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    PROCESS FOR PRODUCING WIRING BOARD, AND WIRING BOARD
    91.
    发明公开
    PROCESS FOR PRODUCING WIRING BOARD, AND WIRING BOARD 审中-公开
    VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE UND LEI​​TERPLATTE

    公开(公告)号：EP1863327A1

    公开(公告)日：2007-12-05

    申请号：EP05766427.8

    申请日：2005-07-21

    Applicant: Cluster Technology Co., Ltd

    Inventor： FUJIMOTO, Takayoshi, Cluster Technology Co., Ltd. ,  KITAOKA, Kenji, Cluster Technology Co., Ltd.

    IPC: H05K3/10 ,  H05K1/14 ,  H05K3/36

    CPC classification number: H05K3/4007 ,  H05K1/0284 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/182 ,  H05K3/246 ,  H05K3/3436 ,  H05K3/4614 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09472 ,  H05K2203/0709 ,  H05K2203/1173 ,  H05K2203/1189 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: A wiring circuit board and a method of producing the same are provided in which a desired pattern of wiring is provided at higher density while permitting no overflow from the grooves of an electroless plating catalyst containing solution and an electric conductor forming liquid such as silver ink.
    The pattern of electric conductor is deposited by applying the electric conductor forming liquid into the grooves provided in a substrate and distributing the same along the grooves with the action of capillarity. The method starts with patterning the grooves in the surface of the substrate (S1), applying the electric conductor forming liquid into the grooves (S2), and coating the surface of the substrate with a layer of repellent liquid which is lower in the affinity with the electric conductor forming liquid (S3). This is followed by cleaning at least the grooves (S4) and then filling the grooves with the electric conductor forming liquid once again (S5). The electric conductor forming liquid applied into the grooves is then distributed throughout the grooves by the action of capillarity. When silver ink is used, the pattern of electric conductor is produced by repeating an action of applying and drying a number of times. Alternatively, the patter of electric conductor can be produced by an electroless plating technique or a combination of an electroless plating technique and an electro-plating technique for separating an electrical conductive material form the electric conductor forming liquid.

    Abstract translation: 提供了一种布线电路板及其制造方法，其中以更高的密度提供所需的布线图形，同时不会从含化学镀电镀催化剂溶液的槽和诸如银墨的电导体形成液体的槽中溢出。 通过将导电剂形成液体施加到设置在基板中的凹槽中并通过毛细管作用沿着凹槽分布而将电导体的图案沉积。 该方法开始于图案化基板表面上的凹槽（S1），将导电剂形成液体施加到凹槽（S2）中，并且用一层与亲水性相差较小的驱避液体涂覆基板的表面， 导电体形成液体（S3）。 然后，至少清洗槽（S4），然后再次用导电体形成液填充槽（S5）。 然后通过毛细作用的作用将施加到槽中的电导体成形液分布在整个凹槽中。 当使用银墨时，通过重复施加和干燥多次的动作来产生电导体的图案。 或者，电导体的图案可以通过化学镀技术或化学镀技术和用于从形成电导体的液体分离导电材料的电镀技术的组合来制造。

    Elektrische Verbindung zwischen einem MID und einem Leitungskabel
    92.
    发明公开
    Elektrische Verbindung zwischen einem MID und einem Leitungskabel 审中-公开
    一个MID和电缆之间的电连接

    公开(公告)号：EP1783867A3

    公开(公告)日：2007-06-20

    申请号：EP06450159.6

    申请日：2006-11-07

    Applicant: I & T Innovation Technology Entwicklungs- und Holding Aktiengesellschaft

    Inventor： Ziegler, Wolfgang

    IPC: H01R12/12

    CPC classification number: H01R12/62 ,  H01R9/2466 ,  H01R43/24 ,  H01R2201/26 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/326 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10356 ,  H05K2201/1059 ,  H05K2201/10598

    Abstract: Die Erfindung betrifft ein Verfahren zum Herstellen einer elektrischen Verbindung zwischen einem Kabel (1) mit einem oder einer Vielzahl von elektrischen Leitern (1.1) und einer Schaltung (2) auf einem dreidimensionalen, insbesondere spritzgegossenen Schaltungsträger (3), umfassend die folgenden Schritte:
    - auf dem Schaltungsträger (3) wird ein Kontaktelement (4) ausgebildet, welches eine erhabene, metallisierte Oberfläche (4.1) aufweist, die mit der Schaltung (3) elektrisch verbunden ist;
    - in dem Kabel (1) wird eine Aussparung (5) in Form eines Durchgangsloches vorgesehen, wobei
    - die Aussparung (5) derart in das Kabel (1) eingebracht wird, dass sie wenigstens einen Leiter (1.1) in dem Kabel (1) vollständig durchdringt und dadurch eine leitende Oberfläche des Leiters (1.1) freilegt;
    - das Kabel (1) wird derart mit seiner Aussparung auf das Kontaktelement (4) geschoben, dass die freigelegte leitende Oberfläche des Leiters in einen elektrisch leitenden Kontakt mit der metallisierten Oberfläche (4.1) des Kontaktelementes (4) gelangt.

