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    LEAD-FREE SOLDER COMPOSITIONS
    7.
    发明申请
    LEAD-FREE SOLDER COMPOSITIONS 审中-公开

    公开(公告)号：WO2020135932A1

    公开(公告)日：2020-07-02

    申请号：PCT/EP2019/025490

    申请日：2019-12-26

    Applicant: ALPHA ASSEMBLY SOLUTIONS INC. ,  SETNA, Rohan, P.

    Inventor： PANDHER, Ranjit ,  NAGARAJAN, Niveditha ,  KUMAR, Anil ,  RIBAS, Morgana de Avila ,  DUTT, Gyan ,  SARKAR, Siuli ,  BILGRIEN, Carl

    IPC: B23K35/26 ,  C22C13/00

    Abstract: A lead-free solder alloy comprising: from 1 to 9 wt.% copper, at least one of: from greater than 0 to 1 wt.% nickel, from greater than 0 to 10 wt.% germanium, from greater than 0 to 1 wt.% manganese, from greater than 0 to 10 wt.% aluminium, from greater than 0 to 10 wt.% silicon, from greater than 0 to 9 wt.% bismuth, from greater than 0 to 5 wt.% indium, from greater than 0 to 1 wt.% titanium, from greater than 0 to 2 wt.% lanthanum, from greater than 0 to 2 wt.% neodymium, optionally one or more of: up to 1 wt.% chromium, up to 1 wt.% gallium, up to 1 wt.% cobalt, up to 1 wt.% iron, up to 1 wt.% phosphorous, up to 1 wt.% gold, up to 1 wt.% tellurium, up to 1 wt.% selenium, up to 1 wt.% calcium, up to 1 wt.% vanadium, up to 1 wt.% molybdenum, up to 1 wt.% platinum, up to 1 wt.% magnesium, up to 5 wt.% silver, up to 1 wt.% zinc, up to 2 wt.% rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities.

    LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
    8.
    发明申请
    LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES 审中-公开
    无铅和无阻抗的锡焊可靠的高温

    公开(公告)号：WO2014057261A1

    公开(公告)日：2014-04-17

    申请号：PCT/GB2013/052624

    申请日：2013-10-09

    Applicant: ALPHA METALS, INC. ,  SETNA, Rohan

    Inventor： PANDHER, Ranjit ,  BHATKAL, Ravi ,  SINGH, Bawa ,  DE AVILA RIBAS, Morgana ,  CHOUDHURY, Pritha ,  KUMAR, Anil ,  MUKHERJEE, Sutapa ,  SARKAR, Siuli

    IPC: B23K35/26 ,  B23K35/02

    CPC classification number: B23K35/262 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/012 ,  B23K1/085 ,  B23K1/19 ,  B23K1/203 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  B23K2203/12 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3457 ,  H05K3/3463 ,  Y10T403/479

    Abstract: A lead-free, antimony-free solder alloy comprising: (a) 10 wt.% or less of silver, (b) 10 wt.% or less of bismuth, (c) 3 wt.% or less of copper, (d) at least one of the following elements up to 1 wt.% of nickel up to 1 wt.% of titanium up to 1 wt.% of cobalt up to 3.5 wt.% of indium up to 1 wt.% of zinc up to 1 wt.% of arsenic, (e) optionally one or more of the following elements 0 to 1 wt.% of manganese,0 to 1 wt. % of chromium, 0 to 1 wt.% of germanium,0 to 1 wt.% of iron, 0 to 1 wt.% of aluminum, 0 to 1 wt.% of phosphorus, 0 to 1 wt.% of gold, 0 to 1 wt.% of gallium, 0 to 1 wt.% of tellurium, 0 to 1 wt.% 20 of selenium, 0 to 1 wt.% of calcium, 0 to 1 wt.% of vanadium, 0 to 1 wt.% of molybdenum, 0 to 1 wt.% of platinum, 0 to 1 wt.% of magnesium, 0 to 1 wt.% of rare earths, (f) the balance tin, together with any unavoidable 2 impurities.

    Abstract translation: 一种无铅，无锑焊料合金，其包含：（a）10重量％以下的银，（b）10重量％以下的铋，（c）3重量％以下的铜，（d ）以下元素中的至少一种元素，至多1重量％的镍，至多1重量％的钛，至多1重量％的钴，至多3.5重量％的至多1重量％的锌，至多1重量％的锌，至多 1重量％的砷，（e）任选的一种或多种以下元素，0至1重量％的锰，0至1重量％ 铬的含量，0-1重量％的锗，0-1重量％的铁，0-1重量％的铝，0-1重量％的磷，0-1重量％的金，0 至1重量％的镓，0至1重量％的碲，0至1重量％的20，硒，0至1重量％的钙，0至1重量％的钒，0至1重量％ 的钼，0〜1重量％的铂，0〜1重量％的镁，0〜1重量％的稀土，（f）余量为锡，以及任何不可避免的2种杂质。

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