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19 条记录 (耗时 0.023 秒)

    Semiconductor device and chip structure thereof
    1.
    发明申请
    Semiconductor device and chip structure thereof 审中-公开
    半导体器件及其芯片结构

    公开(公告)号：US20070262444A1

    公开(公告)日：2007-11-15

    申请号：US11800451

    申请日：2007-05-04

    申请人： Yung-Chang Chen ,  Yuan-Lin Tzeng ,  Ming-Tsung Wang ,  Jeng-Yuan Lai ,  Cheng-Hsu Hsiao

    发明人： Yung-Chang Chen ,  Yuan-Lin Tzeng ,  Ming-Tsung Wang ,  Jeng-Yuan Lai ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/34

    CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L21/78 ,  H01L29/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2224/05599

    摘要： A semiconductor device, a chip structure thereof, and a method for fabricating the same are proposed. The method involves cutting a wafer with an array of chips twice so as to separate the chips and to form a chip structure. The first cutting is wider than the second cutting, and both are performed on an inactive surface of each of the chips. The chip structure includes a protruding portion formed on the inactive surface. The chip structure is electrically connected to a substrate by conductive bumps in a flip-chip manner and mounted with a heat sink. A decrease in contact area between the chip and the heat sink reduces warpage caused to the semiconductor device by thermal stress, thus preventing delamination of the heat sink and cracking of the conductive bumps, and reducing the expense and time spent on finding suitable underfill materials.

    摘要翻译： 提出了一种半导体器件及其芯片结构及其制造方法。 该方法包括用芯片阵列切割晶片两次以分离芯片并形成芯片结构。 第一切割比第二切割宽，并且都在每个切屑的非活性表面上进行。 芯片结构包括形成在非活性表面上的突出部分。 芯片结构通过导电凸块以倒装芯片方式电连接到基板，并安装有散热片。 芯片和散热片之间的接触面积的减小减少了热应力对半导体器件产生的翘曲，从而防止了散热器的分层和导电凸块的破裂，并且降低了在寻找合适的底部填充材料上花费的花费和时间。

    Semiconductor package substrate
    6.
    发明申请
    Semiconductor package substrate 审中-公开
    半导体封装基板

    公开(公告)号：US20080277786A1

    公开(公告)日：2008-11-13

    申请号：US12156874

    申请日：2008-06-05

    申请人： Chun-Lung Chen ,  Yu-Po Wang ,  Jeng-Yuan Lai ,  Cheng-Hsu Hsiao

    发明人： Chun-Lung Chen ,  Yu-Po Wang ,  Jeng-Yuan Lai ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/48

    CPC分类号： H05K1/115 ,  H01L23/3677 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0206 ,  H05K1/112 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2201/10674 ,  H01L2224/0401

    摘要： A semiconductor package substrate includes a body having an upper surface and a lower surface opposite to one another, a plurality of circuit layers formed in the body, a plurality of solder pads formed on the upper surface of the body, and a plurality of solder ball pads formed on the lower surface of the body. Each of the solder pads is electrically connected to one of the solder ball pads via the circuit layers and conductive structures disposed between the circuit layers, wherein the circuit layers and conductive structures are configured to expand outwardly in a fan-out manner so as to provide more space between the circuit layers closer to the lower surface of the body such that part of the solder pad-solder ball pad electrical connections can comprise a plurality of parallel connected conductive structures formed in the space, thereby enhancing the heat conducting passageway and the effect of heat-dissipation without having to dispose more solder pads on surface of the substrate.

