公开(公告)号：EP0873047B1

公开(公告)日：2008-02-13

申请号：EP98106742.4

申请日：1998-04-14

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Kobayashi, Kazuhito ,  Kumashiro, Yasushi ,  Takahashi, Atsushi ,  Morita, Koji ,  Tanabe, Takahiro ,  Yamamoto, Kazunori ,  Nakaso, Akishi ,  Arike, Shigeharu ,  Otsuka, Kazuhisa ,  Urasaki, Naoyuki ,  Fujimoto, Daisuke ,  Takano, Nozomu

IPC: H05K3/46

CPC classification number: H05K3/4655 ,  C09D5/00 ,  H05K1/0373 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249946 ,  Y10T428/249952

公开(公告)号：EP1847575A1

公开(公告)日：2007-10-24

申请号：EP05819587.6

申请日：2005-12-26

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： KAMIKORIYAMA, Y. MITSUI MINING & SMELTING CO., LTD ,  OGATA, Sumikazu, MITSUI MINING & SMELTING CO., LTD ,  ANAI, Kei, MITSUI MINING & SMELTING CO., LTD. ,  SAWAMOTO, Hiroki, MITSUI MINING & SMELTING CO. LTD ,  HORIUCHI, M., MITSUI MINING & SMELTING CO., LTD. ,  MUKUNO, Takashi, Hikoshima Smelting Co., Ltd. ,  YOSHIMARU, Katsuhiko, Hikoshima Smelting Co., LTD.

IPC: C09D11/02 ,  B01F17/16 ,  B01F17/18 ,  B01F17/52 ,  H01B1/00 ,  H01B1/22

CPC classification number: C09D11/52 ,  H01B1/22 ,  H05K1/097 ,  H05K2201/0239

Abstract: It is an object of the present invention to provide a conductive ink which enables to form a circuit or the like having excellent adhesion to a substrate and to forma conductor having high film density and low electric resistance. Inorder to attain the obj ect, a conductive ink comprising metal powder or metal oxide powder dispersed in a dispersion medium, which is characterized in that the dispersion medium contains a metal salt or a metal oxide as a film density improver for increasing film density of a conductor formed by using the conductive ink is adopted. A main solvent constituting the dispersion medium is selected from one or a combination of two or more selected from the group consisting of water, alcohols, glycols and saturated hydrocarbons having a boiling point of 300 deg. C or less at normal pressure.

Abstract translation: 本发明的目的是提供一种导电油墨，其能够形成对基材具有优异粘附性的电路等并形成具有高膜密度和低电阻的导体。 为了达到上述目的，提供一种包含分散在分散介质中的金属粉末或金属氧化物粉末的导电油墨，其特征在于，所述分散介质含有作为膜密度改进剂的金属盐或金属氧化物，以提高膜密度 采用导电油墨形成的导体。 构成分散介质的主要溶剂选自水，醇，二醇和沸点为300度的饱和烃的一种或两种以上的组合。 C以下。

公开(公告)号：EP1634330A1

公开(公告)日：2006-03-15

申请号：EP04750861.9

申请日：2004-04-29

Applicant: 3M Innovative Properties Company

Inventor： MAO, Guoping 3M Center ,  QU, Shichun 3M Center ,  LI, Fuming B. 3M Center ,  CLOUGH, Robert S. 3M Center ,  O'BRYAN, Nelson B. Jr. 3M Center

IPC: H01L23/498 ,  H01L23/15

CPC classification number: C08L65/00 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0373 ,  H05K3/4626 ,  H05K2201/0209 ,  H05K2201/0239 ,  H01L2924/00

Abstract: A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.

公开(公告)号：EP1387367A4

公开(公告)日：2005-04-27

申请号：EP02710342

申请日：2002-01-24

Applicant: JSR CORP

Inventor： ITO NOBUYUKI ,  MASUKO HIDEAKI ,  HASEGAWA SATOMI ,  YOSHIMURA NAKAATSU

IPC: C04B35/00 ,  C08K9/02 ,  C09C1/36 ,  C09C3/06 ,  C09C3/08 ,  C09D5/00 ,  C09D5/44 ,  C09D179/08 ,  H01B3/00 ,  H01B3/12 ,  H01G4/20 ,  H01L23/14 ,  H01L23/495 ,  H01L23/498 ,  H05K1/03 ,  H05K1/16 ,  H05K3/00 ,  H05K3/46 ,  C08K3/22 ,  C08K9/00 ,  C08K9/04

