公开(公告)号：EP1427013A3

公开(公告)日：2004-07-07

申请号：EP04005427.2

申请日：2000-09-20

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Haupt, Detlef ,  Maurer, Thomas

IPC: H01L23/367 ,  H05K1/02

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/0969 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10772 ,  H01L2924/00

Abstract: Das Steuergerät (20) ist mit einem elektrischen Bauelement (2) bestückt, in dem Wärme erzeugt wird. Diese wird über ein längliches Metallteil (21) abgeführt wird, dessen eine Stirnfläche (22) mit dem Bauelement (2) verlötet ist. Die dem Bauelement (2) zugewandte Stirnfläche (22) weist eine ihre Oberfläche vergrößernde Gestalt auf. Sie ist nach außen gewölbt ausgebildet und kann mit einer Riffelung versehen sein.

公开(公告)号：EP1214741A2

公开(公告)日：2002-06-19

申请号：EP00963990.7

申请日：2000-09-20

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： MAURER, Thomas ,  HAUPT, Detlef

IPC: H01L23/367

CPC classification number: H01L23/367 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/0969 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10772 ,  H01L2924/00

Abstract: The control device (1) is equipped with an electrical component (2) in which heat is generated. Said heat is dissipated over an elongated metal part (10) whose one face (12) is soldered to the component (2). The face (12) oriented toward the component (2) has a shape that increases the size of its surface. The shape is outwardly arched and can be provided with a ribbing.

公开(公告)号：EP1044082A1

公开(公告)日：2000-10-18

申请号：EP98956935.5

申请日：1998-11-19

Applicant: Leica Geosystems AG ,  MTA Automation AG

Inventor： REMY DE GRAFFENRIED, Christian

IPC: B23K1/005

CPC classification number: B23K1/0056 ,  B23K2201/40 ,  G02B6/4238 ,  G02B7/00 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/0373 ,  H05K2201/10772 ,  H05K2201/10969 ,  H05K2203/101 ,  Y02P70/613 ,  Y10T29/4913

Abstract: The invention relates to a method for fixing an especially modularly mounted, miniaturised component (2) onto a base plate (1) by means of a soldered joint. One side (4) of the component (2) is coated with a layer (5) of soldering material and the base plate (1) is coated at least partially with a layer of metal (6, 6', 6''). The component (2) is positioned above the base plate (1) with the metal layer and the layer of soldering material (5) facing each other without touching, at a vertical distance from each other. Heat energy is then supplied from the side of the base plate (1) in order to melt the soldering material of the soldering material layer (5) on the side (4) of the component (2) until a drop is formed. The component (2) and the base plate (1) are mutually fixed to each other when the drop of soldering material (5') fills the gap between them.

公开(公告)号：EP0917191A3

公开(公告)日：2000-05-24

申请号：EP98121864.7

申请日：1998-11-17

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD

Inventor： Oishi, Junji ,  Nagai, Kenichi

IPC: H01L21/60 ,  H01L21/56

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/498 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/111 ,  H05K3/28 ,  H05K3/321 ,  H05K3/382 ,  H05K2201/017 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/025 ,  H05K2203/0307 ,  H05K2203/095 ,  Y02P70/611 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: In an electronic component unit, in order to prevent the occurrence of connection trouble between the connecting area of a conductive pattern and the electrode of an electronic component, the surface of connecting area 4a of conductive pattern 4 formed on substrate 1 is roughened, and the protruding electrode 7a of a semiconductor integrated circuit 7 is connected with the roughened surface of connecting area 4a by means of an electroconductive adhesive 8.

公开(公告)号：EP0876518A4

公开(公告)日：1999-11-10

申请号：EP97901913

申请日：1997-01-10

Applicant: MICROMODULE SYSTEMS INC

Inventor： LYKINS JAMES L III

IPC: C25D5/16 ,  C25D5/18 ,  H01R13/03 ,  H05K3/24 ,  H05K3/40 ,  C25D5/00 ,  B32B15/08 ,  C25D5/34

CPC classification number: H01R13/03 ,  C25D5/16 ,  C25D5/18 ,  H05K3/241 ,  H05K3/4007 ,  H05K2201/0373 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12569 ,  Y10T428/12993

Abstract: A method for rendering a surface of a contact rough includes submerging the surface of the contact in an electroplating bath (18) having a dissolved metal salt, and pulsing an electric current through the contact and the bath (18) to form a rough metallic structure on the surface of the contact.

