公开(公告)号：EP2230687A3

公开(公告)日：2012-12-05

申请号：EP10156602.4

申请日：2010-03-16

Applicant: Smartrac IP B.V.

Inventor： Michalk, Manfred

IPC: H01L23/498

CPC classification number: H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/11334 ,  H01L2224/11505 ,  H01L2224/1155 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/48091 ,  H01L2224/81191 ,  H01L2224/81345 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83907 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/181 ,  H05K3/102 ,  H05K3/321 ,  H05K3/326 ,  H05K3/4015 ,  H05K2201/0116 ,  H05K2201/0221 ,  H05K2201/0281 ,  H05K2201/0373 ,  H05K2201/10234 ,  H05K2201/10977 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Die Erfindung betrifft eine Schaltungsanordnung, umfassend zumindest zwei Verbindungspartner (10.1, 10.2, 10.3), welche über Verbindungsflächen (7.1, 7.2, 7.3) elektrisch und/oder mechanisch miteinander verbunden sind, wobei die Verbindungspartner (10.1, 10.2, 10.3) Leiterbahnen, elektrisch leitfähige Fasermaterialien und/oder elektronische Bauelemente sind. Erfindungsgemäß ist zwischen den Verbindungsflächen (7.1, 7.2, 7.3) zumindest ein Verbindungselement (1) angeordnet, welches mit zumindest einer Verbindungsfläche (7.1, 7.2, 7.3) formschlüssig und/oder stoffschlüssig verbunden ist.
Des Weiteren betrifft die Erfindung ein Verfahren zum elektrischen und/oder mechanischen Verbinden von Vcrbindungspartncrn (10.1, 10.2, 10.3) einer Schaltungsanordnung und eine Vorrichtung (16) zum Aufbringen von Verbindungselementen (1) auf eine Verbindungsfläche (7.1, 7.2, 7.3).

公开(公告)号：EP2451014A1

公开(公告)日：2012-05-09

申请号：EP10794233.6

申请日：2010-07-01

Applicant: Hitachi Chemical Company, Ltd.

Inventor： TAKAI Kenji ,  EJIRI Yoshinori ,  NAGAHARA Yuuko ,  MATSUZAWA Mitsuharu

IPC: H01R11/01 ,  H01B5/00 ,  H01B13/00

CPC classification number: H05K3/323 ,  B22F1/0062 ,  B22F1/025 ,  B22F2998/10 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0338 ,  B22F1/02

Abstract: [Problem to be Solved] To provide conductive particles which are capable of providing an anisotropically conductive adhesive that can maintain sufficient insulation characteristics and conduction characteristics even when used for the connection of a very small circuit, while having excellent moisture absorption resistance at a lower cost.
[Solution] A coated conductive particle (5) comprises: a composite conductive particle (3) that has a resin particle (4) and a metal layer (6) that covers the resin particle (4); and insulating fine particles (1) that are provided on the outer side of the metal layer (6) so as to partially cover the surface of the metal layer (6). The metal layer (6) has a nickel-palladium alloy plating layer (6a).

Abstract translation: [待解决的问题]为了提供能够提供各向异性导电粘合剂的导电颗粒，即使在用于连接非常小的电路时也能保持足够的绝缘特性和导电特性，同时具有较好的耐吸湿性 。 [解决方案]涂覆的导电颗粒（5）包括：具有树脂颗粒（4）和覆盖树脂颗粒（4）的金属层（6）的复合导电颗粒（3）; 以及设置在所述金属层（6）的外侧上以部分地覆盖所述金属层（6）的表面的绝缘性细颗粒（1）。 金属层（6）具有镍 - 钯合金镀层（6a）。

公开(公告)号：EP2148393A4

公开(公告)日：2012-03-28

申请号：EP08752686

申请日：2008-05-14

Applicant: HITACHI CHEMICAL CO LTD

Inventor： KOJIMA KAZUYOSHI ,  KOBAYASHI KOUJI ,  ARIFUKU MOTOHIRO ,  MOCHIZUKI NICHIOMI

IPC: C09J9/02 ,  H01B1/22 ,  H05K3/32

CPC classification number: H05K3/323 ,  C08K7/16 ,  C08K9/02 ,  C09J9/02 ,  C09J11/02 ,  H01B1/02 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/13016 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/2989 ,  H01L2224/81903 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01R4/04 ,  H01R12/714 ,  H01R13/03 ,  H05K3/361 ,  H05K2201/0221 ,  Y10T428/2998 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A circuit-connecting material for electrical connection of two circuit members with circuit electrodes formed thereon, with the circuit electrodes opposing, wherein the circuit-connecting material comprises an adhesive composition and conductive particles, and the conductive particles are conductive particles having a plurality of protrusions on the surface and consisting of a core made of an organic high molecular compound covered with a metal layer composed of nickel or a nickel alloy, the mean particle size of the core being 1-4 µm and the thickness of the metal layer being 65-125 nm.

