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    HEAT SINK
    31.
    发明公开
    HEAT SINK 审中-公开
    散热器

    公开(公告)号：EP1374654A1

    公开(公告)日：2004-01-02

    申请号：EP02753633.3

    申请日：2002-03-14

    Applicant: Aavid Thermalloy, LLC

    Inventor： FISHER, Francis, Edward ,  BOWLES, Russell

    IPC: H05K7/20

    CPC classification number: H05K3/341 ,  H01L23/3672 ,  H01L23/40 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K3/3421 ,  H05K2201/066 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2201/2081 ,  H05K2203/0315 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A composite heat sink device (1) includes a heat sink body (2, 3) formed of aluminum, the body (2, 3) having a pair of coplanar surfaces (4), and a thermally conductive solderable element (5), for example of copper, mechanically fixed to each of the coplanar surfaces (4). Each of the solderable elements has a first surface which is contiguous with one of the coplanar surfaces, and a second surface which is soldered to a printed circuit board.

    Abstract translation: 一种复合散热装置（1），包括由铝形成的散热器本体（2,3），所述本体（2,3）具有一对共面表面（4）和导热可焊接元件（5），所述导热可焊接元件 铜的例子，机械固定到每个共面表面（4）。 每个可焊接元件具有与共面表面中的一个邻接的第一表面和焊接到印刷电路板的第二表面。

    Dielectric filter and method of making same
    33.
    发明公开
    Dielectric filter and method of making same 失效
    电介质过滤器及其制造方法

    公开(公告)号：EP1280223A1

    公开(公告)日：2003-01-29

    申请号：EP02022883.9

    申请日：1997-03-18

    Applicant: NGK Spark Plug Company Limited

    Inventor： Ito, Kenji, c/o NGK Spark Plug Co., Ltd.

    IPC: H01P11/00 ,  H01P1/205

    CPC classification number: H01P11/007 ,  H01P1/2056 ,  H05K1/0243 ,  H05K3/282 ,  H05K3/3442 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/1006 ,  H05K2201/10909 ,  H05K2201/10969 ,  Y02P70/613

    Abstract: In a dielectric filter to be mounted on a printed circuit board, a conductive layer (x) formed on the surface of a dielectric substrate (1) includes an electroless copper-plated layer (m) formed on the surface of the substrate, and a conductive covering layer (n) having good dielectric conductivity and good solder wettability and formed on the surface of the electroless copper-plated layer (m). In place of the conductive covering layer (n) or in addition to the conductive covering layer (n), there is provided a protective synthetic resin layer (p) which covers the electroless copper-plated layer (m) or the conductive covering layer (n) and which vanishes upon exposure to heat of molten solder (25). Even when the conductive layer (x) is formed by electroless copper-plating, the conductive layer (x) is free from stain. Moreover, a terminal portion of the conductive layer (x) formed on the surface of the dielectric filter (1) can be soldered to a conductive path formed on a printed circuit board to thereby establish electric connection therebetween.

    Abstract translation: 在安装在印刷电路板上的介质滤波器中，形成在介质基片（1）表面上的导电层（x）包括形成在基片表面上的无电镀铜层（m），和 导电覆盖层（n）具有良好的介电导电性和良好的焊料润湿性并形成在无电镀铜层（m）的表面上。 代替导电覆盖层（n）或除了导电覆盖层（n）之外，还提供覆盖无电镀铜层（m）或导电覆盖层（p）的保护性合成树脂层（p） n）并且在暴露于熔融焊料（25）的热量时消失。 即使当通过无电镀铜形成导电层（x）时，导电层（x）也没有污点。 而且，形成在介质滤波器（1）的表面上的导电层（x）的端子部分可以焊接到形成在印刷电路板上的导电路径，从而建立它们之间的电连接。

    SOLDER FOR ELECTRONIC PART BONDING ELECTRODES, AND SOLDERING METHOD
    34.
    发明授权
    SOLDER FOR ELECTRONIC PART BONDING ELECTRODES, AND SOLDERING METHOD 失效
    很多关于主角为连接电子部件和焊接

    公开(公告)号：EP0858859B1

    公开(公告)日：2002-04-24

    申请号：EP97925301.0

    申请日：1997-06-06

    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

    Inventor： SAKAI, Yoshinori ,  SUETSUGU, Kenichiro ,  YAMAGUCHI, Atsushi

    IPC: B23K35/26

    CPC classification number: B23K35/262 ,  B23K2201/36 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/10909

    Abstract: A solder for electronic part bonding electrodes, not containing lead and having a fine structure and excellent heat resisting fatigue characteristics is provided. A solder for electronic part bonding electrodes, the main constituent components of which are Sn, Ag and Cu, characterized in that the weight ratio of these components is 92-97 wt.% of Sn, 3.0-6.0 wt.% of Ag and 0.1-2.0 wt.% of Cu. A small amount of Ag is added to solder which contains Sn as a main component, whereby an alloy having a fine alloy structure, capable of minimizing structure variation and having excellent heat resisting fatigue characteristics can be obtained. When a small amount of Cu is added, an intermetallic compound is formed, and the bond strength of the alloy is improved.

