公开(公告)号：US5818113A

公开(公告)日：1998-10-06

申请号：US713846

申请日：1996-09-12

申请人： Yuji Iseki ,  Yasushi Shizuki ,  Hiroshi Yamada ,  Takashi Togasaki ,  Kunio Yoshihara

发明人： Yuji Iseki ,  Yasushi Shizuki ,  Hiroshi Yamada ,  Takashi Togasaki ,  Kunio Yoshihara

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/13 ,  H01L24/28 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1423 ,  H01L2924/15151 ,  H01L2924/3011

摘要： A semiconductor device wherein a sealing resin is filled in a space between an interconnecting wiring board and a semiconductor chip after the semiconductor chip is flip chip-mounted on the wiring board in which at least a non-planar region consisting of a through hole, a concave portion or a convex portion, or a region exhibiting poor wettability to the sealing resin is formed on the surface of the wiring board or the semiconductor chip so as to provide a void in the sealed resin filled between the wiring board and the semiconductor chip for the purpose of minimizing any bad influence from the sealing resin on the interconnecting wirings or elements formed on the semiconductor chip.

摘要翻译： 一种半导体器件，其中在半导体芯片倒装芯片安装在布线板上之后，在互连线路板和半导体芯片之间的空间中填充密封树脂，其中至少由通孔， 在该布线板或半导体芯片的表面上形成凹部或凸部，或者对密封树脂具有差的润湿性的区域，以便在填充在布线板和半导体芯片之间的密封树脂中提供空隙 最小化密封树脂对形成在半导体芯片上的互连布线或元件的不良影响的目的。

公开(公告)号：US5914536A

公开(公告)日：1999-06-22

申请号：US678536

申请日：1996-07-05

申请人： Yasushi Shizuki ,  Yuji Iseki ,  Naoko Ono ,  Kunio Yoshihara ,  Masayuki Saito ,  Hiroshi Yamada ,  Kazuki Tateyama

发明人： Yasushi Shizuki ,  Yuji Iseki ,  Naoko Ono ,  Kunio Yoshihara ,  Masayuki Saito ,  Hiroshi Yamada ,  Kazuki Tateyama

IPC分类号： G01R31/04 ,  H01L21/60 ,  H01L21/66 ,  H01L23/485 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H01L23/48

CPC分类号： H01L24/13 ,  G01R31/048 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3452 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/171 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81801 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K1/0203 ,  H05K1/0269 ,  H05K2201/0367 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/0989 ,  H05K2201/10674 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2203/0465 ,  H05K3/3431 ,  H05K3/368 ,  Y02P70/613

摘要： A semiconductor device includes a wiring board having a main surface and a plurality of pad electrodes formed on the main surface, a rectangular semiconductor element having a main surface facing the main surface of the wiring board and mounted on the main surface of the wiring board, a solder resist formed to surround the semiconductor element with a preset distance therefrom on the main surface of the wiring board, a plurality of terminal electrodes formed on the end portion of the main surface of the semiconductor element, and a plurality of solder bumps for electrically connecting the plurality of pad electrodes to the plurality of terminal electrodes with a gap provided between the main surface of the wiring board and the main surface of the semiconductor element, wherein each of the plurality of pad electrodes includes at least a portion which extends from substantially under a corresponding one of the plurality of terminal electrodes of the semiconductor element to the solder resist lying outside the semiconductor element and each of the plurality of solder bumps includes a portion extending over part of a corresponding one of the plurality of pads which lies outside the semiconductor element.

摘要翻译： 半导体器件包括具有主表面和形成在主表面上的多个焊盘电极的布线板，具有面向布线板的主表面的主表面并且安装在布线板的主表面上的矩形半导体元件， 在该布线基板的主面上形成有围绕半导体元件与预定距离的阻焊剂，形成于该半导体元件的主面的端部的多个端子电极和多个用于电连接的焊料凸块 将所述多个焊盘电极连接到所述多个端子电极，所述间隙设置在所述布线板的主表面和所述半导体元件的主表面之间，其中所述多个焊盘电极中的每一个包括至少一部分， 在半导体元件的多个端子电极中的对应的一个到焊料re 位于半导体元件外侧的多个焊料块中的每一个包括在位于半导体元件外部的多个焊盘中相应的一个焊盘的一部分上延伸的部分。

公开(公告)号：US5898909A

公开(公告)日：1999-04-27

申请号：US720379

申请日：1996-09-27

申请人： Kunio Yoshihara ,  Kouhei Morizuka ,  Mitsuo Konno ,  Yasuo Ashizawa ,  Junko Akagi ,  Yasuhiro Kuriyama ,  Motoyasu Morinaga ,  Eiji Takagi ,  Yasushi Shizuki ,  Yuji Iseki ,  Takeshi Hanawa ,  Takeshi Miyagi

