公开(公告)号：US06878644B2

公开(公告)日：2005-04-12

申请号：US10430942

申请日：2003-05-06

申请人： Zhenjiang Cui ,  Rick J. Roberts ,  Michael S. Cox ,  Jun Zhao ,  Khaled Elsheref ,  Alexandros T. Demos

发明人： Zhenjiang Cui ,  Rick J. Roberts ,  Michael S. Cox ,  Jun Zhao ,  Khaled Elsheref ,  Alexandros T. Demos

IPC分类号： H01L21/3105 ,  H01L21/762 ,  H01L21/31 ,  H01L21/461 ,  H01L21/76

CPC分类号： H01L21/76229 ,  H01L21/3105

摘要： A method of filling a plurality of trenches etched in a substrate. In one embodiment the method includes depositing a layer of spin-on glass material over the substrate and into the plurality of trenches; curing the layer of spin-on glass material by exposing the spin-on glass material to electron beam radiation at a first temperature for a first period and subsequently exposing the spin-on glass material to an electron beam at a second temperature for a second period, where the second temperature is greater than the first temperature. The method concludes by depositing a layer of silica glass over the cured spin-on glass layer using a chemical vapor deposition technique.

摘要翻译： 一种填充蚀刻在衬底中的多个沟槽的方法。 在一个实施例中，该方法包括在衬底上沉积旋涂玻璃材料层并进入多个沟槽; 通过在第一温度下将自旋玻璃材料暴露于电子束辐射第一周期，随后将旋涂玻璃材料暴露于第二温度下的电子束第二周期来固化旋涂玻璃材料层 ，其中第二温度大于第一温度。 该方法的结论是通过使用化学气相沉积技术在固化的旋涂玻璃层上沉积二氧化硅玻璃层。

公开(公告)号：US06992024B2

公开(公告)日：2006-01-31

申请号：US10730193

申请日：2003-12-05

申请人： Zhenjiang Cui ,  Rick J. Roberts ,  Michael S. Cox ,  Jun Zhao

发明人： Zhenjiang Cui ,  Rick J. Roberts ,  Michael S. Cox ,  Jun Zhao

IPC分类号： H01L21/31 ,  H01L21/469

CPC分类号： H01L21/76229

摘要： A method of filling a plurality of trenches etched in a substrate. In one embodiment the method includes depositing a layer of spin-on glass material over the substrate and into the plurality of trenches; exposing the layer of spin-on glass material to a solvent; curing the layer of spin-on glass material; and depositing a layer of silica glass over the cured spin-on glass layer using a chemical vapor deposition technique.

摘要翻译： 一种填充蚀刻在衬底中的多个沟槽的方法。 在一个实施例中，该方法包括在衬底上沉积旋涂玻璃材料层并进入多个沟槽; 将旋涂玻璃材料层暴露于溶剂中; 固化旋涂玻璃材料层; 并使用化学气相沉积技术在固化的旋涂玻璃层上沉积二氧化硅玻璃层。

公开(公告)号：US06693050B1

公开(公告)日：2004-02-17

申请号：US10431031

申请日：2003-05-06

申请人： Zhenjiang Cui ,  Rick J. Roberts ,  Michael S. Cox ,  Jun Zhao

发明人： Zhenjiang Cui ,  Rick J. Roberts ,  Michael S. Cox ,  Jun Zhao

IPC分类号： H01L2131

CPC分类号： H01L21/76229

摘要： A method of filling a plurality of trenches etched in a substrate. In one embodiment the method includes depositing a layer of spin-on glass material over the substrate and into the plurality of trenches; exposing the layer of spin-on glass material to a solvent; curing the layer of spin-on glass material; and depositing a layer of silica glass over the cured spin-on glass layer using a chemical vapor deposition technique.