    Des weiteren betrifft die vorliegende Erfindung eine Baugruppe aus einem dreidimensionalen Schaltungsträger und einem Kabel mit einer entsprechenden elektrisch leitenden Verbindung zwischen den Bauteilen.

    MEHRSCHICHTIGER KÖRPER MIT UNTERSCHIEDLICH MIKROSTRUKTURIERTEN BEREICHEN MIT ELEKTRISCH LEITFÄHIGER BESCHICHTUNG
    93.
    发明公开
    MEHRSCHICHTIGER KÖRPER MIT UNTERSCHIEDLICH MIKROSTRUKTURIERTEN BEREICHEN MIT ELEKTRISCH LEITFÄHIGER BESCHICHTUNG 有权
    与导电被膜不同的微结构区多层体

    公开(公告)号：EP1785016A2

    公开(公告)日：2007-05-16

    申请号：EP05776119.9

    申请日：2005-08-24

    Applicant: OVD Kinegram AG

    Inventor： SCHILLING, Andreas ,  TOMPKIN, Wayne, Robert

    IPC: H05K3/12

    CPC classification number: H05K3/14 ,  B42D25/328 ,  G02B5/1857 ,  H05K2201/09036 ,  H05K2201/09045 ,  Y10T428/2457

    Abstract: The invention relates to a multilayer body (11, 12) comprising a replicating varnish layer (22). A first relief structure (25, 125, 65) is moulded into said replicating varnish layer (22) on a plane defined by coordinate axes x and y in the first area of the multilayer body and an electroconductive constant surface-density coating (23I, 23n, 123n) is applied to the replicating varnish layer (22) in the first area of the multilayer body (11, 12) and in the second adjacent area thereof. The first relief structure (25, 125, 65) is embodied in such a way that different structural elements thereof have a high depth/width ratio, in particular >2. At least one perpendicular or near-to-perpendicular flank extends along the entire or near-to-entire depth of the relief structure, thereby reducing or removing the coating electrocunductivity.

    THREE-DIMENSIONAL CIRCUIT BOARD
    96.
    发明公开
    THREE-DIMENSIONAL CIRCUIT BOARD 有权
    VERFAHREN ZUR HERSTELLUNG EINER DREIDIMENSIONALEN LEITERPLATTE

    公开(公告)号：EP1722613A1

    公开(公告)日：2006-11-15

    申请号：EP05710333.5

    申请日：2005-02-17

    Applicant: SANKYO KASEI CO., LTD.

    Inventor： YUMOTO, Tetsuo c/o Sankyo Kasei Co., Ltd.

    IPC: H05K1/11 ,  H05K1/02

    CPC classification number: G01R31/28 ,  H05K1/0284 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09854 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T29/49176

    Abstract: An object of the present invention is to prevent the damage of molding pins in an injection-molding die and to provide a secure deposit, thereby reducing circuit pitches to the limit. Pre-determined circuit patterns (3) of a conductive material are formed on both sides of a circuit board (2). A through hole (5) is formed on the circuit board (2) to carry electricity between the circuit patterns (3) on the both sides thereof. The inner shape of the through hole is narrow in a direction between the adjacent circuit patterns (3) and wide in a circuit extending direction.

    Abstract translation: 本发明的一个目的是防止注射成型模具中的模制销的损坏并提供牢固的沉积物，从而将电路间距减小到极限。 导电材料的预定电路图案（3）形成在电路板（2）的两侧。 在电路板（2）上形成通孔（5），以在其两侧的电路图案（3）之间承载电力。 通孔的内部形状在相邻的电路图案（3）之间的方向上窄，并且在电路延伸方向上宽。

    Patterning method
    98.
    发明公开
    Patterning method 审中-公开
    图案化方法

    公开(公告)号：EP1385364A3

    公开(公告)日：2005-03-02

    申请号：EP03254560.0

    申请日：2003-07-21

    Applicant: SEIKO EPSON CORPORATION

    Inventor： Kawase, Takeo, Epson Cambridge Laboratory

    IPC: B41M3/00 ,  G02B5/20 ,  G02F1/1335 ,  H05K3/12

    CPC classification number: H05K3/1258 ,  B41M3/006 ,  H05K3/125 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2203/0108 ,  H05K2203/013

    Abstract: A substrate is patterned by forming an indent region 8 in the surface 10 of a substrate 4 and depositing a liquid material onto the surface 10 at selected locations adjacent to the indent region 8. The liquid material spreads over the surface to an edge of the indent region, at which point further spreading is controlled by the effective enhancement of the contact angle of the liquid material relative to the surface as provided by the indent region.

    Abstract translation: 通过在基底4的表面10中形成凹陷区域8并且在与凹陷区域8相邻的选定位置处将液体材料沉积到表面10上来图案化基底。液体材料在表面上扩散到凹陷的边缘 区域，在该点处，通过液体材料相对于由凹陷区域提供的表面的接触角的有效增强来控制进一步的扩展。

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