公开(公告)号：EP0599595B1

公开(公告)日：1998-04-22

申请号：EP93309316.3

申请日：1993-11-23

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Keiichi, Nakao, Rejidensu Momoyama 103 ,  Noboru, Mohri

IPC: H05K3/46 ,  H01L21/48 ,  H05K3/00

CPC classification number: H01L21/486 ,  H01L21/4867 ,  H05K1/092 ,  H05K3/0029 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/09181 ,  H05K2203/025 ,  Y10T29/49163 ,  Y10T156/1057

公开(公告)号：EP0649562B1

公开(公告)日：1998-03-04

申请号：EP93917069.2

申请日：1993-07-08

Applicant: RAYCHEM CORPORATION

Inventor： GRAVES, Gregory, A. ,  ZHANG, Michael ,  CHANDLER, Daniel ,  CHANG, Chi-Ming Dep.of Chemical Engineering ,  FANG, Shou-Mean

IPC: H01C1/14 ,  H01C1/01 ,  H01C17/00 ,  H05K1/18

CPC classification number: H01C7/005 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H05K1/184 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613

Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising: (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals.

公开(公告)号：EP0582881B1

公开(公告)日：1997-12-29

申请号：EP93111860

申请日：1993-07-23

Applicant: MURATA MANUFACTURING CO

Inventor： KUBOTA KENJIN ,  SAKAI NORIO ,  KAWABATA SHOICHI

IPC: H01G2/06 ,  H01G4/232 ,  H01L21/66 ,  H01L23/10 ,  H01L23/498 ,  H01L23/58 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01G4/232 ,  H01G2/065 ,  H01L22/20 ,  H01L22/32 ,  H01L23/10 ,  H01L23/49805 ,  H01L2924/014 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/09563 ,  H05K2201/09845 ,  Y10T29/435 ,  Y10T29/49004 ,  Y10T29/4902 ,  Y10T29/49165 ,  Y10T29/49169

公开(公告)号：EP0796038A3

公开(公告)日：1997-11-05

申请号：EP97104425.0

申请日：1997-03-14

Applicant: TDK Corporation

Inventor： Hayashi, Katsuhiko

IPC: H05K9/00

CPC classification number: H05K3/3405 ,  H05K1/0237 ,  H05K3/341 ,  H05K3/403 ,  H05K5/0091 ,  H05K9/0039 ,  H05K2201/09181 ,  H05K2201/10371

Abstract: Downward projections made on two side walls of a cap are fitted into recesses in two opposed side faces of a substrate. Lower margins of two end walls of the cap are soldered to ground electrodes provided on a part mounting face of the substrate. Lower margins in the proximity of projections of the side walls of the cap are soldered to ground electrodes provided on the part mounting face above recesses of the substrate. Therefore, it is provided a high-frequency module that can produce a good electromagnetic shielding effect even in a high-frequency band.

公开(公告)号：EP0712266A3

公开(公告)日：1996-06-26

申请号：EP95308071.0

申请日：1995-11-10

Applicant: VLT CORPORATION

Inventor： Pullen, Stephen R. ,  Hedlund III,Walter R.

IPC: H05K5/00 ,  H05K7/20

CPC classification number: H05K7/20463 ,  H01L2224/05553 ,  H01L2224/73265 ,  H01L2924/09701 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0052 ,  H05K3/0061 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K3/42 ,  H05K5/0095 ,  H05K7/209 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/613 ,  Y10T29/49179 ,  Y10T29/49211

Abstract: A structure comprising a baseplate, a circuit board parallel and adjacent to the baseplate, and an electronic component is described. The circuit board has an edge with a scallop formed in the edge, and the scallop is plated with a conductive material. The electronic component includes a power-dissipating surface and a pad for making electrical connection. The electronic component is mounted with the power-dissipating surface in contact with the baseplate and the pad electrically connected to the conductive material.

Abstract translation: 描述了一种结构，包括基板，与基板平行且相邻的电路板以及电子部件。 电路板的边缘有一个边缘，边缘形成扇贝，扇贝镀有导电材料。 电子组件包括功率消耗表面和用于进行电连接的焊盘。 电子元件安装成使功率消散表面与基板接触并且焊盘电连接到导电材料。

公开(公告)号：EP0315792B1

公开(公告)日：1995-05-10

申请号：EP88117121.9

申请日：1988-10-14

Applicant: LORAL AEROSPACE CORPORATION

Inventor： Chall, Louis Edmond, Jr.