公开(公告)号：EP0508946B1

公开(公告)日：1996-07-24

申请号：EP92810184.9

申请日：1992-03-12

Applicant: Dyconex AG

Inventor： Schmidt, Walter, Dr. ,  Martinelli, Marco

IPC: B32B15/08 ,  H05K3/38

CPC classification number: B32B15/08 ,  B29C37/0082 ,  B32B3/30 ,  B32B2311/12 ,  B32B2457/08 ,  C23F1/02 ,  H05K1/056 ,  H05K3/064 ,  H05K3/383 ,  H05K3/384 ,  H05K3/44 ,  H05K2201/0338 ,  H05K2201/0373 ,  H05K2201/068 ,  H05K2203/0323 ,  H05K2203/0723

公开(公告)号：EP0615290A3

公开(公告)日：1994-11-17

申请号：EP94102227.9

申请日：1994-02-14

Applicant: International Business Machines Corporation

Inventor： Deutsch, Alina ,  Lewis, David Andrew ,  Narayan. Chandrasekhar ,  Plachy,Anthony Louis

IPC: H01L23/538 ,  H01L23/64

CPC classification number: H01L23/5385 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0216 ,  H05K1/0289 ,  H05K1/111 ,  H05K3/4614 ,  H05K2201/0373 ,  H05K2201/0792 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/10719 ,  H05K2203/061 ,  Y02P70/611 ,  H01L2924/00

Abstract: Electrical interconnection structures are described. The electrical interconnection structures are formed by electrically interconnecting in a stack a plurality of discrete substrates (22, 24). By using a plurality of discrete substrates, a multilayer dielectric/electrical conductor structure can be fabricated from individual discrete substrates each of which can be tested prior to forming a composite stack so that defects in each discrete substrate can be eliminated before inclusion into the stack. Electrical interconnection between adjacent substrate is provided by an array of contact locations on each surface of the adjacent substrates. Corresponding contacts on adjacent substrates are adapted for mutual electrical engagement. Adjacent contact locations can be thermocompression bonded. To reduce the parasitic capacitance and coupled noise between the contact pads (26) the electrical conductors within the interior of each discrete substrate, the contact pads on each substrate have elongated shape. The elongated contact pads or lattice pads on adjacent substrates are nonparallel and preferably orthogonal so that the corresponding pads of adjacent substrates electrically interconnect an intersecting area which varies in location along the elongated contact pads as the placement of the adjacent substrates varies in the manufacture thereof.

Abstract translation: 描述电互连结构。 电互连结构通过在堆叠中电互连而形成，多个分立的衬底（22,24）。 通过使用多个分立的衬底，多层电介质/电导体结构可以由单独的离散衬底制成，每个离散衬底可以在形成复合堆叠之前进行测试，从而在包含在堆叠中之前可以消除每个离散衬底中的缺陷。 相邻基板之间的电气互连由相邻基板的每个表面上的接触位置阵列提供。 相邻基板上的对应接点适于相互电接合。 相邻的接触位置可以热压粘合。 为了减小接触焊盘（26）之间的寄生电容和耦合噪声，每个离散衬底内部的电导体，每个衬底上的接触焊盘具有细长形状。 相邻基板上的细长接触焊盘或网格焊盘是不平行的并且优选地是正交的，使得相邻衬底的相应衬垫在相邻衬底的布置在其制造中变化时，沿着细长接触焊盘的位置电连接沿着位置变化的交叉区域。

公开(公告)号：EP0594409A1

公开(公告)日：1994-04-27

申请号：EP93308328.9

申请日：1993-10-19

Applicant: NIPPON CMK CORP.

Inventor： Kawakami, Shin, c/o Nippon CMK Corp.

IPC: H01R9/09

CPC classification number: H05K3/4046 ,  H01R12/523 ,  H01R43/02 ,  H05K1/0298 ,  H05K3/3447 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/0373 ,  H05K2201/09845

Abstract: A connection device which electrically connects given circuits (6,7) on a double-sided (E) or multi-layer printed wiring board via through holes (10) drilled in each board. The connection device includes a main body made of insulating material, and a lead wire (3), which is made of a bundle of a plurality of twisted fine lines, extends from the main body, and the lead end of which is cone-shaped.

