公开(公告)号：WO2021018999A1

公开(公告)日：2021-02-04

申请号：PCT/EP2020/071483

申请日：2020-07-30

Applicant: HERAEUS DEUTSCHLAND GMBH & CO KG

Inventor： MIYAZAKI, Yayoi ,  ISHIKAWA, Akio ,  MERKER, Udo

IPC: H01G9/00 ,  H01G9/012 ,  H01G9/028

Abstract: The present invention relates to a capacitor comprising i) an electrode body comprising an electrode material, wherein a dielectric layer comprising a dielectric material at least partially covers a surface of the electrode body; ii) a solid electrolyte layer comprising a solid electrolyte material that at least partially covers a surface of the dielectric layer, wherein the solid electrolyte material comprises a conductive polymer; iii) an anode contact that is in contact with the electrode body and that comprises copper, metal-plated copper or a copper-containing alloy; and iv) a cathode contact that is in contact with the solid electrolyte layer; wherein the capacitor further comprises at least one metal ion migration inhibitor. The present invention also relates to a process for the production of a capacitor, to a capacitor obtainable by such a process, to electronic circuit comprising the capacitor according to present invention and to the use of these capacitors in electronic circuits.

公开(公告)号：WO2018083013A1

公开(公告)日：2018-05-11

申请号：PCT/EP2017/077541

申请日：2017-10-27

Applicant: HERAEUS DEUTSCHLAND GMBH & CO KG

Inventor： GUNTERMANN, Udo ,  LÖVENICH, Wilfried ,  SCHEEL, Arnulf

IPC: C08G61/12 ,  H01B1/12 ,  C08L65/00 ,  C08L25/18

Abstract: The present invention relates to a liquid composition comprising i) particles comprising a complex of a polythiophene and apolyanion, and ii) at least one solvent; wherein a) the liquid composition comprises at least 30wt.-% of the polythiophene, based on the total weight of the polythiophene and the polyanion, and b) the weight average particle diameter (d 50 ) of particles i) is in the range from 10nm to 2,000nm. The present invention also relates to a process for the preparation of a liquid composition, to a liquid composition obtainable by such a process, to a process for the preparation of a layered body, to a layered body obtainable by such a process and to the use of a liquid composition.

Abstract translation: 本发明涉及一种液体组合物，其包含i）包含聚噻吩和多羟基化合物的配合物的颗粒，和ii）至少一种溶剂; 其中a）基于聚噻吩和聚阴离子的总重量，液体组合物包含至少30重量％的聚噻吩，和b）颗粒的重均粒径（d 50） i）在10nm至2000nm的范围内。 本发明还涉及一种用于制备液体组合物的方法，一种通过该方法获得的液体组合物，一种用于制备层状体的方法，一种通过该方法获得的层状体以及一种用途 的液体组合物。

公开(公告)号：WO2016156170A1

公开(公告)日：2016-10-06

申请号：PCT/EP2016/056463

申请日：2016-03-23

Applicant: HERAEUS DEUTSCHLAND GMBH & CO KG

Inventor： KÖNIG, Markus ,  SCHULZ, Gerd ,  ZINDEL, Daniel ,  HÖRTEIS, Matthias

IPC: H01B1/16 ,  H01L31/0224

CPC classification number: H01B1/16 ,  H01L31/02167 ,  H01L31/022425 ,  Y02E10/50

Abstract: In general, the present invention relates to an electro-conductive paste comprising an oxide additive and solar cells obtainable therefrom. More specifically, the present invention relates to electro-conductive pastes, solar cell precursors, processes for preparation of solar cells, solar cells and solar modules. The present invention relates to a conductive paste composition comprising the following paste constituents: a. at least about 70 wt. % Ag particles, based on the paste; b. a vehicle; c. a glass; d. an oxide additive comprising MI, Mil, and O; wherein MI and Mil are different; wherein MI is selected from the group consisting of: V, Nb, Ta, Cr, Mo, W, Ge, As, Sb, Se, Te, Pb and Bi; wherein Mil is selected from the group consisting of: V, Nb, Ta, Cr, Mo, W, Ge, As, Sb, Se, Te, Pb, Bi, Mn, Ce, Zn, Li, Na, K, Rb, Cs, Mg, Ca, Sr and Ba; wherein the oxide additive is crystalline according to electron back scattering diffraction (EBSD) measurement.

