公开(公告)号：EP0971570B1

公开(公告)日：2007-07-25

申请号：EP98901002.0

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： TAKADA, Masaru, Ibiden Co., Ltd. ,  TSUKADA, Kiyotaka, Ibiden Co., Ltd. ,  KOBAYASHI, Hiroyuki ,  MINOURA, Hisashi ,  UKAI, Yoshikazu ,  KONDO, Mitsuhiro

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: When a printed wiring board which has inner layer conductor circuits (161 and 131) between insulating layers (101 - 103) and blind via-holes (141 and 142) made from the top surface of the insulating layer to the inner layer conductor circuits is manufactured, a hole (160) is provided beforehand in the center part of the inner layer conductor circuits (161) at the bottom of the blind via-hole (141), and a laser beam is applied from the top surface side of the insulating layer to form the blind via-holes (141 and 142). After that, metal plating films are formed on the surfaces of the inner layer conductor circuits (131 and 161) and the blind via-holes (141 and 142).

Abstract translation: 当在绝缘层（101-103）之间具有内层导体电路（161和131）以及由绝缘层的顶面到内层导体电路制成的盲通孔（141和142）的印刷线路板是 在盲孔（141）的底部的内层导体电路（161）的中央部预先设置孔（160），从绝缘体的上表面侧照射激光 层以形成盲通孔（141和142）。 此后，在内层导体电路（131和161）和盲通孔（141和142）的表面上形成金属镀膜。

公开(公告)号：EP1019986A4

公开(公告)日：2003-03-26

申请号：EP98952161

申请日：1998-10-07

Applicant: DIMENSIONAL CIRCUITS CORP

Inventor： GREGOIRE GEORGE D

IPC: H01R12/55 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/12 ,  H05K3/40 ,  H05K3/46 ,  H01R9/09

CPC classification number: H05K3/005 ,  H05K1/095 ,  H05K1/112 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/061 ,  H05K3/107 ,  H05K3/1241 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/465 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09863 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/025 ,  H05K2203/041 ,  H05K2203/0746 ,  H05K2203/095 ,  H05K2203/1189 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A wiring board construction (10) includes at least one microvia (12) disposed in a base substrate (14) and includes a deep imprinted cup shaped in the top surface thereof (24). A conductor material is disposed within the recess (26), and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion (31) helps to complete an electrically conductive path through the substrate.

Abstract translation: 布线板结构包括设置在基底基板中的至少一个微孔，并且包括形成在其顶表面中的深刻印刷杯。 导体材料设置在凹部内，并且具有设置在其底部的部分。 设置在与导体材料底部相对的基板的底表面处的导体有助于完成穿过基板的导电路径，以帮助完成穿过基板的导电路径。

公开(公告)号：EP2981158B1

公开(公告)日：2018-09-19

申请号：EP14774851.1

申请日：2014-03-26

Applicant: KYOCERA Corporation

Inventor： KAJITA, Satoshi ,  HAGIHARA, Mitsuhiro ,  MATSUMOTO, Yuuhei

IPC: H05K3/46 ,  H05K1/11 ,  H05K1/03 ,  H05K3/42

CPC classification number: H05K1/0306 ,  H05K1/0298 ,  H05K1/036 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0038 ,  H05K3/421 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2201/2072

Abstract: A wiring board (3) in accordance with an embodiment of the invention includes: an inorganic insulating layer (13) having a via hole (V) formed so as to penetrate the inorganic insulating layer (13) in a thickness direction thereof; a conductive layer (11) disposed on the inorganic insulating layer (13); and a via conductor (12) which adheres to an inner wall (W) of the via hole (V) and is connected with the conductive layer (11). The inorganic insulating layer (13) includes a first section (33) including a plurality of inorganic insulating particles (16) partly connected to each other, and a resin portion (18) located in gaps (17) between the inorganic insulating particles (16), and a second section (34) which is interposed between the first section (33) and the via conductor (12), including a plurality of inorganic insulating particles (16) partly connected to each other, and a conducting portion (19) composed of part of the via conductor (12) which is located in gaps (17) between the inorganic insulating particles (16).

