公开(公告)号：US09030912B2

公开(公告)日：2015-05-12

申请号：US13175817

申请日：2011-07-01

申请人： Yun Wang ,  Jun Lu

发明人： Yun Wang ,  Jun Lu

IPC分类号： G01V1/28

CPC分类号： G01V1/286 ,  G01V2210/48 ,  G01V2210/586

摘要： An approach is provided for a multi-component seismic data processing that separates P-type and S-type seismic waves in an affine coordinate system. A method for separating and composing seismic waves comprises: determining base vectors of the seismic waves; transforming and separating the seismic wave in an affine coordinate system; and obtaining a signal with true amplitudes and eliminating a mode leakage phenomenon. Therefore, the method achieves the wave separation and recovers the amplitudes of separated waves simultaneously, which reduces noises to provide more precisely seismic data and to satisfy the requirement of seismic data analysis and processing.

摘要翻译： 提供了一种用于在仿射坐标系中分离P型和S型地震波的多分量地震数据处理的方法。 一种用于分离和组合地震波的方法包括：确定地震波的基矢量; 在仿射坐标系中转换和分离地震波; 并获得具有真实幅度的信号并消除模式泄漏现象。 因此，该方法实现了波分离，同时恢复了分离波的振幅，减少了噪声，提供了更精确的地震数据，满足了地震数据分析与处理的要求。

公开(公告)号：US20120002505A1

公开(公告)日：2012-01-05

申请号：US13175817

申请日：2011-07-01

申请人： Yun Wang ,  Jun Lu

发明人： Yun Wang ,  Jun Lu

IPC分类号： G01V1/28

CPC分类号： G01V1/286 ,  G01V2210/48 ,  G01V2210/586

摘要： An approach is provided for a multi-component seismic data processing that separates P-type and S-type seismic waves in an affine coordinate system. A method for separating and composing seismic waves comprises: determining base vectors of the seismic waves; transforming and separating the seismic wave in an affine coordinate system; and obtaining a signal with true amplitudes and eliminating a mode leakage phenomenon. Therefore, the method achieves the wave separation and recovers the amplitudes of separated waves simultaneously, which reduces noises to provide more precisely seismic data and to satisfy the requirement of seismic data analysis and processing.

摘要翻译： 提供了一种用于在仿射坐标系中分离P型和S型地震波的多分量地震数据处理的方法。 一种用于分离和组合地震波的方法包括：确定地震波的基矢量; 在仿射坐标系中转换和分离地震波; 并获得具有真实幅度的信号并消除模式泄漏现象。 因此，该方法实现了波分离，同时恢复了分离波的振幅，减少了噪声，提供了更精确的地震数据，满足了地震数据分析与处理的要求。

公开(公告)号：US20230371749A1

公开(公告)日：2023-11-23

申请号：US18108007

申请日：2023-02-09

申请人： Jun Lu

发明人： Jun Lu

IPC分类号： A47J42/34

CPC分类号： A47J42/34

摘要： The present invention comprises a condiment shaker/crusher for crushing, holding and dispensing seasonings to add taste to edible food. The condiment shaker comprises a body member having an opening. The body member is made of a squeezable material and defines an interior space for holding the seasonings to be crushed and dispensed. A top is removably engaged about the opening of the body member.

公开(公告)号：US20190202179A1

公开(公告)日：2019-07-04

申请号：US16292923

申请日：2019-03-05

申请人： Jun Lu ,  Wenjie Chen ,  Curtis Schilling, III ,  John Joseph D'Errico ,  Weihong Cui

发明人： Jun Lu ,  Wenjie Chen ,  Curtis Schilling, III ,  John Joseph D'Errico ,  Weihong Cui