公开(公告)号：EP2081222A4

公开(公告)日：2011-11-30

申请号：EP07830824

申请日：2007-10-30

Applicant: HITACHI CHEMICAL CO LTD

Inventor： KOJIMA KAZUYOSHI ,  KOBAYASHI KOUJI ,  ARIFUKU MOTOHIRO ,  MOCHIZUKI NICHIOMI

IPC: H01L21/60 ,  C09J9/02 ,  C09J11/02 ,  H01B1/00 ,  H01B1/22 ,  H01B5/16 ,  H05K1/14 ,  H05K3/32

CPC classification number: H01B1/22 ,  C08K7/16 ,  C08K9/02 ,  C09J9/02 ,  C09J11/02 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

公开(公告)号：EP2202755A4

公开(公告)日：2011-03-30

申请号：EP08841659

申请日：2008-10-24

Applicant: SEKISUI CHEMICAL CO LTD

Inventor： SASAKI TAKU ,  NATSUI HIROSHI ,  UENOYAMA SHINYA ,  SUN REN-DE

IPC: H01B5/00 ,  C23C18/40 ,  H01B1/22 ,  H01B13/00 ,  H01R11/01 ,  H05K1/14 ,  H05K3/32

CPC classification number: H05K3/323 ,  C23C18/1635 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/38 ,  C23C18/40 ,  C23C18/405 ,  C25D5/56 ,  H01B1/22 ,  H01R13/035 ,  H05K2201/0221

Abstract: It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period. The present invention is a conductive particle comprising a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more.

公开(公告)号：EP1278211B1

公开(公告)日：2010-11-10

申请号：EP02255043.8

申请日：2002-07-17

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Fujiki, Hironao, c/o Silicone-Electronics Materials ,  Fukushima, Motoo, Silicone-Electronics Materials

IPC: H01B1/04 ,  H01B1/20 ,  C08L83/04 ,  C08L83/06 ,  C08L83/12 ,  H01B1/22

CPC classification number: H01B1/22 ,  C08G65/007 ,  C08G65/336 ,  C08G77/12 ,  C08G77/20 ,  C08G77/46 ,  C08K9/02 ,  C08L83/04 ,  H01B1/20 ,  H05K1/095 ,  H05K2201/0221 ,  H05K2201/0254 ,  H05K2203/159 ,  C08L83/00

公开(公告)号：EP2230687A2

公开(公告)日：2010-09-22

申请号：EP10156602.4

申请日：2010-03-16

Applicant: Michalk, Manfred

Inventor： Michalk, Manfred

IPC: H01L23/498

CPC classification number: H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/11334 ,  H01L2224/11505 ,  H01L2224/1155 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/48091 ,  H01L2224/81191 ,  H01L2224/81345 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83907 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/181 ,  H05K3/102 ,  H05K3/321 ,  H05K3/326 ,  H05K3/4015 ,  H05K2201/0116 ,  H05K2201/0221 ,  H05K2201/0281 ,  H05K2201/0373 ,  H05K2201/10234 ,  H05K2201/10977 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Die Erfindung betrifft eine Schaltungsanordnung, umfassend zumindest zwei Verbindungspartner (10.1, 10.2, 10.3), welche über Verbindungsflächen (7.1, 7.2, 7.3) elektrisch und/oder mechanisch miteinander verbunden sind, wobei die Verbindungspartner (10.1, 10.2, 10.3) Leiterbahnen, elektrisch leitfähige Fasermaterialien und/oder elektronische Bauelemente sind. Erfindungsgemäß ist zwischen den Verbindungsflächen (7.1, 7.2, 7.3) zumindest ein Verbindungselement (1) angeordnet, welches mit zumindest einer Verbindungsfläche (7.1, 7.2, 7.3) formschlüssig und/oder stoffschlüssig verbunden ist.
Des Weiteren betrifft die Erfindung ein Verfahren zum elektrischen und/oder mechanischen Verbinden von Vcrbindungspartncrn (10.1, 10.2, 10.3) einer Schaltungsanordnung und eine Vorrichtung (16) zum Aufbringen von Verbindungselementen (1) auf eine Verbindungsfläche (7.1, 7.2, 7.3).

Abstract translation: 该电路装置具有两个连接伙伴（10.1,10.2），其与由海誓山盟连接表面（7.1,7.2）电和机械连接。 连接伙伴是电路路径，导电纤维材料或电子元件。 的连接元件连接面，其具有底切（4）和与所述连接面中的一个配合地连接之间布置。 该连接元件被压在连接面的部分材料（M7.1，M7.2）。 因此独立权利要求中包括了以下内容：（1）的电路装置的连接伙伴的电气和机械连接的方法; 和（2）上连接表面施加连接元件的设备。

公开(公告)号：EP2081222A1

公开(公告)日：2009-07-22

申请号：EP07830824.4

申请日：2007-10-30

Applicant: Hitachi Chemical Company, Ltd.