公开(公告)号：EP2627159A4

公开(公告)日：2018-01-17

申请号：EP11830572

申请日：2011-09-30

Applicant: NGK SPARK PLUG CO

Inventor： YOSHIDA YOSHITAKA ,  YAMAMOTO HIROAKI

IPC: H05K1/03 ,  B32B3/30 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K1/0306 ,  B32B3/30 ,  H05K1/09 ,  H05K3/00 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09863 ,  Y10T156/10 ,  Y10T428/15

Abstract: There are provided a multi-piece-array in which it is difficult for chipping, cracking, or breaking to occur from the vicinity of dividing grooves at the time of division or after division and which has high reliability, and a method of manufacturing the multi-piece-array. A multi-piece-array 1 is formed by laminating a plurality of ceramic layers s1 and s2 and has a front surface 2 and a back surface 3. The multi-piece-array 1 includes a product region 4a where a plurality of wiring board portions 4 having a rectangular shape in plan view and including cavities 5 are arranged in a matrix, an edge portion 6 that is positioned along the periphery of the product region 4a, and dividing grooves 8 and 9 that are formed on at least one of the front surface 2 and the back surface 3 along boundaries between the wiring board portions 4 and 4 and boundaries between the wiring board portions 4 and the edge portion 6. The deepest portions 8b of the dividing grooves 8 and 9 have an arc shape and each of the dividing grooves 8 and 9 includes a middle portion 8a between the deepest portion 8b and a groove inlet 8c on a cross-section orthogonal to an extending direction. The width w2 of the deepest portion 8b is greater than the width w3 of the groove inlet 8c and the width w1 of the middle portion 8a is equal to or less than the width w3 of the groove inlet 8c.

公开(公告)号：EP2988883A4

公开(公告)日：2017-02-22

申请号：EP14756616

申请日：2014-02-27

Applicant: TEXAS INSTRUMENTS INC

Inventor： JOHNSON PETER B ,  WYGANT IRA OAKTREE

IPC: B06B1/02

CPC classification number: B06B1/0292 ,  B06B2201/76 ,  B81B7/007 ,  B81B2203/0127 ,  B81B2207/096 ,  B81C1/00301 ,  B81C2201/013 ,  B81C2203/036 ,  H02N1/006 ,  H04R19/005 ,  H05K2201/09845 ,  H05K2201/09863

Abstract: A Capacitive Micromachined Ultrasonic Transducer (CMUT) device includes at least one CMUT cell including a first substrate of a single crystal material having a top side including a patterned dielectric layer thereon including a thick and a thin dielectric region, and a through-substrate via (TSV) extending a full thickness of the first substrate. The TSV is formed of the single crystal material, is electrically isolated by isolation regions in the single crystal material, and is positioned under a top side contact area of the first substrate. A membrane layer is bonded to the thick dielectric region and over the thin dielectric region to provide a movable membrane over a micro-electro-mechanical system (MEMS) cavity. A metal layer is over the top side substrate contact area and over the movable membrane including coupling of the top side substrate contact area to the movable membrane.

公开(公告)号：EP2981158A4

公开(公告)日：2017-01-18

申请号：EP14774851

申请日：2014-03-26

Applicant: KYOCERA CORP

Inventor： KAJITA SATOSHI ,  HAGIHARA MITSUHIRO ,  MATSUMOTO YUUHEI

IPC: H05K3/46 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/0306 ,  H05K1/0298 ,  H05K1/036 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0038 ,  H05K3/421 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2201/2072

Abstract: A wiring board (3) in accordance with an embodiment of the invention includes: an inorganic insulating layer (13) having a via hole (V) formed so as to penetrate the inorganic insulating layer (13) in a thickness direction thereof; a conductive layer (11) disposed on the inorganic insulating layer (13); and a via conductor (12) which adheres to an inner wall (W) of the via hole (V) and is connected with the conductive layer (11). The inorganic insulating layer (13) includes a first section (33) including a plurality of inorganic insulating particles (16) partly connected to each other, and a resin portion (18) located in gaps (17) between the inorganic insulating particles (16), and a second section (34) which is interposed between the first section (33) and the via conductor (12), including a plurality of inorganic insulating particles (16) partly connected to each other, and a conducting portion (19) composed of part of the via conductor (12) which is located in gaps (17) between the inorganic insulating particles (16).