    摘要翻译： 半导体封装基板包括具有彼此相对的上表面和下表面的主体，形成在主体中的多个电路层，形成在主体的上表面上的多个焊盘，以及多个焊球 衬垫形成在身体的下表面上。 每个焊盘通过设置在电路层之间的电路层和导电结构电连接到焊球之一，其中电路层和导电结构被配置为以扇出方式向外扩展，以便提供 电路层之间的距离更靠近主体的下表面的空间更多，使得焊料焊盘 - 焊球焊盘电连接的一部分可以包括形成在该空间中的多个平行连接的导电结构，从而增强导热通道和效果 的散热而不必在基板的表面上设置更多的焊盘。

    Heat dissipation unit and a semiconductor package that has the heat dissipation unit
    7.
    发明申请
    Heat dissipation unit and a semiconductor package that has the heat dissipation unit 审中-公开
    散热单元和具有散热单元的半导体封装

    公开(公告)号：US20080246142A1

    公开(公告)日：2008-10-09

    申请号：US12080798

    申请日：2008-04-04

    申请人： Jeng-Yuan Lai ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao

    发明人： Jeng-Yuan Lai ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/367

    CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A heat dissipation unit and a semiconductor package having the same are disclosed. The semiconductor package includes a carrier; an electronic component mounted on and electrically connected to the carrier; a heat dissipation unit, which includes a flat section attached to the electronic component, extension sections connected to the flat section, and a heat dissipation section connected to the extension sections; and an encapsulant encapsulating the electronic component and the heat dissipation unit, wherein stress releasing sections are at least disposed at intersectional corners between the extension sections and the flat section so as to prevent projections from being formed by concentrated stresses in a punching process of the heat dissipation unit, thereby maintaining flatness of the flat section and further preventing circuits of the electronic component from being damaged due to a contact point produced between the electronic component and the flat section in a molding process.

    摘要翻译： 公开了一种散热单元和具有该散热单元的半导体封装。 半导体封装包括载体; 电子部件，其安装在所述载体上并与其电连接; 散热单元，其包括附接到所述电子部件的平坦部分，连接到所述平坦部分的延伸部分和连接到所述延伸部分的散热部分; 以及封装电子部件和散热部的密封剂，其中应力释放部至少设置在延伸部和平坦部之间的交叉角处，以防止在热冲压加工中由于集中应力而形成突起 从而保持平坦部分的平坦度，并且进一步防止电子部件的电路在模制过程中由于在电子部件和平坦部分之间产生的接触点而损坏。

    Externally-embedded heat-dissipating device for ball grid array integrated circuit package
    10.
    发明授权
    Externally-embedded heat-dissipating device for ball grid array integrated circuit package 有权
    外置嵌入式散热装置，用于球栅阵列集成电路封装

    公开(公告)号：US06369455B1

    公开(公告)日：2002-04-09

    申请号：US09545357

    申请日：2000-04-07

    申请人： Tzong-Da Ho ,  Chien-Ping Huang ,  Jeng-Yuan Lai

    发明人： Tzong-Da Ho ,  Chien-Ping Huang ,  Jeng-Yuan Lai

    IPC分类号： H01L2328

    CPC分类号： H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

    摘要： An externally-embedded heat-dissipating device is designed for use with a BGA (Ball Grid Array) IC package for dissipating the IC-produced heat during operation to the atmosphere. that can help further increase the efficiency of heat dissipation from the BGA IC package. The heat-dissipating device is characterized in that it can be externally embedded in the top surface of the encapsulant without having to be supported on the substrate, and also in that it can help reduce the heat path from the IC chip to the heat-dissipating device so that heat-dissipation efficiency can be further increased as compared to the prior art. Further, the heat-dissipating device can help reduce manufacture cycle time and cost and also help prevent delamination, flash, and popcorn effect that would otherwise occur in the case of the prior art. It also can help save layout space over the substrate for compact design of the package. Overall speaking, the proposed heat-dissipating device is more advantageous to use than the prior art.

    摘要翻译： 外部嵌入散热装置设计用于BGA（球栅阵列）IC封装，用于在大气中运行时散发IC产生的热量。 这有助于进一步提高BGA IC封装的散热效率。 散热装置的特征在于，其可以外部嵌入密封剂的顶表面，而不必被支撑在基板上，并且还可以帮助减少从IC芯片到散热的热路径 装置，使得与现有技术相比可以进一步提高散热效率。 此外，散热装置有助于减少制造周期的时间和成本，并且还有助于防止在现有技术的情况下会发生的分层，闪光和爆米花效应。 它还可以帮助节省基板上的布局空间，实现封装的紧凑设计。 总体而言，所提出的散热装置比现有技术更有利于使用。