摘要翻译： 一种填充蚀刻在衬底中的多个沟槽的方法。 在一个实施例中，该方法包括在衬底上沉积旋涂玻璃材料层并进入多个沟槽; 将旋涂玻璃材料层暴露于溶剂中; 固化旋涂玻璃材料层; 并使用化学气相沉积技术在固化的旋涂玻璃层上沉积二氧化硅玻璃层。

公开(公告)号：US06936551B2

公开(公告)日：2005-08-30

申请号：US10428374

申请日：2003-05-01

申请人： Farhad Moghadam ,  Jun Zhao ,  Timothy Weidman ,  Rick J. Roberts ,  Li-Qun Xia ,  Alexandros T. Demos

发明人： Farhad Moghadam ,  Jun Zhao ,  Timothy Weidman ,  Rick J. Roberts ,  Li-Qun Xia ,  Alexandros T. Demos

IPC分类号： B05D3/06 ,  B05D7/24 ,  C23C16/26 ,  C23C16/40 ,  C23C16/56 ,  H01L21/3105 ,  H01L21/312 ,  H01L21/31 ,  H01L21/469

CPC分类号： B05D1/60 ,  B05D3/068 ,  B05D3/141 ,  B05D5/08 ,  B05D5/12 ,  C08G77/50 ,  C23C16/26 ,  C23C16/401 ,  C23C16/56 ,  H01L21/0206 ,  H01L21/02063 ,  H01L21/02126 ,  H01L21/02129 ,  H01L21/02167 ,  H01L21/02211 ,  H01L21/02216 ,  H01L21/02271 ,  H01L21/02274 ,  H01L21/02282 ,  H01L21/02351 ,  H01L21/0276 ,  H01L21/0277 ,  H01L21/0337 ,  H01L21/3105 ,  H01L21/31058 ,  H01L21/3121 ,  H01L21/3122 ,  H01L21/3125 ,  H01L21/3146 ,  H01L21/3148 ,  H01L21/316 ,  H01L21/31625 ,  H01L21/31633 ,  H01L21/76807 ,  H01L21/76814 ,  H01L21/76825 ,  H01L21/76829

摘要： One embodiment of the present invention is a method for fabricating a low-k dielectric film that includes steps of: (a) chemical vapor depositing a lower-k dielectric film; and (b) e-beam treating the lower-k dielectric film.

摘要翻译： 本发明的一个实施例是一种制造低k电介质膜的方法，包括以下步骤：（a）化学气相沉积低k电介质膜; 和（b）电子束处理低k电介质膜。

公开(公告)号：US07256139B2

公开(公告)日：2007-08-14

申请号：US11045650

申请日：2005-01-28

申请人： Farhad Moghadam ,  Jun Zhao ,  Timothy Weidman ,  Rick J. Roberts ,  Li-Quan Xia ,  Alexandros T. Demos

发明人： Farhad Moghadam ,  Jun Zhao ,  Timothy Weidman ,  Rick J. Roberts ,  Li-Quan Xia ,  Alexandros T. Demos

IPC分类号： H01L21/31

CPC分类号： B05D1/60 ,  B05D3/068 ,  B05D3/141 ,  B05D5/08 ,  B05D5/12 ,  C08G77/50 ,  C23C16/26 ,  C23C16/401 ,  C23C16/56 ,  H01L21/0206 ,  H01L21/02063 ,  H01L21/02126 ,  H01L21/02129 ,  H01L21/02167 ,  H01L21/02211 ,  H01L21/02216 ,  H01L21/02271 ,  H01L21/02274 ,  H01L21/02282 ,  H01L21/02351 ,  H01L21/0276 ,  H01L21/0277 ,  H01L21/0337 ,  H01L21/3105 ,  H01L21/31058 ,  H01L21/3121 ,  H01L21/3122 ,  H01L21/3125 ,  H01L21/3146 ,  H01L21/3148 ,  H01L21/316 ,  H01L21/31625 ,  H01L21/31633 ,  H01L21/76807 ,  H01L21/76814 ,  H01L21/76825 ,  H01L21/76829

摘要： One embodiment of the present invention is a method for fabricating a low-k dielectric film that included steps of: (a) chemical vapor depositing a lower-k dielectric film; and (b) e-beam treating the lower-k dielectric film.

摘要翻译： 本发明的一个实施例是一种制造低k电介质膜的方法，包括以下步骤：（a）化学气相沉积低k电介质膜; 和（b）电子束处理低k电介质膜。

公开(公告)号：US07431585B2

公开(公告)日：2008-10-07

申请号：US10278615

申请日：2002-10-22

申请人： Jun Zhao ,  David Quach ,  Timothy Weidman ,  Rick J. Roberts ,  Farhad Moghadam ,  Dan Maydan

发明人： Jun Zhao ,  David Quach ,  Timothy Weidman ,  Rick J. Roberts ,  Farhad Moghadam ,  Dan Maydan

IPC分类号： F27D3/00

CPC分类号： H01L21/67109 ,  Y10S414/139

摘要： An apparatus for processing substrates is disclosed. In one embodiment, the apparatus includes a housing and a plurality of stacked cell structures in the housing. An actuator is adapted to move the plurality of stacked cell structures inside of the housing while substrates in the stacked cell structures are being heated.