Abstract translation: 一种连接装置，其通过在每个板上钻出的通孔（10）将双面（E）或多层印刷线路板上的给定电路（6,7）电连接。 连接装置包括由绝缘材料制成的主体以及由多根扭曲的细线束组成的引线（3），所述引线（3）从主体延伸并且其引线端是锥形的 。

公开(公告)号：EP0568311A2

公开(公告)日：1993-11-03

申请号：EP93303270.8

申请日：1993-04-27

Applicant: Nippon CMK Corp.

Inventor： Kawakami, Shin, c/o Nippon CMK Corp.

IPC: H05K3/46 ,  H05K3/40 ,  H01R9/09

CPC classification number: H05K3/4046 ,  H01R12/523 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4038 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0373 ,  H05K2201/09845 ,  H05K2201/10287 ,  H05K2203/063

Abstract: A method of manufacturing a multilayer printed wiring board is disclosed. In the disclosed method, respective layers of a multilayer printed wiring board are formed with respective printed wiring boards (1, 4, 6), respective printed wiring boards are laminated and pasted up, and necessary circuits of the printed wiring board are electrically connected by means of through holes punched into the respective printed wiring boards. The method comprises the steps of: making the outer diameter of a connecting land (8,9) of the printed wiring board positioned at an inner layer of the respective printed wiring boards forming respective layers, larger than through hole (13,14) diameter of connecting lands (10,11) of the printed wiring board positioned at an outer layer of the respective printed wiring boards; making the through hole (13,14) diameter of connecting lands (10,11) of the printed wiring board positioned at an outer layer of the respective printed wiring boards larger than the through hole (12) diameter of the connecting lands (8,9) of the printed wiring board positioned at an inner layer of the respective printed wiring boards; inserting a plurality of fine wires (16) into respective through holes punched in the respective printed wiring boards; filling up solder (17) into the through holes of the connecting lands by capillary action; and electrically connecting necessary circuits between the respective printed wiring boards with each other.

Abstract translation: 公开了一种制造多层印刷电路板的方法。 在所公开的方法中，多层印刷电路板的各层形成有各自的印刷电路板（1,4,6），各个印刷电路板被层叠并粘贴，印刷电路板的必要电路通过 穿过各个印刷电路板的通孔的装置。 该方法包括以下步骤：使位于各印刷电路板的内层的印刷电路板的连接焊盘（8,9）的外径形成各自的层，比通孔（13,14）的直径大 位于各印刷电路板的外层的印刷线路板的连接台（10,11）; 使位于各印刷电路板的外层的印刷电路板的连接焊盘（10,11）的直径大于连接焊盘（8）的通孔（12）的直径， 9）位于各印刷电路板的内层的印刷电路板; 将多根细线（16）插入各个印刷电路板上冲孔的相应通孔中; 通过毛细作用将焊料（17）填充到连接焊盘的通孔中; 并且将各个印刷线路板之间的必要电路彼此电连接。

公开(公告)号：EP0385787A2

公开(公告)日：1990-09-05

申请号：EP90302214.3

申请日：1990-03-01

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Matsubara, Hiroshi

IPC: H01L21/60 ,  H01L23/485

CPC classification number: H01L24/10 ,  G02F1/13452 ,  H01L21/563 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05124 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/11015 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/1319 ,  H01L2224/136 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29399 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/29416 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/06 ,  H05K3/102 ,  H05K3/247 ,  H05K3/321 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0373 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/01014

Abstract: A connection electrodes (12) producing method has a step of forming resin layer (13) which can be softened after hardened, on a circuit substrate (11) on which an electrode pattern is formed. Then, only the resin layer material on the electrode pattern is cured and left. Thereafter, conductive particles (14) are adhered to only the resin layer on the electrode pattern by softening the resin layer and by scattering the conductive particles on the circuit substrate with the softened resin layer.

Abstract translation: 连接电极（12）的制造方法具有在形成有电极图案的电路基板（11）上形成硬化后能够软化的树脂层（13）的工序。 然后，仅将电极图案上的树脂层材料固化并残留。 此后，通过使树脂层软化，并且通过软化树脂层将导电颗粒散布在电路基板上，导电颗粒（14）仅粘附在电极图案上的树脂层上。