Abstract translation: 通常，本发明涉及包含氧化物添加剂和可从其获得的太阳能电池的导电浆料。 更具体地说，本发明涉及导电浆料，太阳能电池前体，太阳能电池的制备方法，太阳能电池和太阳能电池组件。 本发明涉及包含以下糊剂成分的导电浆料组合物：a。 至少约70wt。 ％Ag颗粒，基于糊状物; 湾 一辆车; C。 一杯; 天。 包含MI，Mil和O的氧化物添加剂; 其中MI和Mil不同; 其中MI选自：V，Nb，Ta，Cr，Mo，W，Ge，As，Sb，Se，Te，Pb和Bi; 其中，M 1选自由V，Nb，Ta，Cr，Mo，W，Ge，As，Sb，Se，Te，Pb，Bi，Mn，Ce，Zn，Li，Na，K，Rb， Cs，Mg，Ca，Sr和Ba; 其中所述氧化物添加剂是根据电子背散射衍射（EBSD）测量结晶的。

公开(公告)号：WO2016091718A1

公开(公告)日：2016-06-16

申请号：PCT/EP2015/078555

申请日：2015-12-03

Applicant: HERAEUS DEUTSCHLAND GMBH & CO KG ,  HERAEUS MATERIALS SINGAPORE PTE., LTD.

Inventor： SARANGAPANI, Murali ,  SCHARF, Jürgen ,  THIRUNARAYANAN, Rajkumar ,  HARON, Ahmad Abdillah

IPC: C23C28/02 ,  C25D3/48 ,  C25D3/50 ,  C25D7/06 ,  H01L23/00

CPC classification number: C23C28/023 ,  C23C18/1637 ,  C23C18/1651 ,  C25D3/48 ,  C25D3/50 ,  C25D5/10 ,  C25D5/34 ,  C25D7/0607 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45572 ,  H01L2224/45644 ,  H01L2224/45944 ,  H01L2224/45964 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48847 ,  H01L2224/49425 ,  H01L2224/49429 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2924/01203 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01015 ,  H01L2924/01012 ,  H01L2924/01058 ,  H01L2224/45664 ,  H01L2224/45639 ,  H01L2224/45669 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2924/2011 ,  H01L2924/01033

Abstract: The present invention relates to a wire comprising a core with a surface, a first coating layer with a layer surface and a further coating layer, wherein A) the core comprises a) at least 99.95 wt.% of copper, b) an amount X of at least one element selected from silver and gold, c) an amount Y of at least one element selected from phosphorus, magnesium and cerium, wherein the ratio of X and Y is in the range of from 0.03 to 50; B) the first coating layer is composed of at least one element selected from the group comprising of palladium, platinum and silver, wherein the first coating layer is superimposed over the surface of the core, C) the further coating layer is superimposed over the layer surface of the first coating layer, wherein the further coating layer is composed of gold. The present invention further relates to a method for manufacturing a wire as aforementioned and to an electric device comprising the wire of the invention.

Abstract translation: 本发明涉及包括具有表面的芯，具有层表面的第一涂层和另外的涂层的导线，其中A）芯包括a）至少99.95重量％的铜，b）量X 的至少一种选自银和金的元素，c）选自磷，镁和铈中的至少一种元素的量Y，其中X和Y的比例在0.03至50的范围内; B）第一涂层由选自钯，铂和银的组中的至少一种元素组成，其中第一涂层叠加在芯的表面上，C）另外的涂层叠加在该层上 所述第一涂层的表面，其中所述另外的涂层由金构成。 本发明还涉及如上所述的线材的制造方法以及包括本发明的线材的电气装置。

公开(公告)号：WO2021048219A1

公开(公告)日：2021-03-18

申请号：PCT/EP2020/075220

申请日：2020-09-09

Applicant: HERAEUS DEUTSCHLAND GMBH & CO KG

Inventor： NEUMANN, Christian ,  MOTTWEILER, Jakob ,  BURSON, WIilliam C. ,  KOSEL, Björn ,  BRAND, Benjamin ,  BAUER, Stella Valery

IPC: C08G73/10 ,  C08J5/18 ,  C08L79/08 ,  C09D179/08 ,  C09D11/101 ,  C09D11/30

Abstract: The invention relates to a process of manufacturing a composite comprising a layer of a polyimide and a substrate, comprising at least these steps: i. Providing a first composition comprising an acid compound; and a second composition comprising a diamine compound; ii. Forming a first layer on the substrate, and iii. Forming a second layer on the first layer, wherein if the first layer is formed by applying the first composition, the second layer is formed by applying the second composition, and vice versa; wherein the first and the second layer overlap at least in part thereby forming a pattern on the substrate; iv. Conducting a thermal treatment on the pattern wherein the polyimide layer is formed. The invention further relates to such a composite, a kit comprising a first composition comprising an acid compound and a second composition comprising a diamine compound as well as a use of the kit.