CPC classification number: H01L24/49 ,  C08K9/02 ,  H01L23/145 ,  H01L23/49527 ,  H01L23/49589 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/135 ,  H01L2924/00 ,  H01L2224/45099

Abstract: The dielectric-forming composition according to the invention is characterized by consisting of: composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material; and (B) a resin component constituted of at least one of a polymerizable compound and a polymer. In addition, another dielectric-forming composition according to the invention is characterized by containing: ultrafine particle-resin composite particles composed of (J) inorganic ultrafine particles with the average particle size of 0.1 mu m or smaller, and (B) a resin component constituted of at least one of a polymerizable compound and a polymer, wherein part or all of the surfaces of the inorganic ultrafine particles (J) are coated with the resin component (B), and the ultrafine particle-resin composite particles contain 20% by weight or more of the inorganic ultrafine particles (J); and inorganic particles with the average particle size of 0.1 to 2 mu m and permittivity of 30 or greater, or inorganic composite particles in which a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material is deposited on the part or all of the surfaces of the inorganic particles.

公开(公告)号：EP1517595A2

公开(公告)日：2005-03-23

申请号：EP04021368.8

申请日：2004-09-08

Applicant: HITACHI CHEMICAL CO., LTD.

Inventor： Amou, Satoru, Hitachi, Ldt. ,  Umino, Morimichi, Hitachi, Ldt. ,  Nagai, Akira, Hitachi, Ldt. ,  Nakamura, Yoshihiro ,  Minami, Nobuyuki

IPC: H05K1/03 ,  H05K3/46 ,  C08F12/08

CPC classification number: H05K1/032 ,  H05K1/024 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/31645

Abstract: There are provided a resin composition comprising a crosslinking component with a weight average molecular weight of 1,000 or less having a, plurality of styrene groups and represented by the following formula:
wherein R is a hydrocarbon skeleton, each of R 1 s is a hydrogen atom or a hydrocarbon group, each of R 2 , R 3 and R 4 is a hydrogen atom or an alkyl group, m is an integer of 1 to 4, and n is an integer of 2 or more, at least one high-molecular weight compound, an inorganic filler, and at least one treating agent for said inorganic filler; its cured product; and a prepreg, a laminate sheet having a conductor layer, and a multilayer printed wiring board obtained by processing the conductor layer of the laminate sheet into wiring.

Abstract translation: 本发明提供一种树脂组合物，包含具有1,000的重均分子量或更少具有，苯乙烯基团的多个交联组分和代表由下式：worin R是烃基骨架中，每个R 1秒的是一个氢原子 或烃基，每个R 2，R 3和R 4是氢原子或烷基，m为1〜4的整数，和n是2或更多，至少一个高分子量的整数 化合物的无机填料，和至少一种治疗剂，所说的无机填料; 其固化产物; 和半固化片，具有导体层的层压片和多层印刷电路板通过层叠片的导体层加工成布线获得。

公开(公告)号：EP0807703B1

公开(公告)日：2002-10-02

申请号：EP97107832.4

申请日：1997-05-14

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD

Inventor： Sakai, Masayuki ,  Hatanaka, Hideo ,  Tsukamoto, Masahide ,  Nakatani, Seiichi ,  Okano, Masayuki ,  Kojima, Tamao

IPC: D04H1/00 ,  D04H1/58 ,  H05K1/03 ,  D21H13/18

CPC classification number: H05K1/0366 ,  B32B15/14 ,  C08J5/04 ,  D04H1/00 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/64 ,  D21H13/26 ,  D21H17/52 ,  H05K1/024 ,  H05K2201/0239 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0783 ,  H05K2203/087 ,  H05K2203/097 ,  H05K2203/1105 ,  Y10T442/198 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2902 ,  Y10T442/626

公开(公告)号：EP1124770A1

公开(公告)日：2001-08-22

申请号：EP99951480.5

申请日：1999-10-08

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce, E. ,  ROBERTSON, Walter, J. ,  VELPARI, Vedagiri ,  LAMMON-HILINSKI, Kami ,  LAWTON, Ernest, L.