公开(公告)号：US07381052B2

公开(公告)日：2008-06-03

申请号：US11445630

申请日：2006-06-02

申请人： Jun Zhao ,  David Quach ,  Timothy Weidman ,  Rick J. Roberts ,  Farhad Moghadam ,  Dan Maydan

发明人： Jun Zhao ,  David Quach ,  Timothy Weidman ,  Rick J. Roberts ,  Farhad Moghadam ,  Dan Maydan

IPC分类号： C23C16/04

CPC分类号： H01L21/67109 ,  Y10S414/139

摘要： An apparatus for processing substrates is disclosed. In one embodiment, the apparatus includes a housing and a plurality of stacked cell structures in the housing. An actuator is adapted to move the plurality of stacked cell structures inside of the housing while substrates in the stacked cell structures are being heated.

摘要翻译： 公开了一种处理衬底的设备。 在一个实施例中，该装置包括外壳和壳体中的多个堆叠的电池结构。 致动器适于在堆叠的电池结构中的衬底被加热的同时将多个堆叠的电池结构移动到壳体内部。

公开(公告)号：US06895776B2

公开(公告)日：2005-05-24

申请号：US10617902

申请日：2003-07-10

申请人： Jun Zhao ,  Rick J. Roberts

发明人： Jun Zhao ,  Rick J. Roberts

IPC分类号： B01F5/10 ,  B01F13/00 ,  B01F15/06 ,  B24B37/04 ,  B24B57/02 ,  B67D7/76 ,  B67D7/80 ,  H01L21/312 ,  H01L21/316 ,  H01L21/44 ,  B67D5/62

CPC分类号： H01L21/02282 ,  B01F13/00 ,  B01F13/0011 ,  B01F15/065 ,  B01F2003/0035 ,  B24B37/04 ,  B24B57/02 ,  H01L21/3121 ,  H01L21/316

摘要： An anti-stratification-delivery system comprises a multi-zone-refrigeration unit having at least first and second zone temperature controllers, the first and second zone temperature controllers are capable of being set at different temperatures to establish a temperature gradient in a liquid, the temperature gradient being sufficient to cause natural-thermal convention within the liquid to stir a colloid suspended in the liquid to an approximately uniform-colloidal suspension; and a delivery system configured to dispense the approximately uniform-colloidal suspension.

摘要翻译： 防分层输送系统包括具有至少第一和第二区域温度控制器的多区域制冷单元，第一和第二区域温度控制器能够被设定在不同温度以建立液体中的温度梯度， 温度梯度足以引起液体内的自然热惯性，将悬浮在液体中的胶体搅拌成大致均匀的胶态悬浮液; 以及配置成分配近似均匀胶体悬浮液的输送系统。

公开(公告)号：US07743728B2

公开(公告)日：2010-06-29

申请号：US12106824

申请日：2008-04-21

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： B05C13/02 ,  C23C14/00 ,  H01L21/677

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool). In one embodiment, the cluster tool is adapted to perform a track lithography process in which a photosensitive material is applied to a substrate, patterned in a stepper/scanner, and then removed in a developing process completed in the cluster tool. In one embodiment of the cluster tool, substrates are grouped together in groups of two or more for transfer or processing to improve system throughput, reduce the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, and thus increase system reliability. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

摘要翻译： 实施例通常提供使用多室处理系统（例如，集群工具）来处理衬底的装置和方法。 在一个实施例中，簇工具适于执行轨道光刻工艺，其中感光材料被施加到基板上，在步进/扫描器中图案化，然后在以集群工具完成的显影过程中去除。 在集群工具的一个实施例中，将基板分成两组或更多组以进行传送或处理，以提高系统吞吐量，减少机器人必须在处理室之间传送一批衬底的移动次数，从而减少 提高系统可靠性。 实施例还提供了用于增加衬底转移过程以减少系统停机时间的可靠性的方法和装置。

公开(公告)号：US20090067956A1

公开(公告)日：2009-03-12

申请号：US12254778

申请日：2008-10-20

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： H01L21/67

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership, is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.