发明人： Kunio Yoshihara ,  Kouhei Morizuka ,  Mitsuo Konno ,  Yasuo Ashizawa ,  Junko Akagi ,  Yasuhiro Kuriyama ,  Motoyasu Morinaga ,  Eiji Takagi ,  Yasushi Shizuki ,  Yuji Iseki ,  Takeshi Hanawa ,  Takeshi Miyagi

IPC分类号： H01L25/00 ,  H01L23/552 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01P5/08 ,  H01P7/06 ,  H01P7/10 ,  H01Q23/00 ,  H03D7/00 ,  H04B1/38 ,  H04B1/44

CPC分类号： H03D7/00 ,  H01L23/552 ,  H01Q23/00 ,  H04B1/408 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4823 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025

摘要： Disclosed is an ultra high frequency radio communication apparatus having: a receiver antenna; a transmitter antenna; an IC chip being electrically connected to the receiver antenna and the transmitter antenna; a substrate on which the receiver antenna, the transmitter antenna and the IC chip are mounted; an input terminal for inputting to the IC chip a base band input signal; an output terminal for outputting a base band output signal from the IC chip; and a control signal terminal for inputting a control signal for controlling the IC chip to the IC chip. The IC chip is placed in a shielding space such that the cut-off frequency of the shielding space is higher than the frequency of a carrier signal for radio communication.

摘要翻译： 公开了一种超高频无线通信装置，具有：接收天线; 发射天线; IC芯片电连接到接收机天线和发射机天线; 其上安装有接收天线，发射机天线和IC芯片的基板; 输入端子，用于向IC芯片输入基带输入信号; 输出端子，用于从IC芯片输出基带输出信号; 以及用于输入用于将IC芯片控制到IC芯片的控制信号的控制信号端子。 IC芯片被放置在屏蔽空间中，使得屏蔽空间的截止频率高于用于无线电通信的载波信号的频率。

公开(公告)号：US5764119A

公开(公告)日：1998-06-09

申请号：US725167

申请日：1996-10-03

申请人： Takeshi Miyagi ,  Yuji Iseki ,  Yasushi Shizuki ,  Kunio Yoshihara ,  Masayuki Saito ,  Kazuhito Higuchi ,  Takeshi Hanawa ,  Eiji Takagi

发明人： Takeshi Miyagi ,  Yuji Iseki ,  Yasushi Shizuki ,  Kunio Yoshihara ,  Masayuki Saito ,  Kazuhito Higuchi ,  Takeshi Hanawa ,  Eiji Takagi

IPC分类号： H01P3/08 ,  H05K1/02 ,  H05K1/14 ,  H05K3/04 ,  H05K3/10 ,  H05K3/46

CPC分类号： H05K3/045 ,  H01P3/088 ,  H05K1/0242 ,  H05K1/144 ,  H05K2201/09036 ,  H05K2201/098 ,  H05K3/107 ,  H05K3/465

摘要： A wiring board for high-frequency signals, which comprises, a substrate, a dielectric layer formed on the substrate and provided on its surface with a U-shaped groove having an arcuate bottom for forming a wiring therein, and a signal wiring formed in the U-shaped groove, which is featured in that an upper end portion of the signal wiring is protruded out of the surface of the dielectric layer. A distance (H) from a protruded top surface of the signal wiring to a bottom of the U-shaped groove and a width (W) of the U-shaped groove preferably meet a relationship of 2

摘要翻译： 一种高频信号用布线基板，其特征在于，包括：基板，形成在所述基板上的电介质层，其表面上形成有用于在其中形成布线的弓形底部的U形槽，以及形成在所述基板上的信号布线 U形槽的特征在于，信号线的上端部突出到电介质层的表面之外。 从信号线的突出顶面到U形槽的底部的距离（H）和U形槽的宽度（W）优选满足2 <（W / H）<50的关系， 并且从电介质层的表面突出的信号布线的部分的高度优选在10nm至10μm的范围内。

公开(公告)号：US06263193B1

公开(公告)日：2001-07-17

申请号：US09044911

申请日：1998-03-20

申请人： Yuji Iseki ,  Keiichi Yamaguchi ,  Mitsuo Konno

发明人： Yuji Iseki ,  Keiichi Yamaguchi ,  Mitsuo Konno

IPC分类号： H04B138

CPC分类号： H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/15155 ,  H01L2924/1616 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q21/0025 ,  H01Q23/00 ,  H04B1/38 ,  H01L2924/00014

摘要： A microwave transmitter/receiver module has a package that includes a high-frequency circuit board and an electromagnetically narrowed space. A semiconductor chip is mounted on the circuit board and is contained in the electromagnetically narrowed space. The electromagnetically narrowed space has a cutoff frequency that is higher than a carrier frequency for microwave communication. A receiver antenna pattern is formed on the top surface of the package and is electromagnetically connected to the semiconductor chip through a first slot. A transmitter antenna pattern is formed on the top surface of the package at a different position from the receiver antenna pattern and is electromagnetically connected to the semiconductor chip through a second slot. Since the antenna patterns are on the top surface of the package, the proper performance thereof is secured and the package is compact.

