公开(公告)号：EP1335389A1

公开(公告)日：2003-08-13

申请号：EP01934417.5

申请日：2001-05-30

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： WAKIYA, Takeshi c/o Sekisui Chemical Co., Ltd. ,  MORITA, Takeharu c/o Sekisui Chemical Co., Ltd. ,  HIRAIKE, Hiroshi c/o Sekisui Chemical Co., Ltd. ,  NAGAI, Katsutoshi ,  TANIGUCHI, Tatsuo

IPC: H01B5/00 ,  C08F2/44 ,  C08F292/00

CPC classification number: H01B1/22 ,  B82Y30/00 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C08F2/44 ,  C08F292/00 ,  C08L51/08 ,  C09C3/10 ,  C09D5/24 ,  H01B1/02 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0239 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/2804 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998

Abstract: It is an object of the invention to provide coated particles excellent in the reliability of connection.
The invention provides coated particles each comprising a metal-surfaced particle as a core and resulting from a partial surface modification of that core particle with an organic compound via a functional group (A) capable of binding to a metal.

Abstract translation: 本发明的目的是提供连接可靠性优异的涂覆颗粒。 本发明提供了包含金属表面的颗粒作为核心并由有机化合物通过能够与金属结合的官能团（A））部分地表面改性核心颗粒的涂层颗粒。

公开(公告)号：EP0996321A3

公开(公告)日：2003-02-12

申请号：EP99306548.1

申请日：1999-08-19

Applicant: SONY CHEMICALS CORPORATION

Inventor： Yamada, Yukio, Sony Chemicals Corporation ,  Saito, Masao, Sony Chemicals Corporation ,  Shinozaki, Junji, Sony Chemicals Corporation ,  Takeichi, Motohide, c/o Sony Chemicals Corporation

IPC: H05K3/32 ,  H01L21/60 ,  H01R4/04

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0266 ,  H05K2201/10674 ,  H01L2924/00

Abstract: An anisotropically electroconductive adhesive to be used for establishing electric connection between terminals (15) of, for example, an IC chip (14) and of a circuit pattern (17), at a low cost with high reliabilities both in the establishment of electric connection and in the insulation upon the connection without suffering from short-circuiting between circuit lines in the circuit and without causing any obstruction on the circuit, even when the terminals (15) or the circuit lines (17) are disposed at close intervals, which adhesive (10) comprises an electrically insulating adhesive matrix (13) and electroconductive particles (11,12) dispersed in the matrix (13), wherein the electroconductive particles (11,12) comprise at least two electroconductive particulate products of different average particle sizes and wherein each particle of both the particulate products (11,12) is coated with an electrically insulating resin insoluble in the insulating adhesive matrix (13).

Abstract translation: 用于在例如IC芯片和电路图案的端子之间建立电连接的各向异性导电粘合剂以低成本建立电连接并且在连接时的绝缘性中不受损害 即使当端子或电路线以紧密的间隔设置时，即使在电路中的电路线之间短路并且不引起电路上的任何障碍，该粘合剂包括电绝缘粘合剂基质和分散在基质中的导电颗粒，其中 导电颗粒包含至少两种不同平均粒径的导电颗粒产品，并且其中两种颗粒产品的每个颗粒都涂覆有不溶于绝缘粘合剂基质的电绝缘树脂。

公开(公告)号：EP1278211A1

公开(公告)日：2003-01-22

申请号：EP02255043.8

申请日：2002-07-17

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Fujiki, Hironao, Silicone-Electr. Mat. Res. Ctr. ,  Fukushima, Motoo, Silicone-Electr. Mat. Res. Ctr.

IPC: H01B1/04 ,  H01B1/20 ,  C08L83/04 ,  C08L83/06 ,  C08L83/12 ,  H01B1/22

CPC classification number: H01B1/22 ,  C08G65/007 ,  C08G65/336 ,  C08G77/12 ,  C08G77/20 ,  C08G77/46 ,  C08K9/02 ,  C08L83/04 ,  H01B1/20 ,  H05K1/095 ,  H05K2201/0221 ,  H05K2201/0254 ,  H05K2203/159 ,  C08L83/00

Abstract: A conductive composition is obtained by dispersing conductive particles in a curable polymer. At least 50% by weight of the entire conductive particles are those conductive particles coated with a metal on their outermost layer surface and having a specific gravity which differs within ±1.5 from the specific gravity of the curable polymer. The composition remains stable during storage, experiences a minimal change with time of curability, and cures into a conductive rubber which experiences a minimal change with time of volume resistivity.

