公开(公告)号：EP1749310B1

公开(公告)日：2010-05-12

申请号：EP05766585.3

申请日：2005-05-26

Applicant: Commissariat à l'énergie atomique et aux énergies alternatives

Inventor： LE BLEVENNEC, Gilles ,  PRENE, Philippe

IPC: H01L21/20 ,  H01L29/786

CPC classification number: H01L21/02362 ,  H01L21/02126 ,  H01L21/02172 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/02422 ,  H01L21/02488 ,  H01L21/02513 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/31695 ,  H01L21/76251 ,  H01L27/1214 ,  H01L27/1218 ,  H01L29/78603 ,  H01L51/0097 ,  H01L2251/5338 ,  H05K1/0393 ,  H05K1/053 ,  H05K2201/0116

Abstract: The invention relates to a substrate for electronic application, comprising a flexible support successively covered with a porous oxide layer and a layer of polycrystalline or amorphous silicon. The invention further relates to a method for production of such a substrate.

公开(公告)号：EP2181978A1

公开(公告)日：2010-05-05

申请号：EP09170261.3

申请日：2009-09-15

Applicant: Micro Systems Engineering GmbH

Inventor： Schwanke, Dieter ,  Harnack, Mirco ,  Bittner, Achim ,  Schmid, Ulrich

IPC: C04B41/91 ,  C03C15/00 ,  H01Q1/38 ,  H05K1/03 ,  C03C17/00

CPC classification number: C03C15/00 ,  C03C17/02 ,  C03C17/28 ,  C03C17/34 ,  C03C17/38 ,  C03C2218/113 ,  C03C2218/116 ,  C03C2218/119 ,  C03C2218/31 ,  C04B41/009 ,  C04B41/52 ,  C04B41/89 ,  C04B2111/00844 ,  H01Q1/38 ,  H05K1/024 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2203/1147 ,  C04B41/4582 ,  C04B41/5023 ,  C04B41/5353 ,  C04B41/4539 ,  C04B41/5022 ,  C04B41/4537 ,  C04B41/522 ,  C04B41/488 ,  C04B35/00

Abstract: Die vorliegende Erfindung betrifft ein keramisches Substratmaterial mit einer ersten Schicht und mindestens einer weiteren, zumindest bereichsweise auf der ersten Schicht angeordneten zweiten Schicht, wobei die erste Schicht aus mindestens einer ersten Komponente aus einem kristallinen Keramikmaterial und/oder einem Glasmaterial als Matrix besteht, wobei die erste Schicht eine zweite Komponente aus einem weiteren kristallinen Keramikmaterial enthält, wobei Mantelbereiche der Kristalle und/oder Kristallagglomerate der zweiten Komponente mindestens bereichsweise derart herausgeätzt sind, dass eine Hohlraumstruktur, vorzugsweise in Form einer Poren- und/oder Röhrenstruktur vorliegt. Um auf die Hohlraumstruktur Dünnschicht-Strukturen aufbringen zu können, ist die zweite Schicht als Versiegelungsschicht ausgebildet, welche die Oberfläche der ersten Schicht in den Bereichen versiegelt, auf denen sie angeordnet ist.

Abstract translation: 陶瓷基板材料包括第一层（10）和在区域方式的方式，在设置在第一层上的第二层，其中第一组分的第一层besteht由结晶陶瓷材料和/或玻璃材料制成，并且包含一第二 由另外的结晶陶瓷材料的组成部分。 结晶和/或第二组分的附聚物结晶的侧面区域中蚀刻出到区域方式的方式，如此做了一个空腔结构（12）呈现的孔结构和/或管状结构的形式。 第二层形成为（14）的密封层。 陶瓷基板材料包括第一层（10）和在区域方式的方式，在设置在第一层上的第二层，其中第一组分的第一层besteht由结晶陶瓷材料和/或玻璃材料制成，并且包含一第二 由另外的结晶陶瓷材料的组成部分。 结晶和/或第二组分的附聚物结晶的侧面区域中蚀刻出到区域方式的方式，如此做了一个空腔结构（12）呈现的孔结构和/或管状结构的形式。 第二层形成为密封第一层的表面上，具有5微米的层厚度，包含有机材料，陶瓷材料和/或玻璃材料的密封层（14）：如聚酰亚胺，并通过屏幕产生 印刷过程中，旋涂法或溶胶 - 凝胶过程。 蚀刻的空腔结构仅呈现在所述第一层的预定区域和在所述第一层的预定深度一直达到。 第一层与由低温共烧陶瓷技术的第三层一起生产。 金属化层存在的密封层上，通过薄层技术产生并从空心与中空空腔结构中至多在区域permeably运行区域而不腔结构。 一个独立的claimsoft包括用于制造陶瓷基板材料的方法。