摘要翻译： 微波发射器/接收器模块具有包括高频电路板和电磁狭窄空间的封装。 半导体芯片安装在电路板上并被包含在电磁变窄的空间中。 电磁变窄的空间具有高于微波通信的载波频率的截止频率。 接收器天线图案形成在封装的顶表面上，并且通过第一槽与半导体芯片电磁连接。 发射器天线图案在与接收器天线图案不同的位置处形成在封装的顶表面上，并且通过第二槽电磁连接到半导体芯片。 由于天线图案位于封装的顶表面上，因此确保其适当的性能并且封装是紧凑的。

公开(公告)号：US20050261036A1

公开(公告)日：2005-11-24

申请号：US11183009

申请日：2005-07-18

申请人： Shu-ichi Sekine ,  Takayoshi Itoh ,  Yuji Iseki ,  Naoko Ono ,  Keiichi Yamaguchi ,  Hiroyuki Kayano ,  Akihiro Tsujimura ,  Kazuhiro Inoue ,  Noriaki Odachi ,  Yasushi Murakami

发明人： Shu-ichi Sekine ,  Takayoshi Itoh ,  Yuji Iseki ,  Naoko Ono ,  Keiichi Yamaguchi ,  Hiroyuki Kayano ,  Akihiro Tsujimura ,  Kazuhiro Inoue ,  Noriaki Odachi ,  Yasushi Murakami

IPC分类号： H01Q1/24 ,  H03H7/40 ,  H04B1/04 ,  H04B1/46

CPC分类号： H03H7/40 ,  H01Q1/242 ,  H04B1/0458

摘要： In a radio equipment of portable type, the impedance of an antenna is optimized by adjusting a matching circuit which has the adjustment function and is connected to an antenna, based on a reflection phase sent back from the antenna, outputted from a reflection phase detector, and a current supplied to a transmitter-receiver which generates a transmitting signal.

公开(公告)号：US5631809A

公开(公告)日：1997-05-20

申请号：US305397

申请日：1994-09-13

申请人： Eiji Takagi ,  Yuji Iseki ,  Naoko Ono

发明人： Eiji Takagi ,  Yuji Iseki ,  Naoko Ono

IPC分类号： H01L23/04 ,  H01L23/02 ,  H01L23/08 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/66 ,  H05K9/00 ,  H01L23/043 ,  H01L23/552 ,  H05K7/02

CPC分类号： H01L23/3107 ,  H01L23/49562 ,  H01L23/66 ,  H01L24/49 ,  H01L2223/6644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025

摘要： A semiconductor device comprising a semiconductor chip, a sheet-like metal member electrically connected to a major surface of the semiconductor chip and serving as a ground electrode for the chip, and input/output electrodes electrically connected to the semiconductor chip and situated in the same plane as that of the sheet-like metal member, the chip, the metal member, and the input/output electrodes being encapsulated in an electrically insulating member having a bottom surface and adapted to be mounted on a surface of a circuit board. The sheet-like metal member is brought out from inside the electrically insulating member without being bent and has its one end face situated in substantially the same plane as the bottom surface of the electrically insulating member which faces to the surface of the circuit board when the metal member is mounted on the circuit board and the major surface of the chip is approximately prependicular to the end face of the sheet-like metal member.

摘要翻译： 一种半导体器件，包括半导体芯片，电连接到半导体芯片的主表面并用作芯片的接地电极的片状金属构件，以及与半导体芯片电连接并位于其中的输入/输出电极 作为片状金属构件，芯片，金属构件和输入/输出电极的平面被封装在具有底表面并且适于安装在电路板的表面上的电绝缘构件中。 片状金属构件不会弯曲而从电绝缘构件的内部带出，并且其一个端面位于与电路板的表面相对的电绝缘构件的底面的大致相同的平面中， 金属构件安装在电路板上，并且芯片的主表面大致垂直于片状金属构件的端面。

公开(公告)号：US5583424A

公开(公告)日：1996-12-10

申请号：US212797

申请日：1994-03-15

申请人： Toshiro Sato ,  Kunio Matsukura ,  Isamu Yanase ,  Yuji Iseki ,  Tetsuhiko Mizoguchi ,  Yuji Ide ,  Michio Hasegawa ,  Yoshihiko Yamaguchi ,  Yasunori Iwamoto