IPC: C03C25/10 ,  C08J5/08 ,  H05K1/03

CPC classification number: C08J5/08 ,  C03C25/47 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: One aspect of the present invention is a prepreg for an electronic support, the prepreg comprising: (a) a polymeric matrix material; and (b) a fabric comprising a strand comprising glass fibers, at least a portion of the fabric having a coating which is compatible with the polymeric matrix material, the prepreg having a drill tip percent wear of no greater than about 32 percent, as determined after drilling 2000 holes through a stack of 3 laminates, each laminate including eight of the prepregs, at a hole density of 62 holes per square centimeter (400 holes per square inch) and a chip load of 0.001 with a 0.46 mm (0.018 inch) diameter tungsten carbide drill. The present invention also provides a laminate incorporating the prepreg. Another aspect of the present invention is a prepreg for an electronic support, the prepreg comprising: (a) a polymeric matrix material; and (b) a woven reinforcement fabric comprising glass fibers, at least a portion of the fabric having a coating which is compatible with the polymeric matrix material, the prepreg having a deviation distance of no greater than about 36 micrometers, as determined after drilling 2000 holes through a stack of 3 laminates at a hole density of 62 holes per square centimeter (400 holes per square inch) and a chip load of 0.001 with a 0.46 mm (0.018 inch) diameter tungsten carbide drill. The present invention also provides a laminate incorporating the prepreg.

公开(公告)号：EP0960855A1

公开(公告)日：1999-12-01

申请号：EP99110058.7

申请日：1999-05-21

Applicant: Martinswerk GmbH für chemische und metallurgische Produktion

Inventor： Brown, Neil, Dr. ,  Aggleton, Michael, Dr.

IPC: C01F7/02 ,  H05K1/03 ,  B32B5/28 ,  B32B27/18

CPC classification number: B32B5/28 ,  B32B27/18 ,  C01F7/021 ,  C01P2004/51 ,  C01P2004/61 ,  C01P2006/12 ,  C01P2006/19 ,  C01P2006/32 ,  C09C1/407 ,  C09K21/02 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0239

Abstract: A non hygroscopic thermally stable aluminium hydroxide is described which is particularly useful for the preparation of thermally stable and fire retardant laminates for printed circuit boards.

Abstract translation: 描述了非吸湿热稳定的氢氧化铝，其特别可用于制备用于印刷电路板的热稳定和阻燃层压材料。

公开(公告)号：EP0703951B1

公开(公告)日：1998-07-15

申请号：EP94915446.2

申请日：1994-05-02

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： KROPP, Michael, A. ,  MAHONEY, Wayne, S.

IPC: C09D163/00 ,  C08G59/68 ,  H01B1/20 ,  C08G65/12

CPC classification number: H05K3/323 ,  C08G59/68 ,  C08L2666/02 ,  C09J163/00 ,  H05K2201/0129 ,  H05K2201/0239 ,  H05K2203/121 ,  Y10T428/2839 ,  Y10T428/2852

Abstract: An anisotropically conductive adhesive composition provides electrical conductivity between facing electrodes but maintains electric insulation laterally between adjacent electrodes and comprises (a) a cationically polymerizable monomer, such as a glycidyl epoxy resin; (b) a thermoplastic resin, essentially free of nucleophilic or metal complexing functional groups; (c) optionally, an alcohol containing material; (d) a thermally initiated catalyst system comprising: (1) a salt of an organometallic cation; (2) a cure rate enhancer; and (3) a stabilizing additive; (e) conductive particles; and (f) optionally, a silane coupling agent, wherein the adhesive compositions cure at a temperature of 120 DEG -125 DEG C.

公开(公告)号：EP0443401B1

公开(公告)日：1997-03-26

申请号：EP91101884.4

申请日：1991-02-11

Applicant: ROGERS CORPORATION

Inventor： Arthur, David J. ,  Swei, Gwo S.

IPC: C08K9/06 ,  H05K1/03 ,  H01L23/14

CPC classification number: C04B41/009 ,  C04B26/08 ,  C04B35/14 ,  C04B41/4584 ,  C04B2111/00844 ,  C08K9/04 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4626 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/29 ,  Y10T428/3154 ,  C04B14/06 ,  C04B20/1018 ,  C04B41/51 ,  C04B41/49 ,  C08L27/12 ,  H01L2924/00