公开(公告)号：EP2145337A1

公开(公告)日：2010-01-20

申请号：EP08718986.6

申请日：2008-04-04

Applicant: MBDA UK Limited

Inventor： DUNLEAVY, Michael ,  HAQ, Sajad ,  DAVIES, Joseph, Maurice ,  REW, Jason, Karl

IPC: H01B3/00

CPC classification number: B29C39/10 ,  H01B3/006 ,  H01G4/206 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0254 ,  Y10T428/24967

Abstract: A bulk dielectric material comprises a solid composite material comprising a solid matrix material and a plurality of filler elements distributed within the matrix material. The bulk dielectric material has, at a frequency greater than 1 MHz, (i) a permittivity having a real part of magnitude greater than 10 and an imaginary part of magnitude less than 3, and (ii) an electrical breakdown strength greater than 5 kV/mm and has a minimum dimension greater than 2 mm.

公开(公告)号：EP1707315B1

公开(公告)日：2009-03-11

申请号：EP05703853.1

申请日：2005-01-13

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： HAYASHI, Fumihiro Sumitomo Electric Industries Ltd ,  MASUDA, Yasuhito Sumitomo Electric Industries, Ltd ,  OKUDA, Yasuhiro Sumitomo Electric Industries, Ltd.

IPC: B24C1/04 ,  C23C18/16 ,  H05K3/10 ,  B24C3/32 ,  H05K3/00 ,  H05K3/38 ,  H05K3/42 ,  B24C11/00

CPC classification number: B24C3/322 ,  B24C1/04 ,  B24C11/00 ,  C23C18/1605 ,  C23C18/1644 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/30 ,  H05K1/0284 ,  H05K3/107 ,  H05K3/182 ,  H05K3/184 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0293 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2203/025 ,  H05K2203/0565 ,  Y10T428/24479 ,  Y10T428/24496 ,  Y10T428/24612 ,  Y10T428/249953 ,  Y10T428/249987 ,  Y10T442/674

Abstract: A production method for a porous molding in which complicated and fine penetrated portions and recesses are pattern-worked. A pattern-worked porous molding or non-woven fabric in which a plated layer is selectively formed on the surfaces of penetrated portions and recesses. A mask having pattern-form penetrated portions is disposed on at least one surface of a porous molding or non-woven fabric, and fluid or fluid containing abrasive grains is sprayed over the mask to form penetrated portions or recesses or the both of them, to which the opening shape of the mask’s penetrated portion is transferred, on the porous molding or non-woven fabric. A porous molding or non-woven fabric and an electric circuit components or the like in which a plated layer is selectively formed on the surfaces of penetrated portions or recesses or the both of them.

公开(公告)号：EP1637261A4

公开(公告)日：2009-03-11

申请号：EP04736126

申请日：2004-06-04

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： OKUDA YASUHIRO ,  HAYASHI FUMIHIRO ,  HAGA TSUYOSHI ,  FUJITA TARO ,  UENOYAMA MAYO ,  MASUDA YASUHITO ,  IDOMOTO YUICHI

IPC: H05K3/00 ,  B23B35/00 ,  B29C67/20 ,  H05K3/42

CPC classification number: B29C44/5618 ,  B29C67/202 ,  H05K3/0011 ,  H05K3/0055 ,  H05K3/422 ,  H05K3/426 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2203/0565 ,  H05K2203/0769 ,  H05K2203/1147 ,  Y10T29/49167

Abstract: A method of manufacturing a drilled porous resin base material with conductive drilled inner wall surfaces, comprising a step 1 for penetrating liquid or solution into the porous structure of the porous resin base material, a step 2 for forming solid matter from the penetrated liquid or solution, a step 3 for forming a plurality of drilled holes passed from the first surface to the second surface of the porous resin base material having the solid matter in the porous structure, and a step 4 for melting or dissolving the solid matter and removing it from the porous structure. The method also comprises the step for selectively adhering catalysts to only the inner wall surfaces of the drilled holes and adhering a conductive metal to the inner wall surfaces.