公开(公告)号：WO2019020571A1

公开(公告)日：2019-01-31

申请号：PCT/EP2018/069933

申请日：2018-07-23

Applicant: HERAEUS DEUTSCHLAND GMBH & CO KG

Inventor： NEUMANN, Christian ,  SAUTTER, Armin ,  ASMUS, Tim

IPC: A61B5/00 ,  C09J133/00 ,  C08L81/00 ,  C09J7/00

Abstract: The present invention relates to a dispersion comprising i) particles A) of polymer comprising repeating units having the general structure -CH 2 -CHR 1 -COOR 2 - wherein R 1 represent H or an alkyl group, and R 2 represents an optionally substituted C 1 -C 10 -alkyl group, wherein particles A) have a mass average particle diameter (d 50 ) of at least 500 nm; ii) particles B) of a conductive polymer, preferably particles B) of a complex of a cationic polythiophene and a polymeric anion, wherein the particles B) have a mass average particle diameter of less than 150 nm; iii) at least one dispersant, preferably water; wherein the weight ratio of the polymer in particles A) to the conductive polymer in particles B), preferably the weight ratio of the polymer in particles A) to the total weight of the cationic polythiophene and the polymeric anion in the complex of particles B) is at least 5 : 1. The present invention also relates to a layered body, to a process for the production of such a layered body, to a layered body obtainable by that process and to the use of a layered body for electrophysical measurements.

公开(公告)号：WO2018137934A1

公开(公告)日：2018-08-02

申请号：PCT/EP2018/050661

申请日：2018-01-11

Applicant: HERAEUS DEUTSCHLAND GMBH & CO KG

Inventor： GUNTERMANN, Udo

IPC: C08L65/00 ,  C08L25/18 ,  C09D5/24 ,  C09D165/00 ,  H01B1/12

Abstract: The present invention relates to a liquid composition comprising: i) particles comprising a complex of a polythiophene and a polyanion, ii) at least one tetraalkyl orthosilicate, iii) at least one solvent, and iv) gallic acid, at least one derivative of gallic acid or a mixture thereof. The present invention also relates to a process for the preparation of a liquid composition, to a liquid composition obtainable by such a process, to a process for the preparation of a layered body, to the layered body obtainable by such a process, to a layered body and to the use of a liquid composition.

公开(公告)号：WO2017060140A3

公开(公告)日：2017-06-01

申请号：PCT/EP2016073102

申请日：2016-09-28

Applicant: HERAEUS DEUTSCHLAND GMBH & CO KG

Inventor： HINRICH ANDREAS ,  DUCH SUSANNE ,  MIRIC ANTON ,  SCHÄFER MICHAEL

IPC: H01L21/58 ,  H01L21/48 ,  H01L21/60 ,  H01L21/683 ,  H01L23/14 ,  H01L23/373 ,  H01L23/488 ,  H01L23/495 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01L24/83 ,  H01L21/4821 ,  H01L21/4867 ,  H01L21/4871 ,  H01L21/6836 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49582 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/95 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27418 ,  H01L2224/2744 ,  H01L2224/27848 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/2939 ,  H01L2224/75272 ,  H01L2224/753 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/83898 ,  H01L2224/83907 ,  H01L2224/95 ,  H01L2224/97 ,  H05K3/305 ,  H05K3/3436 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0781

Abstract: The invention relates to a method for producing a substrate arrangement (10, 10") for connecting to an electronic component (30), comprising the steps of: providing a substrate (11) that has a first side (12) and a second side (13), applying a contacting material layer (15) to the first side (12) of said substrate (11), and applying a pre-fixation agent (18) to at least some sections of a side (16) of the contacting material layer (15) that faces away from said substrate (11). The invention also relates to a corresponding substrate arrangement (10, 10") and to a corresponding method for connecting at least one electronic component (30) to the substrate arrangement (10, 10"). The claimed measures provide for sufficient handling strength during transportation from the place of assembly to the place of connection. The contacting material layer (15) should preferably be applied across the whole surface, or close to the whole surface, on the first side (12) of the substrate (11). The substrate (11), with the applied contacting material layer (15) and the applied pre-fixation agent (18), can be positioned detachably on a carrier (20). When connecting to the electronic component (30, 30'), the substrate arrangement (10, 10") is sintered, crimped, soldered and/or bonded thereto. The substrate (11) can be a metal sheet or a metal strip section, particularly a copper sheet or a copper strip section, a lead frame, a DCB substrate or a PCB substrate. The electronic component (30) can be a semiconductor, a DCB substrate or a PCB substrate.

