗粒材料生产方法包括从至少一个喷嘴喷射包括有机溶剂和至少包含树脂并溶解或分散在有机溶剂中的颗粒材料组合物的颗粒材料组合物液体，以形成颗粒材料组合物的液滴 气相中的液体; 并固化颗粒状材料组合物液体的液滴以制备颗粒材料组合物的颗粒。 液滴固化步骤包括使液滴与用于颗粒材料组合物的不良溶剂接触。

公开(公告)号：US09034729B2

公开(公告)日：2015-05-19

申请号：US12438869

申请日：2007-08-22

申请人： Hiroshi Yamada ,  Katsuhiko Kitagawa ,  Kazuo Okada ,  Yuichi Morita ,  Hiroyuki Shinogi ,  Shinzo Ishibe ,  Yoshinori Seki ,  Takashi Noma

发明人： Hiroshi Yamada ,  Katsuhiko Kitagawa ,  Kazuo Okada ,  Yuichi Morita ,  Hiroyuki Shinogi ,  Shinzo Ishibe ,  Yoshinori Seki ,  Takashi Noma

IPC分类号： H01L21/30 ,  H01L27/146 ,  B81C1/00

CPC分类号： H01L27/14618 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2224/13025 ,  H01L2924/00014

摘要： An object of the invention is to provide a smaller semiconductor device of which the manufacturing process is simplified and the manufacturing cost is reduced and a method of manufacturing the same. Furthermore, an object of the invention is to provide a semiconductor device having a cavity. A first supporting body 5 having a penetration hole 6 penetrating it from the front surface to the back surface is attached to a front surface of a semiconductor substrate 2 with an adhesive layer 4 being interposed therebetween. A device element 1 and wiring layers 3 are formed on the front surface of the semiconductor substrate 2. A second supporting body 7 is attached to the first supporting body 5 with an adhesive layer 8 being interposed therebetween so as to cover the penetration hole 6. The device element 1 is sealed in a cavity 9 surrounded by the semiconductor substrate 2, the first supporting body 5 and the second supporting body 7.

摘要翻译： 本发明的目的是提供一种较小的半导体器件，其制造工艺简化并且制造成本降低，并且制造该半导体器件的方法。 此外，本发明的目的是提供一种具有空腔的半导体器件。 具有穿透孔6的从前表面到后表面穿透的第一支撑体5被粘附在半导体衬底2的前表面上，其间插入有粘合剂层4。 器件元件1和布线层3形成在半导体衬底2的前表面上。第二支撑体7被安装在第一支撑体5上，其中夹有粘合剂层8以覆盖穿透孔6。 器件元件1被密封在由半导体衬底2，第一支撑体5和第二支撑体7包围的空腔9中。

公开(公告)号：US08849625B2

公开(公告)日：2014-09-30

申请号：US13367837

申请日：2012-02-07

申请人： Takuro Ikeda ,  Eiji Kitagawa ,  Hiroshi Yamada

发明人： Takuro Ikeda ,  Eiji Kitagawa ,  Hiroshi Yamada

IPC分类号： G06F17/50 ,  G08G1/01

CPC分类号： G06F17/5009 ,  G06F17/5068 ,  G06F17/5095 ,  G08G1/0125

摘要： A simulator used in a distributed process simulation includes: a storage unit configured to store map information, agent information, and area allocation information; a simulation execution unit; a condition determination unit configured to determine the condition of the reference agent to be referenced by the simulation execution unit based on a movement state of the agent; an allocation discrimination unit configured to discriminate another computer allocated an area in which the reference agent corresponding to the condition can be located; and an agent information acquisition unit configured to acquire the information about the agent satisfying the condition of the reference agent from the other discriminated computer.

摘要翻译： 在分布式处理仿真中使用的模拟器包括：存储单元，被配置为存储地图信息，代理信息和区域分配信息; 模拟执行单元; 条件确定单元，被配置为基于所述代理的移动状态来确定由所述模拟执行单元引用的参考代理的状态; 分配鉴别单元，被配置为区分分配了与条件相对应的参考代理可以位于其中的区域的另一计算机; 以及代理信息获取单元，被配置为从另一个判别计算机获取关于所述参考代理的条件的代理的信息。