IPC: H01L23/48 ,  H05K7/20 ,  H01L23/52

CPC classification number: H01L23/52 ,  G01R31/318505 ,  G11C29/006 ,  H01L23/13 ,  H01L23/473 ,  H01L23/5385 ,  H01L2924/0002 ,  H01L2924/15162 ,  H01L2924/3011 ,  H05K1/0286 ,  H05K1/142 ,  H05K3/3442 ,  H05K3/403 ,  H05K7/20545 ,  H05K2201/09181 ,  H05K2201/09418 ,  H05K2201/1053 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP0599595A3

公开(公告)日：1994-12-21

申请号：EP93309316.3

申请日：1993-11-23

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Keiichi, Nakao, Rejidensu Momoyama 103 ,  Noboru, Mohri

IPC: H05K3/46 ,  H01L21/48 ,  H05K3/00

CPC classification number: H01L21/486 ,  H01L21/4867 ,  H05K1/092 ,  H05K3/0029 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/09181 ,  H05K2203/025 ,  Y10T29/49163 ,  Y10T156/1057

Abstract: For minimizing the size of a ceramic electronic device for elimination of noise in a digital circuit installed in an electric apparatus, a method comprises the steps of placing a ceramic layers structure encapsulating internal electrodes on a substrate which has a plurality of apertures arranged therein, making through holes in the ceramic layers structure by applying a sand blasting through the apertures of the substrate, and forming in the through holes external electrodes connected to the internal electrodes.

公开(公告)号：EP0599595A2

公开(公告)日：1994-06-01

申请号：EP93309316.3

申请日：1993-11-23

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Keiichi, Nakao, Rejidensu Momoyama 103 ,  Noboru, Mohri

IPC: H05K3/46 ,  H01L21/48 ,  H05K3/00

CPC classification number: H01L21/486 ,  H01L21/4867 ,  H05K1/092 ,  H05K3/0029 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/09181 ,  H05K2203/025 ,  Y10T29/49163 ,  Y10T156/1057

Abstract: For minimizing the size of a ceramic electronic device for elimination of noise in a digital circuit installed in an electric apparatus, a method comprises the steps of placing a ceramic layers structure encapsulating internal electrodes on a substrate which has a plurality of apertures arranged therein, making through holes in the ceramic layers structure by applying a sand blasting through the apertures of the substrate, and forming in the through holes external electrodes connected to the internal electrodes.

Abstract translation: 为了最小化用于消除安装在电子设备中的数字电路中的噪声的陶瓷电子器件的尺寸，一种方法包括以下步骤：将包封内电极的陶瓷层结构放置在其中布置有多个孔的衬底上， 在陶瓷层结构中通过穿过基板的孔进行喷砂并在通孔中形成连接到内部电极的外部电极。

公开(公告)号：EP0334397A2

公开(公告)日：1989-09-27

申请号：EP89109817.0

申请日：1985-05-16

Applicant: BRITISH TELECOMMUNICATIONS public limited company

Inventor： Whitehead, Graham Keith ,  Taylor, Kenneth

IPC: H01L23/50 ,  H01L23/12 ,  H01L23/14

CPC classification number: H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/244 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09181 ,  H05K2201/09709 ,  H05K2201/10727 ,  H05K2201/10909 ,  H05K2203/0723 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: A circuit board may be moulded from an aromatic thermoplastic material, the circuit board (1) comprising one or more die attachment sites (8) moulded therein preferably with the die attachment site recessed so that the surface of the die (9) is co-planar with conductive tracks on the board. The die attachment sites may be moulded with a relief pattern (30) therein so that thermally induced strains of an attached die are reduced.
Also for the same reason a heat sink may be attached underneath the carrier below the carrier's die attachment site and thermally conductive material may connect them together. The heat sink may be used for mechanical anchorage.

Abstract translation: 电路板可以由芳族热塑性材料模制而成，其中电路板（1）包括一个或多个在其中模制的模具附着位置（8），其中模具附接部位凹进，使得模具（9）的表面共同 与板上的导电轨道平面。 模具附接部位可以用其中的浮雕图案（30）模制，使得附着的模具的热诱导应变减小。 同样的原因，散热器可以在载体下方的载体的芯片附接位置附着，并且导热材料可以将它们连接在一起。 散热器可用于机械锚固。

公开(公告)号：EP0149932A1

公开(公告)日：1985-07-31

申请号：EP84402372.1

申请日：1984-11-21

Applicant: INTERCONNEXIONS CERAMIQUES S.A.

Inventor： Dubuisson, Jacques ,  Le Gal, Pascal

IPC: H05K1/16 ,  H01L29/80

CPC classification number: H05K1/024 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/0187 ,  H05K2201/049 ,  H05K2201/09181 ,  Y10T29/435 ,  H01L2924/00

Abstract: L'invention concerne un support (100) pour composant (30) rapide, notamment composant hyperfréquence, en forme de bloc fritté de feuilles empilées de céramique de forte constante diélectrique, apte à recevoir des métallisations superficielles (21-24) formant connexions de raccordement aux bornes du composant.
Selon l'invention, il comprend une zone centrale (110) émergeant en surface du support, s'étendant sensiblement au droit de l'emplacement du composant (30) supporté, et formée d'un matériau de faible constante diélectrique; il est prévu, hors de la zone centrale et à la périphérie de celle-ci, sous la surface du support et à faible profondeur (e), au moins une métallisation interne (131, 132) formée par un motif conducteur porté par l'une des feuilles de l'empilement et relié à une connexion de masse (141,142), la métallisation interne (131; 132) et l'une des métallisations superficielles (21; 22) ayant des surfaces en regard de manière à constituer un condensateur de découplage pour la borne du composant à laquelle est reliée cette métallisation superficielle.