公开(公告)号：EP2627159A1

公开(公告)日：2013-08-14

申请号：EP11830572.1

申请日：2011-09-30

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： YOSHIDA Yoshitaka ,  YAMAMOTO Hiroaki

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0306 ,  B32B3/30 ,  H05K1/09 ,  H05K3/00 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09863 ,  Y10T156/10 ,  Y10T428/15

Abstract: There are provided a multi-piece-array in which it is difficult for chipping, cracking, or breaking to occur from the vicinity of dividing grooves at the time of division or after division and which has high reliability, and a method of manufacturing the multi-piece-array.
A multi-piece-array 1 is formed by laminating a plurality of ceramic layers s1 and s2 and has a front surface 2 and a back surface 3. The multi-piece-array 1 includes a product region 4a where a plurality of wiring board portions 4 having a rectangular shape in plan view and including cavities 5 are arranged in a matrix, an edge portion 6 that is positioned along the periphery of the product region 4a, and dividing grooves 8 and 9 that are formed on at least one of the front surface 2 and the back surface 3 along boundaries between the wiring board portions 4 and 4 and boundaries between the wiring board portions 4 and the edge portion 6. The deepest portions 8b of the dividing grooves 8 and 9 have an arc shape and each of the dividing grooves 8 and 9 includes a middle portion 8a between the deepest portion 8b and a groove inlet 8c on a cross-section orthogonal to an extending direction. The width w2 of the deepest portion 8b is greater than the width w3 of the groove inlet 8c and the width w1 of the middle portion 8a is equal to or less than the width w3 of the groove inlet 8c.

Abstract translation: 提供了一种多分片阵列，其中在划分或划分之后难以从划分槽附近发生切屑，破裂或断裂，并且其具有高可靠性，并且制造多层结构的方法 -piece阵列。 多片阵列1通过层叠多个陶瓷层s1和s2而形成，并具有前表面2和后表面3.多片阵列1包括产品区域4a，其中多个布线板部分 在平面图中具有矩形形状并且包括空腔5的图4以矩阵形式布置，沿着产品区域4a的周边定位的边缘部分6和形成在前部的至少一个上的分隔槽8和9 表面2和背面3沿着布线板部分4和4之间的边界以及布线板部分4和边缘部分6之间的边界。分隔槽8和9的最深部分8b具有弧形，并且每个 分割槽8,9在与延伸方向正交的截面上包括在最深部分8b和凹槽入口8c之间的中间部分8a。 最深部8b的宽度w2大于槽入口8c的宽度w3，中间部分8a的宽度w1等于或小于槽入口8c的宽度w3。

公开(公告)号：EP1843650B1

公开(公告)日：2012-03-07

申请号：EP07013524.9

申请日：1999-07-30

Applicant: Ibiden Co., Ltd.

Inventor： Hirose, Naohiro ,  Noda, Kouta ,  Segawa, Hiroshi ,  En, Honjin ,  Tsukada, Kiyotaka ,  Ishida, Naoto ,  Asano, Kouji ,  Shouda, Atsushi

IPC: H05K3/46 ,  H05K3/00 ,  H05K3/38 ,  B23K26/38

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

公开(公告)号：EP1827069B1

公开(公告)日：2009-04-22

申请号：EP07075315.7

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru, ,  Tsukada, Kiyotaka, ,  Kobayashi, Hiroyuki, ,  Minoura, Hisashi, ,  Ukai, Yoshikazu, ,  Kondo, Mitsuhiro,

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

公开(公告)号：EP1827065A3

公开(公告)日：2007-10-10

申请号：EP07075318.1

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru c/o Ibiden Co., Ltd. ,  Tsukada, Kiyotaka c/o Ibiden Co., Ltd. ,  Kobayashi, Hiroyuki c/o Ibiden Co., Ltd. ,  Minoura, Hisashi c/o Ibiden Co., Ltd. ,  Ukai, Yoshikazu c/o Ibiden Co., Ltd. ,  Kondo, Mitsuhiro c/o Ibiden Co., Ltd.

IPC: H05K3/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A method of producing a printed wiring board (3) comprising a mounting recess portion (1) for mounting an electronic part, a conductor pattern (7), and a heat-sink plate (6) arranged at the bottom of the mounting recess portion (1), characterized in that a conductor pattern (7) is formed on an insulating substrate (5);
a heat-sink plate (6) is adhered to a lower face of a portion of the insulating substrate (5) forming the mounting recess portion; and
a laser beam (2) is irradiated to an upper face of the portion (10) forming the mounting recess portion to form a mounting recess portion (1).

Abstract translation: 一种印刷线路板（3）的制造方法，该印刷线路板（3）包括用于安装电子部件的安装凹部（1），导体图案（7）和布置在安装凹部的底部的散热板（6） （1），其特征在于，在绝缘基板（5）上形成导体图案（7）。 散热板（6）粘附到形成安装凹部的绝缘基板（5）的一部分的下表面; 并且激光束（2）照射到形成安装凹部的部分（10）的上表面以形成安装凹部（1）。