Inventor： KOJIMA, Kazuyoshi ,  KOBAYASHI, Kouji ,  ARIFUKU, Motohiro ,  MOCHIZUKI, Nichiomi

IPC: H01L21/60 ,  H01B1/00 ,  H01B1/22 ,  H01B5/16 ,  H05K1/14

CPC classification number: H01B1/22 ,  C08K7/16 ,  C08K9/02 ,  C09J9/02 ,  C09J11/02 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: There is provided a circuit connection structure that can provide satisfactory electrical connection between opposing circuit electrodes and that can sufficiently increase the long-term reliability of electrical characteristics between circuit electrodes. A circuit connection structure 1 comprising a first circuit member 30 having a first circuit electrode 32 formed on the main side 31a of a first circuit board 31, a second circuit member 40 situated opposing the first circuit member 30 and having a second circuit electrode 42 formed on the main side 41a of a second circuit board 41, and a circuit-connecting member 10 provided between the main side of the first circuit member 30 and the main side of the second circuit member 40 and electrically connecting the first and second circuit electrodes 32, 42, characterized in that the thickness of the first and second circuit electrodes 32, 42 is at least 50 nm, the circuit-connecting member 10 is obtained by curing a circuit-connecting material containing an adhesive composition and conductive particles 12 having multiple protrusions 14 on the surface side, and the outermost layer of the conductive particles 12 is composed of nickel or a nickel alloy.

Abstract translation: 提供一种电路连接结构，其可以在相对的电路电极之间提供令人满意的电连接，并且可以充分地增加电路电极之间的电特性的长期可靠性。 电路连接结构1包括第一电路构件30，第一电路构件30具有形成在第一电路板31的主侧31a上的第一电路电极32，与第一电路构件30相对的第二电路构件40，并且形成有第二电路电极42 在第二电路基板41的主面41a和设置在第一电路部件30的主面和第二电路部件40的主面之间的电路连接部件10，并电连接第一和第二电路电极32 42，其特征在于，第一和第二电路电极32,42的厚度为至少50nm，电路连接部件10通过固化含有粘合剂组合物的电路连接材料和具有多个突起的导电粒子12而获得 14表面，导电粒子12的最外层由镍或镍合金构成。

公开(公告)号：EP2053615A1

公开(公告)日：2009-04-29

申请号：EP07791966.0

申请日：2007-08-03

Applicant: I.S.T. Corporation

Inventor： HAMA, Nobuyuki ,  TAKEDA, Yasuaki ,  MORIUCHI, Koji

IPC: H01B1/22 ,  C09D179/08

CPC classification number: H01B1/22 ,  C08K5/378 ,  C08K9/02 ,  C08L79/08 ,  C09D179/08 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J179/08 ,  H05K1/095 ,  H05K2201/0154 ,  H05K2201/0221 ,  H05K2203/124

Abstract: The task of the present invention is to offer a conductive paste that can be molded into a conductive coating or film that can maintain flexibility and ductility even while possessing a thickness of 50 µm ∼ 125 µm. The conductive paste of the present invention includes a conductive particulate, a metal capture agent and a polyimide precursor solution. The metal capture agent can be selected as at least one from among either pyrimidinethiol compounds, triazinethiol compounds and imidazole compounds with a mercapto group. Moreover, the conductive particulate is preferably a core particle that is covered with a metal shell. In addition, a polyamic acid solution is preferred as the polyimide precursor solution.

Abstract translation: 本发明的任务是提供可以模制成导电涂层或膜的导电膏，即使在厚度为50μm〜125μm的情况下也能够保持柔软性和延展性。 本发明的导电性糊剂包括导电性粒子，金属捕获剂和聚酰亚胺前体溶液。 金属捕获剂可以选自嘧啶硫醇化合物，三嗪硫醇化合物和具有巯基的咪唑化合物中的至少一种。 此外，导电性粒子优选为被金属壳覆盖的核心粒子。 此外，作为聚酰亚胺前体溶液，优选聚酰胺酸溶液。

公开(公告)号：EP1868422A2

公开(公告)日：2007-12-19

申请号：EP07107196.3

申请日：2007-04-30

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： OI, Kiyoshi

IPC: H05K1/18

CPC classification number: H05K3/4046 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/24 ,  H01L24/82 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/0221 ,  H05K2201/096 ,  H05K2201/10234 ,  H01L2224/29099 ,  H01L2924/00

Abstract: In an electronic component built-in substrate of the present invention, an electronic component (41, 42, 43) is mounted on a mounted body (5) having a first wiring layer (12), the electronic component (41, 42, 43) is embedded in an insulating layer (25), a conductive ball (30) is arranged to pass through the insulating layer (25) and connected electrically to the first wiring layer (12), a second wiring layer (14) connected electrically to the conductive ball (30) is formed on the insulating layer (25), and the first wiring layer (12) and the second wiring layer (14) are interlayer-connected via the conductive ball (30).

Abstract translation: 在本发明的电子部件内置基板中，电子部件（41,42,43）安装在具有第一布线层（12）的安装体（5）上，电子部件（41,42,43） ）嵌入在绝缘层（25）中，导电球（30）布置成穿过绝缘层（25）并与第一布线层（12）电连接，第二布线层（14）电连接到 导电球（30）形成在绝缘层（25）上，并且第一布线层（12）和第二布线层（14）经由导电球（30）层间连接。