IPC分类号： B32B27/08 ,  B32B17/10 ,  C08L1/00 ,  B32B27/30

CPC分类号： B32B27/08 ,  B32B17/10761 ,  B32B27/22 ,  B32B27/30 ,  B32B27/306 ,  B32B27/36 ,  B32B2250/03 ,  B32B2250/246 ,  B32B2270/00 ,  B32B2307/412 ,  B32B2307/418 ,  B32B2307/558 ,  B32B2307/56 ,  B32B2307/732 ,  B32B2419/00 ,  B32B2457/12 ,  B32B2551/00 ,  B32B2571/02 ,  B32B2605/006 ,  B32B2607/02 ,  C08L1/00

摘要： Resin compositions, layers, and interlayers comprising two or more thermoplastic polymers and at least one RI balancing agent for adjusting the refractive index of at least one of the resins or layers is provided. Such compositions, layers, and interlayers exhibit enhanced optical properties while retaining other properties, such as impact resistance and acoustic performance.

公开(公告)号：US09399629B2

公开(公告)日：2016-07-26

申请号：US14203666

申请日：2014-03-11

申请人： Lidong Xing ,  Weitong Dong ,  Jun Lu ,  Ulrich Scholz ,  Jun Yan ,  Jinsong Yang

发明人： Lidong Xing ,  Weitong Dong ,  Jun Lu ,  Ulrich Scholz ,  Jun Yan ,  Jinsong Yang

IPC分类号： C07D307/32 ,  C07D307/20 ,  C07D315/00

CPC分类号： C07D307/32 ,  C07D307/20

摘要： This invention relates to a novel method for the preparation of 3-oxo-tetrahydrofuran comprising oxidizing 3-hydroxy-tetrahydrofuran in the presence of a catalytic amount of 2,2,6,6-tetramethyl-piperidine-N-oxyl (TEMPO) with trichloroisocyanuric acid.

摘要翻译： 本发明涉及一种制备3-氧代 - 四氢呋喃的新方法，其包括在催化量的2,2,6,6-四甲基 - 哌啶-N-氧基（TEMPO）存在下氧化3-羟基 - 四氢呋喃与 三氯异氰脲酸。

公开(公告)号：US09367371B2

公开(公告)日：2016-06-14

申请号：US12754564

申请日：2010-04-05

申请人： Bin Ni ,  Diego Lagunas ,  Jun Lu ,  Venu Reddy ,  Ramamurthy Kumar ,  Sami Ben Romdhane

发明人： Bin Ni ,  Diego Lagunas ,  Jun Lu ,  Venu Reddy ,  Ramamurthy Kumar ,  Sami Ben Romdhane

IPC分类号： G06F9/54 ,  G06F9/50 ,  G06F9/455 ,  G06F9/445 ,  H04L29/08

CPC分类号： G06F9/547 ,  G06F8/60 ,  H04L65/1063 ,  H04L67/04 ,  H04L67/1002

摘要： A method to optimize calls to a service by components of an application running on an application server is provided. The method includes receiving a first call and a second call, the first call made to a service by a first one of a plurality of components included in the application, and the second call made to the service by a second one of the plurality of components; selecting one of a plurality of optimizations, the plurality of optimizations including orchestrating the first call and the second call into a third call to the service; and, in response to the selecting of the orchestrating of the first call and the second call into the third call as the one of the plurality of optimizations, orchestrating the first call and the second call into the third call.

摘要翻译： 提供了一种通过应用程序服务器上运行的应用程序的组件优化对服务的调用的方法。 该方法包括接收第一呼叫和第二呼叫，由应用程序中包含的多个组件中的第一个组件进行的对服务的第一呼叫，以及由多个组件中的第二个组件对该服务进行的第二呼叫 ; 选择多个优化中的一个，所述多个优化包括将所述第一呼叫和所述第二呼叫协调为对所述服务的第三呼叫; 并且响应于将所述第一呼叫的协调选择和所述第三呼叫中的所述第二呼叫作为所述多个优化中的一个进行优化，将所述第一呼叫和所述第二呼叫编排到所述第三呼叫中。