公开(公告)号：EP2015620A2

公开(公告)日：2009-01-14

申请号：EP08010671.9

申请日：2008-06-12

Applicant: Leonhard Kurz Stiftung & Co. KG

Inventor： Schindler, Ulrich, Dr.

IPC: H05K3/02 ,  H05K3/20

CPC classification number: H05K3/207 ,  H01L31/022425 ,  H05K1/097 ,  H05K3/046 ,  H05K2201/0116 ,  H05K2203/0108 ,  H05K2203/0528 ,  H05K2203/1105 ,  H05K2203/1131 ,  Y02E10/50 ,  Y10T428/1405

Abstract: Es wird ein Verfahren zur Erzeugung von Strukturen auf Substraten beschrieben. Mindestens eine Transferschicht (22) wird von einer Prägefolie (2), insbesondere einer Heißprägefolie, vollständig oder bereichsweise auf die Oberfläche des Substrats (1) übertragen, wobei die Transferschicht (22) Bereiche aufweist, die von einem Bindemittel gebildet sind. In der auf das Substrat (1) übertragenen Transferschicht werden offene Poren erzeugt, indem das Bindemittel ausgetrieben wird. In die offenen Poren kann sodann ein Füllstoff eingebracht werden. Weiter wird eine Prägefolie zur Erzeugung von Strukturen auf einem Substrat beschrieben.

Abstract translation: 该方法包括将热压花箔（2）的转印层（22）完全或部分地转印到硅晶片衬底的表面上。 转印层具有转印层含有颗粒的区域和粘合剂。 转移层转移到基底，产生开孔。 导电颗粒作用在碳纳米管或导电聚合物颗粒上，并且半导电颗粒作用在钛二氧化物纳米颗粒或由半导体聚合物制成的颗粒在压印箔中。 还包括用于压花箔，特别是用于在基底上产生结构的热压花箔的独立权利要求。

公开(公告)号：EP1911584A1

公开(公告)日：2008-04-16

申请号：EP06767445.7

申请日：2006-06-27

Applicant: MITSUBISHI ELECTRIC CORPORATION

Inventor： NAKATANI, Mitsunori ,  FUJIHARA, Toshihiko ,  HOSOKAWA, Yuichiro

IPC: B41F15/20 ,  B41F15/00 ,  B41F15/18 ,  H05K3/12 ,  H05K3/34

CPC classification number: H05K3/1216 ,  B41F15/20 ,  H01L31/022425 ,  H01L31/18 ,  H05K2201/0116 ,  H05K2203/0165 ,  H05K2203/082 ,  Y02E10/50

Abstract: A screen printing machine includes a printing stage 1 that includes a plurality of suction holes 2 on the stage surface 3 and fixes an object to be printed 20 on the stage surface 3 by vacuum contact, a printing mask 4 that forms a predetermined electrode pattern on the object to be printed 20 fixed to the printing stage 1, a squeegee 33 that makes prints on the object to be printed 20 by applying a predetermined amount of pressure to metal paste spread on the printing mask 4, and a porous body 6 between the object to be printed 20 and the printing stage 1. The screen printing machine prevents the object to be printed from damage due to foreign particle such as debris and printing paste, and improves production yield.

Abstract translation: 丝网印刷机包括：印刷台1，其在台面3上包括多个吸孔2，通过真空接触将待印刷的物体20固定在台面3上;印刷掩模4，其形成预定的电极图案; 要印刷的物体20固定到印刷台1上，通过对涂布在印刷掩模4上的金属糊施加预定量的压力来对要打印的物体20进行印刷的刮板33;以及多孔体6， 要印刷的对象20和印刷台1.丝网印刷机防止由于诸如碎屑和印刷浆料的异物造成的物体受到损坏，并且提高了生产率。

公开(公告)号：EP1911090A2

公开(公告)日：2008-04-16

申请号：EP06800678.2

申请日：2006-07-28

Applicant: FOSTER MILLER, INC.