Abstract translation: 通过将导电颗粒分散在可固化聚合物中来获得导电组合物。 整个导电颗粒的至少50重量％是在其最外层表面上涂覆有金属的导电颗粒，其比重与可固化聚合物的比重在+/- 1.5内不同。 该组合物在储存过程中保持稳定，随着固化时间的变化经历最小的变化，并且固化成导电橡胶，其体积电阻率随时间经历最小变化。

公开(公告)号：EP0387066A1

公开(公告)日：1990-09-12

申请号：EP90302493.3

申请日：1990-03-08

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Tsukagoshi, Isao ,  Yamaguchi, Yutaka ,  Nakajima, Atsuo ,  Goto, Yasushi

IPC: H01L21/60 ,  H01L21/58

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L24/13 ,  H01L24/29 ,  H01L2224/13019 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  Y10T29/4913 ,  Y10T156/1075 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

Abstract: A process for electrically connecting circuits wherein at least one circuit (4) is provided on an insulating layer (3) and has a plurality of projecting electrodes (2) which are deformable under pressure in the circuit connecting operation, wherein an insulating adhesive having a volatile content of 0.5% or less by weight and comprising

(i) a liquid epoxy resin,
(ii) a solid resin having one or more functional groups and
(iii) a microcapsule type curing agent, in the form of a film (5) having a thickness of 50µm or less,
is interposed between the circuits and is substantially cured after the projecting electrodes have been contacted with the opposing circuits by applying heat and pressure at the time of connection.

Abstract translation: 一种用于电连接电路的方法，其中至少一个电路（4）设置在绝缘层（3）上并且具有多个在电路连接操作中在压力下可变形的突出电极（2），其中绝缘粘合剂具有 挥发物含量为0.5重量％以下，并且包含（i）液体环氧树脂，（ii）具有一个或多个官能团的固体树脂和（iii）薄膜（5）形式的微胶囊型固化剂， 厚度为50μm以下，插入在电路之间，并且在连接后通过施加热和压力使突出电极与相对电路接触后基本固化。

公开(公告)号：EP0242025A1

公开(公告)日：1987-10-21

申请号：EP87301263.7

申请日：1987-02-13

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Tsukagoshi, Isao ,  Yamaguchi, Yutaka ,  Nakajima, Atsuo ,  Mikami, Yoshikatsu ,  Muto, Kuniteru ,  Ikezoe, Yoshiyuki

IPC: H01B1/22 ,  H01R4/04

CPC classification number: H01R4/04 ,  H01B1/22 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/068 ,  Y10T29/49194

Abstract: Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or film capable of exhibiting anisotropic-­electroconductivity comprising an electrically insulating adhesive component and electroconductive particles each particle comprising a polymeric core material coated with a thin metal layer.

Abstract translation: 具有高可靠性的导体良好的连接可以通过使用粘接剂组合物或薄膜能够显示出各向异性导电包括电绝缘粘合剂组分和导电颗粒每个颗粒包含涂覆有薄金属层的聚合物芯材来完成。

公开(公告)号：EP0179805A1

公开(公告)日：1986-05-07

申请号：EP85901804.0

申请日：1985-04-16

Applicant: AMP INCORPORATED (a New Jersey corporation)

Inventor： DERY, Ronald, Allen ,  JONES, Warren, Charlie ,  LYNN, William, Joseph ,  ROWLETTE, John, Robert

IPC: H01B1 ,  H05K3 ,  H01H1

CPC classification number: H05K3/323 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H01H1/029 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233

Abstract: Composition adhésive anisotropiquement conductrice (10) à utiliser pour connecter électriquement au moins une zone conductrice (14) placée sur un substrat (12) à au moins une zone conductrice (20) placée sur un second substrat (18). La composition (10) consiste en un mélange de particules conductrices et d'un liant adhésif non conducteur (26). Les particules conductrices sont dispersées à travers le liant dans plusieurs éléments conducteurs non contigus (24), de manière que, en appliquant une couche (30) de la composition (10) sur la zone conductrice et la zone isolante (14, 16) sur un substrat (12) et en plaçant dans une relation de conductivité et en faisant adhérer au moins ladite zone conductrice (20) sur le second substrat (18) à au moins ladite zone conductrice (14) sur le premier substrat (12), les éléments (24) établissent une connexion électrique entre les zones conductrices adhérées (14, 20) sur les deux substrats (12, 18). Les éléments (24), toutefois, sont suffisamment espacés entre eux pour empêcher une conductivité électrique entre les zones adjacentes sur le même substrat. Sont également décrits un procédé de connexion électrique des zones conductrices sur deux substrats au moyen de cette composition adhésive anisotropiquement conductrice (0) ainsi que des produits fabriqués en utilisant ce procédé.