公开(公告)号：US09326928B2

公开(公告)日：2016-05-03

申请号：US13989007

申请日：2011-11-03

申请人： Haiyang Tong ,  Jun Lu ,  Anjian Hui

发明人： Haiyang Tong ,  Jun Lu ,  Anjian Hui

IPC分类号： A61K8/92 ,  A61K8/18 ,  A61Q19/00 ,  A61Q19/10 ,  A61K8/44 ,  A61K8/34 ,  A61K8/36 ,  A61K8/37 ,  A61Q5/02 ,  A61Q11/00 ,  A61Q90/00

CPC分类号： A61K8/442 ,  A61K8/342 ,  A61K8/361 ,  A61K8/37 ,  A61K8/44 ,  A61Q5/02 ,  A61Q11/00 ,  A61Q19/10 ,  A61Q90/00

摘要： A thick cleaning composition, comprising a long-chain fatty acyl acidic amino acid ester; a fatty compound of fatty acid, fatty alcohol, fatty alcohol ether or polyol fatty acid ester; a surfactant; a solvent composed of water, lower alcohol, polyol and polyol ether; and further comprising a beautifying and cleaning adjuvant for skin, eyes, teeth and hair. The cleaning composition can achieve satisfactory thick appearance when used for cleaning skin and hair, and maintain stable viscosity at different temperatures. In use, the composition can be easily daubed, and foams quickly with good foaming quality.

摘要翻译： 一种厚的清洁组合物，其包含长链脂肪酰基酸性氨基酸酯; 脂肪酸，脂肪醇，脂肪醇醚或多元醇脂肪酸酯的脂肪族化合物; 表面活性剂; 由水，低级醇，多元醇和多元醇醚组成的溶剂; 并且还包括用于皮肤，眼睛，牙齿和头发的美化和清洁辅助剂。 当用于清洁皮肤和头发时，清洁组合物可以获得令人满意的厚外观，并且在不同温度下保持稳定的粘度。 在使用中，组合物可以容易地涂抹，并且具有良好的泡沫质量的泡沫。

公开(公告)号：US09214417B2

公开(公告)日：2015-12-15

申请号：US14186275

申请日：2014-02-21

申请人： Yueh-Se Ho ,  Hamza Yilmaz ,  Yan Xun Xue ,  Jun Lu

发明人： Yueh-Se Ho ,  Hamza Yilmaz ,  Yan Xun Xue ,  Jun Lu

IPC分类号： H01L23/495 ,  H01L27/088

CPC分类号： H01L23/49575 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49568 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L27/088 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/8385 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A combined packaged power semiconductor device includes flipped top source low-side MOSFET electrically connected to top surface of a die paddle, first metal interconnection plate connecting between bottom drain of a high-side MOSFET or top source of a flipped high-side MOSFET to bottom drain of the low-side MOSFET, and second metal interconnection plate stacked on top of the high-side MOSFET chip. The high-side, low-side MOSFET and the IC controller can be packaged three-dimensionally reducing the overall size of semiconductor devices and can maximize the chip's size within a package of the same size and improves the performance of the semiconductor devices. The top source of flipped low-side MOSFET is connected to the top surface of the die paddle and thus is grounded through the exposed bottom surface of die paddle, which simplifies the shape of exposed bottom surface of the die paddle and maximizes the area to facilitate heat dissipation.

摘要翻译： 组合封装的功率半导体器件包括电连接到管芯焊盘的顶表面的翻转顶部源极低侧MOSFET，第一金属互连板，将高边MOSFET的底部漏极或翻转的高侧MOSFET的顶部源极连接到底部 低端MOSFET的漏极和堆叠在高边MOSFET芯片顶部的第二金属互连板。 高侧，低端MOSFET和IC控制器可以三维封装，减小半导体器件的总体尺寸，并可在相同尺寸的封装内最大化芯片的尺寸，并提高半导体器件的性能。 翻转的低侧MOSFET的顶部源极连接到管芯焊盘的顶表面，并且因此通过裸片的裸露的底表面接地，这简化了裸片焊盘的暴露的底面的形状，并使面积最大化 散热。