Inventor： FARRELL, Brian ,  GANNON, John, J., Jr. ,  CAMPBELL, Thomas, G. ,  COPPOLA, Pat, Anhtony ,  O'REILLY, Sean, Gerald ,  BURKE, Joseph, F.

IPC: H01L23/02

CPC classification number: H01Q1/286 ,  B64D43/00 ,  H01Q21/065 ,  H05K1/00 ,  H05K1/038 ,  H05K1/147 ,  H05K3/0058 ,  H05K3/0064 ,  H05K3/3447 ,  H05K3/36 ,  H05K3/4046 ,  H05K2201/0116 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10303

Abstract: A dual function composite system includes a first electronic subsystem, a second electronic subsystem, and a composite member between the first and second electronic subsystems. The composite member includes plies of fabric, and resin impregnating the plies of fabric. At least one ply of the fabric includes signal transmission elements integrated therewith and interconnecting the first electronic subsystem with the second electronic subsystem.

公开(公告)号：EP1855515A1

公开(公告)日：2007-11-14

申请号：EP06714422.0

申请日：2006-02-23

Applicant: So-Ken Co., Ltd

Inventor： KAWAKAMI, Takashi ,  SASO, Nobuyuki

IPC: H05K3/28 ,  H05K1/11 ,  H05K3/18

CPC classification number: H05K3/28 ,  H05K1/03 ,  H05K1/0366 ,  H05K1/038 ,  H05K1/0393 ,  H05K3/184 ,  H05K3/241 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0179 ,  H05K2201/029 ,  Y10T29/49155

Abstract: This invention relates to a printed circuit board which comprises a porous sheet or foil composed of a non-conductive material; a circuit pattern composed of a conductive material formed on the porous sheet or foil; and an organic polymer coating as an insulating layer formed by vapor deposition polymerization.
Also this invention relates to a method for manufacturing a printed circuit board comprising a step of forming a photo-resist layer on a non-conductive porous sheet or foil; a step of forming a circuit pattern in the photo-resist layer by exposing and developing; a step of plating the circuit pattern with a conductive material; a step of removing the photo-resist layer; and a step of forming an organic polymer coating over the circuit pattern of the conductive material by means of vapor deposition polymerization.

Abstract translation: 本发明涉及一种印刷电路板，其包括由非导电材料构成的多孔片或箔片; 由形成在所述多孔片或箔上的导电材料构成的电路图案; 以及作为通过气相沉积聚合形成的绝缘层的有机聚合物涂层。 本发明还涉及一种制造印刷电路板的方法，包括在非导电多孔片或箔片上形成光致抗蚀剂层的步骤; 通过曝光和显影在光刻胶层中形成电路图案的步骤; 用导电材料电镀电路图案的步骤; 除去光致抗蚀剂层的步骤; 以及通过气相沉积聚合在导电材料的电路图案上形成有机聚合物涂层的步骤。

公开(公告)号：EP1693484A3

公开(公告)日：2007-06-20

申请号：EP06250733.0

申请日：2006-02-10

Applicant: Rohm and Haas Electronic Materials, L.L.C.

Inventor： Montano, Joseph R. ,  Reese, Jason A. ,  Little, Luke W.

IPC: C23C18/16 ,  C23C18/28 ,  C23C18/18 ,  C25D5/54

CPC classification number: H05K3/387 ,  C23C18/1651 ,  C23C18/1865 ,  C23C18/1893 ,  C23C18/2086 ,  C25D5/54 ,  H05K2201/0116 ,  H05K2201/0212 ,  H05K2201/0236

Abstract: Methods of improving the adhesion of metal layers to a substrate, such as an optical substrate, are provided. Such methods employ a layer of an adhesion promoting composition including a plating catalyst on the substrate before metal deposition. Also provided are devices made by such processes.