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    Method for connecting at last one wire conductor disposed on a substrate with a chip of a transponder unit
    17.
    发明公开
    Method for connecting at last one wire conductor disposed on a substrate with a chip of a transponder unit 有权
    一种用于在一个转发器单元，其具有芯片的基板上连接至少一个电线导体的方法

    公开(公告)号：EP2302566A1

    公开(公告)日：2011-03-30

    申请号：EP09012053.6

    申请日：2009-09-22

    Applicant: ats Automation Technology Services

    Inventor： Fergus Hynes ,  Garreth Finlay

    IPC: G06K19/077 ,  H05K1/18

    CPC classification number: G06K19/07749 ,  G06K19/0775 ,  H05K1/184 ,  H05K3/103 ,  H05K3/328 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/10287 ,  H05K2201/10727

    Abstract: Method for connecting at least one wire conductor (6) with at least one terminal device (22a, 22b) of a chip module (5) for producing a transponder device (1) comprising a coil device (2) and said chip module (5), wherein, in a first method step, the coil device (2) is disposed and fixed on a substrate (3),and, in a further method step, the wire conductor (6) of the coil device (2) is connected to the chip module (5), characterised in that , during the first method step, end portions (7a, 7b) of the wire conductor (6) are laid so as to extend across the accommodating window (4) in a spaced-apart relation in a central area (Z) of an accommodating window (4) for the chip module (5), the partial areas (8a, 8b) of the wire conductor (6) extending across the accommodating window (4) are displaced from said central area (Z) towards a corresponding edge (23a, 23b) of the accommodating window (4) by means of a positioning device (3) until at least a section of the partial area (8a, 8b) extends over the desired position of a terminal area (22a, 22b), the chip module (5) is subsequently inserted into the accommodating window (4) and the section is then connected in an electrically conductive manner with the terminal area (22a, 22b).

    Abstract translation: 用于连接至少一个线导体的方法（6）与至少一个终端设备（22A，22B）的芯片模块（5），用于生产（1），包括线圈装置的应答器设备（2）和所述芯片模块（5 ）worin，在第一方法步骤中，将线圈装置（2）设置并固定在一个基片（3），并且在进一步的方法步骤中，导线导体（6），线圈装置（2）连接 到芯片模块（5），在第一方法步骤中该特征的，端部（7A，7B）的金属丝导体（6）布置成以间隔开的穿过容纳窗口（4）延伸的 在容纳窗口的中心区域（Z）的关系（4）芯片模块（5），该部分区域（8A，8B）的金属丝导体（6）在整个容纳窗口延伸的（4）从所述移位 中央区域（Z）朝向相应的边缘（23A，23B）通过定位装置的手段的容纳窗口（4）的（3），直到至少部分区域的部分（8A，8B）延伸 在终端区域的所希望的位置（22A，22B），所述芯片模块（5）随后插入到容纳窗（4）和部分随后与终端区域连接在导电的方式（22A，22B） ，

    FLEXIBLE PRINTED WIRING BOARD
    20.
    发明公开
    FLEXIBLE PRINTED WIRING BOARD 审中-公开
    柔性印刷线路板

    公开(公告)号：EP2120516A1

    公开(公告)日：2009-11-18

    申请号：EP08711398.1

    申请日：2008-02-15

    Applicant: Sumitomo Electric Industries, Ltd. ,  Sumitomo Electric Printed Circuits, Inc.

    Inventor： OKA, Yoshio ,  KASUGA, Takashi ,  PARK, Jinjoo ,  NAKAMA, Kouki

    IPC: H05K1/11

    CPC classification number: H05K3/4685 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/118 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0394 ,  H05K2201/10363 ,  H05K2203/1581

    Abstract: A flexible printed wiring board 1 includes a substrate 2, conductor wirings 3 and 4, a coverlay film 5, a jumper wiring 11, and through holes 9 and 10. The conductor wirings 3 and 4 are disposed on a first surface 2a of the substrate 2. The coverlay film 5 covers at least part of the conductor wirings 3 and 4. The jumper wiring 11 electrically connects the conductor wirings 3 and 4 to each other. The through holes 9 and 10 are formed in the substrate 2 and respectively open to the surfaces of the conductor wirings 3 and 4. The jumper wiring 11 is composed of a hardened material of a conductive paste and is formed so that a second surface 2b of the substrate 2 is continuous with respective surfaces 3a and 4a of the conductor wirings 3 and 4 to which the through holes 9 and 10 open.

    Abstract translation: 柔性印刷布线板1包括基板2，导体布线3和4，覆盖膜5，跨接布线11以及通孔9和10.导体布线3和4布置在基板的第一表面2a上 覆盖膜5覆盖导体布线3和4的至少一部分。跳线布线11将导体布线3和4彼此电连接。 通孔9和10形成在衬底2中并分别在导体布线3和4的表面开口。跨接布线11由导电浆料的硬化材料构成，并且形成为使得第二表面2b 基板2与通孔9和10打开的导体布线3和4的相应表面3a和4a连续。

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