公开(公告)号：US20150206868A1

公开(公告)日：2015-07-23

申请号：US14158830

申请日：2014-01-19

申请人： Xiaotian Zhang ,  Hamaz Yilmaz ,  Jun Lu ,  Xiaoguang Zeng ,  Ming-Chen Lu

发明人： Xiaotian Zhang ,  Hamaz Yilmaz ,  Jun Lu ,  Xiaoguang Zeng ,  Ming-Chen Lu

IPC分类号： H01L25/00 ,  H01L25/07 ,  H01L23/495 ,  H01L21/78 ,  H01L25/16

CPC分类号： H01L25/50 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L25/072 ,  H01L25/165 ,  H01L2224/0401 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/06135 ,  H01L2224/16245 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/92157 ,  H01L2224/92225 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

摘要： A semiconductor device package comprises a lead frame having a die paddle comprising a first chip installation area and a second chip installation area, a recess area formed in the first chip installation area, and multiple metal pillars formed in the recess area, a notch divides the first chip installation area into a transverse base extending transversely and a longitudinal base extending longitudinally, and separates the recess area into a transverse recess part formed in the transverse base and a longitudinal recess part formed in longitudinal base; a portion of a transverse extending part connecting to an external pin extends into a portion inside of the notch.

摘要翻译： 一种半导体器件封装，包括具有包括第一芯片安装区域和第二芯片安装区域的模板的引线框架，形成在第一芯片安装区域中的凹部区域和形成在凹部区域中的多个金属柱，凹口将 第一芯片安装区域横向延伸的横向基部和纵向延伸的纵向基部，并且将凹部区域分离成形成在横向基部中的横向凹部和形成在纵向基部中的纵向凹部; 连接到外部销的横向延伸部分的一部分延伸到凹口内部的一部分。

公开(公告)号：US09006901B2

公开(公告)日：2015-04-14

申请号：US13946949

申请日：2013-07-19

申请人： Yuping Gong ,  Yan Xun Xue ,  Ming-Chen Lu ,  Ping Huang ,  Jun Lu ,  Hamza Yilmaz

发明人： Yuping Gong ,  Yan Xun Xue ,  Ming-Chen Lu ,  Ping Huang ,  Jun Lu ,  Hamza Yilmaz

IPC分类号： H01L23/02 ,  H01L23/13 ,  H01L23/00

CPC分类号： H05K3/306 ,  H01L23/13 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49844 ,  H01L23/49861 ,  H01L24/06 ,  H01L24/24 ,  H01L24/25 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/89 ,  H01L24/92 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/24101 ,  H01L2224/24147 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/73267 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/85 ,  H01L2224/92224 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/15153 ,  H05K3/32 ,  H05K3/4697 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49165 ,  Y10T29/49169 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/8384 ,  H01L2224/8485 ,  H01L2224/8385

摘要： A thin power device comprises a substrate having a first set of first contact pads at a front surface of the substrate electrically connecting to a second set of second contact pads at a back surface of the substrate, a through opening opened from the front surface and through the substrate exposing a third contact pad at the back surface of the substrate, a semiconductor chip embedded into the through opening with a back metal layer at a back surface of the semiconductor chip attached on the third contact pad, and a plurality of conductive structures electrically connecting electrodes at a front surface of the semiconductor chip with the corresponding first contact pads in the first sets of first contact pads.

摘要翻译： 薄功率器件包括衬底，衬底在衬底的前表面处具有第一组第一接触焊盘，电连接到衬底的背面处的第二组第二接触焊盘，从前表面开口并穿过 所述基板在所述基板的背面暴露第三接触焊盘，在所述第三接触焊盘的所述半导体芯片的后表面处嵌入所述通孔中的背面金属层的半导体芯片，以及多个导电结构， 将所述半导体芯片的前表面处的电极与所述第一组第一接触焊盘中的对应的第一接触焊盘连接。