公开(公告)号：EP1868422B1

公开(公告)日：2016-06-15

申请号：EP07107196.3

申请日：2007-04-30

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： OI, Kiyoshi

IPC: H05K1/18 ,  H05K3/46

CPC classification number: H05K3/4046 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/24 ,  H01L24/82 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/0221 ,  H05K2201/096 ,  H05K2201/10234 ,  H01L2224/29099 ,  H01L2924/00

公开(公告)号：EP2963655A1

公开(公告)日：2016-01-06

申请号：EP14756789.5

申请日：2014-02-28

Applicant: Sekisui Chemical Co., Ltd.

Inventor： ISHIDA, Hiroya ,  MATSUSHITA, Kiyoto

IPC: H01B5/00 ,  B22F1/02 ,  H01B1/00 ,  H01B1/22 ,  H01B5/16 ,  H01R11/01

CPC classification number: H01B1/22 ,  B22F1/025 ,  B23K35/0244 ,  B23K35/262 ,  C22C13/00 ,  C23C18/1635 ,  C23C18/1651 ,  C23C18/1653 ,  C25D5/12 ,  H01B1/02 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29457 ,  H01L2224/29464 ,  H01L2224/29466 ,  H01L2224/29469 ,  H01L2224/29481 ,  H01L2224/29487 ,  H01L2224/32227 ,  H01L2224/83191 ,  H01L2224/834 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2224/83851 ,  H01L2924/3512 ,  H01L2924/3651 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2203/0425 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/05342 ,  H01L2924/01015 ,  H01L2924/01005 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01032 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01029

Abstract: The present invention aims to provide electroconductive microparticles which are less likely to cause disconnection due to breakage of connection interfaces between electrodes and the electroconductive microparticles even under application of an impact by dropping or the like and are less likely to be fatigued even after repetitive heating and cooling, and an anisotropic electroconductive material and an electroconductive connection structure each produced using the electroconductive microparticles. The present invention relates to electroconductive microparticles each including at least an electroconductive metal layer, a barrier layer, a copper layer, and a solder layer containing tin that are laminated in said order on a surface of a core particle made of a resin or metal, the copper layer and the solder layer being in contact with each other directly, the copper layer directly in contact with the solder layer containing copper at a ratio of 0.5 to 5 % by weight relative to tin contained in the solder layer.

Abstract translation: 本发明的目的在于提供一种导电性微粒，即使在通过滴下等施加冲击时，由于电极和导电性微粒之间的连接界面的断裂，也不太可能导致断开，并且即使在重复加热之后也不易疲劳， 冷却，各向异性导电材料和导电连接结构，均使用导电性微粒制造。 本发明涉及在由树脂或金属制成的核心颗粒的表面上至少包含导电金属层，阻挡层，铜层和含锡的焊料层按顺序层叠的导电性微粒， 铜层和焊料层直接相互接触，铜层与含有铜的焊料层直接相对于焊料层中所含的锡的重量比为0.5〜5重量％。

公开(公告)号：EP1868422A3

公开(公告)日：2014-01-08

申请号：EP07107196.3

申请日：2007-04-30

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： OI, Kiyoshi

IPC: H05K1/18 ,  H05K3/46

CPC classification number: H05K3/4046 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/24 ,  H01L24/82 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/0221 ,  H05K2201/096 ,  H05K2201/10234 ,  H01L2224/29099 ,  H01L2924/00

Abstract: In an electronic component built-in substrate of the present invention, an electronic component (41, 42, 43) is mounted on a mounted body (5) having a first wiring layer (12), the electronic component (41, 42, 43) is embedded in an insulating layer (25), a conductive ball (30) is arranged to pass through the insulating layer (25) and connected electrically to the first wiring layer (12), a second wiring layer (14) connected electrically to the conductive ball (30) is formed on the insulating layer (25), and the first wiring layer (12) and the second wiring layer (14) are interlayer-connected via the conductive ball (30).

公开(公告)号：EP2582214A3

公开(公告)日：2014-01-01

申请号：EP12188121.3

申请日：2012-10-11

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Hamada, Yoshitaka ,  Yamakawa, Naoki

IPC: H05K1/09 ,  C09D11/00 ,  H05K3/12 ,  H01L23/482

CPC classification number: H05K1/095 ,  C09D11/037 ,  C09D11/52 ,  H01L2924/0002 ,  H05K3/1216 ,  H05K3/1283 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0245 ,  H01L2924/00

Abstract: A conductive circuit is formed by printing a pattern using a conductive ink composition and heat curing the pattern. A thixotropic agent, typically carbon black is added to the solvent-free ink composition comprising an addition type silicone resin precursor, a curing catalyst, and conductive particles. The ink composition has such thixotropy that the printed pattern may retain its shape after curing.

Abstract translation: 导电电路通过使用导电油墨组合物印刷图案并加热固化该图案而形成。 通常将炭黑添加到包含加成型有机硅树脂前体，固化催化剂和导电颗粒的无溶剂墨水组合物中。 油墨组合物具有这样的触变性，以致印刷图案在固化后可保持其形状。