发明人： Toshiro Sato ,  Kunio Matsukura ,  Isamu Yanase ,  Yuji Iseki ,  Tetsuhiko Mizoguchi ,  Yuji Ide ,  Michio Hasegawa ,  Yoshihiko Yamaguchi ,  Yasunori Iwamoto

IPC分类号： G05F1/575 ,  H01F17/00 ,  H02M3/28 ,  G05F1/40 ,  H01F5/00

CPC分类号： H01F17/0006 ,  G05F1/575 ,  H02M3/28 ,  H01F2017/0066 ,  H01F2017/0086 ,  H02M2001/0009

摘要： Disclosed is a dc-to-dc converter comprising a switching transistor, a pulse-width modulation controller, a sandwich-type planar inductor, which accumulates an electromagnetic energy at ON state and releases the accumulated electromagnetic energy at OFF state of the switching transistor, a smoothing capacitor, a rectifying element, and a planar search coil for detecting an overcurrent flowing the planar coil, disposed on one of the outer surfaces of the soft magnetic layers constituting the planar inductor.

摘要翻译： 公开了一种DC-DC转换器，其包括开关晶体管，脉宽调制控制器，夹层型平面电感器，其在接通状态下积累电磁能量，并将开关晶体管的断开状态下的累积电磁能量释放， 平滑电容器，整流元件和用于检测流过平面线圈的过电流的平面检索线圈，其设置在构成平面电感器的软磁性层的一个外表面上。

公开(公告)号：US20100025060A1

公开(公告)日：2010-02-04

申请号：US12443938

申请日：2007-10-11

申请人： Yasuo Yamane ,  Keiji Yamada ,  Yuji Iseki ,  Manabu Kondou

发明人： Yasuo Yamane ,  Keiji Yamada ,  Yuji Iseki ,  Manabu Kondou

IPC分类号： B25D9/04 ,  B25D17/06

CPC分类号： B25D17/08 ,  B25D17/02 ,  B25D2250/181

摘要： A silicon lump crushing tool comprising a pneumatic piston drive means for driving a piston installed in a casing from a retreat position to a projection position by air pressure, a guide tube connected to the casing and extending in the movement direction of the piston, and a hammer head. The rear end portion of the hammer head is movably inserted into the front end portion of the guide tube, and when the piston is driven from the retreat position to the projection position, the front end of the piston collides with the rear end of the hammer head.

摘要翻译： 一种硅块破碎工具，包括气动活塞驱动装置，用于通过空气压力将安装在壳体中的活塞从后退位置驱动到突出位置，连接到壳体并沿着活塞的移动方向延伸的导管; 锤头 锤头的后端可移动地插入导管的前端部，当活塞从后退位置被驱动到突出位置时，活塞的前端与锤的后端碰撞 头。

公开(公告)号：US5694030A

公开(公告)日：1997-12-02

申请号：US714780

申请日：1996-09-16

申请人： Toshiro Sato ,  Kunio Matsukura ,  Isamu Yanase ,  Yuji Iseki ,  Tetsuhiko Mizoguchi ,  Yuji Ide ,  Michio Hasegawa ,  Yoshihiko Yamaguchi ,  Yasunori Iwamoto

发明人： Toshiro Sato ,  Kunio Matsukura ,  Isamu Yanase ,  Yuji Iseki ,  Tetsuhiko Mizoguchi ,  Yuji Ide ,  Michio Hasegawa ,  Yoshihiko Yamaguchi ,  Yasunori Iwamoto

IPC分类号： G05F1/575 ,  H01F17/00 ,  H02M3/28 ,  G05F1/40 ,  H01F5/00

CPC分类号： H01F17/0006 ,  G05F1/575 ,  H02M3/28 ,  H01F2017/0066 ,  H01F2017/0086 ,  H02M2001/0009

摘要： Disclosed is a dc-to-dc converter comprising a switching transistor, a pulse-width modulation controller, a sandwich-type planar inductor, which accumulates an electromagnetic energy at ON state and releases the accumulated electromagnetic energy at OFF state of the switching transistor, a smoothing capacitor, a rectifying element, and a planar search coil for detecting an overcurrent flowing the planar coil, disposed on one of the outer surfaces of the soft magnetic layers constituting the planar inductor.

摘要翻译： 公开了一种DC-DC转换器，其包括开关晶体管，脉宽调制控制器，夹层型平面电感器，其在接通状态下积累电磁能量，并将开关晶体管的断开状态下的累积电磁能量释放， 平滑电容器，整流元件和用于检测流过平面线圈的过电流的平面检索线圈，其设置在构成平面电感器的软磁性层的一个外表面上。