Abstract translation: 本发明涉及一种用于连接到一个电子元件（30）一种制造基板组件（10，10“），其包括以下步骤：提供具有第一侧（12）和第二侧（13）的基板（11），应用 在基板（11），至少分批施加Vorfixiermittels从接合材料层（15）的基板（11）侧（16）的面向远离（18）。在本发明的第一侧（12）的接合材料层（15） 对应的基板组件（10,10“）和用于与所述基板组件（10，10“）连接至少一个电子元件（30）的相应的方法。本发明的措施是从Bestückens的地方接合的地方运输过程中是指一种足够 输送阻力生成。接合材料层（15）应该优选在所述基板的所述第一侧（12）的整个表面或大致整个表面 它（11）被应用。 在基板（11）在施加粘接材料层（15）和沉积Vorfixiermittel（18）可以可拆卸地在载体（20）进行定位。 基板组件（10，10“）是，连接到所述电子元件（30，30“）时被烧结与此，按压，焊接和/或粘合。在基板（11），金属板或金属条部分，尤其是铜板或铜带部 是引线框架，一个DCB-衬底或PCB基板的电子部件（30）可以是半导体，DCB-衬底或PCB基板。

公开(公告)号：WO2016087267A2

公开(公告)日：2016-06-09

申请号：PCT/EP2015077501

申请日：2015-11-24

Applicant: HERAEUS DEUTSCHLAND GMBH & CO KG

Inventor： GLYNN JEREMY ,  HAREIN STEVEN

IPC: A61N1/375

CPC classification number: A61N1/375 ,  B22F3/1055 ,  B22F3/225 ,  B22F7/04 ,  B22F7/062 ,  B22F2007/042 ,  B33Y80/00 ,  Y02P10/295

Abstract: On aspect is a housing for an implantable medical device, including a first portion of metal and having integrated features and a second portion also of metal. The first and second portions are sealed together thereby forming the housing with an internal space that is within first and second portions and that fully contains the features such that they are hermetically sealed relative to an external space outside the housing.

Abstract translation: 在一个方面是用于可植入医疗装置的壳体，包括金属的第一部分和具有整体特征的金属的第二部分。 第一和第二部分被密封在一起，由此形成具有在第一和第二部分内的内部空间的壳体，并且完全包含这些特征，使得它们相对于壳体外部的外部空间被气密密封。

公开(公告)号：WO2018019949A1

公开(公告)日：2018-02-01

申请号：PCT/EP2017/069051

申请日：2017-07-27

Applicant: HERAEUS DEUTSCHLAND GMBH & CO KG

Inventor： SAUER, Rüdiger ,  LÖVENICH, Wilfried ,  SAUTTER, Armin

IPC: H01L51/42

CPC classification number: H01L51/448 ,  H01L51/441 ,  Y02E10/549

Abstract: The present invention relates to a solar cell (1) comprising i) a substrate (2) of p-type silicon or n-type silicon, wherein the substrate (2) comprises a front side (2a) the surface of which is at least partially covered with at least one passivation layer (3) and a back side (2b); ii) a conductive polymer layer (4) that at least partially covers the back side (2b) of the substrate; and iii) an electrode (5) that at least partially covers the conductive polymer layer (4) one the side of the conductive polymer layer (4) that is facing away from the substrate (5). The present invention also relates to a process for the preparation of a solar cell, to a solar cell obtainable by this process and to a solar module.

Abstract translation: 本发明涉及一种太阳能电池（1），其包括：i）由p型硅或n型硅构成的衬底（2），其中衬底（2）包括正面（2a） ），其表面至少部分地被至少一个钝化层（3）和背面（2b）覆盖; ii）导电聚合物层（4），其至少部分覆盖所述衬底的背面（2b）; 和iii）电极（5），其至少部分地覆盖导电聚合物层（4）的远离衬底（5）的一侧的导电聚合物层（4）。 本发明还涉及制备太阳能电池的方法，通过该方法获得的太阳能电池和太阳能电池组件。