    Dielectric filter and method of making same
    35.
    发明公开
    Dielectric filter and method of making same 失效
    一种介质滤波器，和处理它的制备

    公开(公告)号：EP0797266A2

    公开(公告)日：1997-09-24

    申请号：EP97301813.8

    申请日：1997-03-18

    Applicant: NGK Spark Plug Co. Ltd.

    Inventor： Ito, Kenji, c/o NGK Spark Plug Co., Ltd.

    IPC: H01P1/205

    CPC classification number: H01P11/007 ,  H01P1/2056 ,  H05K1/0243 ,  H05K3/282 ,  H05K3/3442 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/1006 ,  H05K2201/10909 ,  H05K2201/10969 ,  Y02P70/613

    Abstract: In a dielectric filter to be mounted on a printed circuit board, a conductive layer (x) formed on the surface of a dielectric substrate (1) includes an electroless copper-plated layer (m) formed on the surface of the substrate, and a conductive covering layer (n) having good dielectric conductivity and good solder wettability and formed on the surface of the electroless copper-plated layer (m). In place of the conductive covering layer (n) or in addition to the conductive covering layer (n), there is provided a protective synthetic resin layer (p) which covers the electroless copper-plated layer (m) or the conductive covering layer (n) and which vanishes upon exposure to heat of molten solder (25). Even when the conductive layer (x) is formed by electroless copper-plating, the conductive layer (x) is free from stain. Moreover, a terminal portion of the conductive layer (x) formed on the surface of the dielectric filter (1) can be soldered to a conductive path formed on a printed circuit board to thereby establish electric connection therebetween.

    Surface mountable semiconductor device having self loaded solder joints
    38.
    发明公开
    Surface mountable semiconductor device having self loaded solder joints 失效
    OberflächenmontierbareHalbleitervorrichtung mit selbstbeladenenLötverbindungen。

    公开(公告)号：EP0448266A2

    公开(公告)日：1991-09-25

    申请号：EP91302005.3

    申请日：1991-03-11

    Applicant: MOTOROLA, INC.

    Inventor： Lin, Paul T.

    IPC: H01L21/60

    CPC classification number: H01L23/49582 ,  H01L23/49579 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/10984 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: An improved semiconductor device( 10) is disclosed having a predetermined amount of solder (36), or other electrically conductive binder adsorbed onto the exterior package leads (18) of the semiconductor device.(10) A de-wettable coating (24) comprising preferably nickel, or alternatively chromium, is plated to a superior portion (34) of the package leads,(18) such that, when the heat is applied to the substrate mounting end (32) of the leads,(18) solder (36) desorbes from the de-wettable layer (24) and flows down the lead (18) to the contact pads (40) on the mounting substrate (42) and forms a solder joint.(46) The amount of solder delivered to the contact pad for joint formation is determined by the thickness of the adsorbed solder layer (36) overlying each package lead.(18) Only enough solder is provided on each lead (18) sufficient to form the joint (46) thus avoiding solder bridging between adjacent contact pads.(40)

    Abstract translation: 公开了一种改进的半导体器件（10），其具有预定量的焊料（36）或吸附到半导体器件的外部封装引线（18）上的其它导电粘合剂。（10）一种可脱湿涂层（24），包括 优选为镍，或者铬，电镀到封装引线（18）的上部（34）上，使得当将热量施加到引线的基板安装端（32）时，（18）焊料（36） ）去离子，并从引线（18）向下流到安装基板（42）上的接触焊盘（40），并形成焊接接头。（46）传递到接触点的焊料量 用于接合形成的焊盘由覆盖在每个封装引线上的吸附的焊料层（36）的厚度确定。（18）仅在足够形成接头（46）的每个引线（18）上提供足够的焊料，从而避免相邻 接触垫。（40）

    Method and transfer plate for applying solder to component leads
    40.
    发明公开
    Method and transfer plate for applying solder to component leads 失效
    方法和传送板施加焊料接触部件的引线。

    公开(公告)号：EP0273131A1

    公开(公告)日：1988-07-06

    申请号：EP87115744.2

    申请日：1987-10-27

    Applicant: International Business Machines Corporation

    Inventor： Johary, Ajay

    IPC: H05K3/34 ,  H05K13/04

    CPC classification number: H05K3/3426 ,  B23K3/06 ,  B23K35/0222 ,  H01R4/028 ,  H01R43/0235 ,  H05K3/3484 ,  H05K2201/10727 ,  H05K2201/10909 ,  H05K2201/10984 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y02P70/613

    Abstract: A method and a solder transfer member (18) for applying discrete bodies of solder of predetermined size to the leads of a component for subsequent surface mounting to a substrate. The transfer member is a plate having a non-wetted surface (20), for example titanium, with an array of cavities (22) matching the component lead pattern, each having a volume corresponding to the desired amount of solder to be applied to the corresponding lead. The method includes placing solder paste on the transfer member and filling the cavities by wiping the plate surface. The component is placed on the transfer member with the leads contacting the solder paste in the cavities. Reflow of the solder paste bonds to each lead a discrete body of solder having a precisely determined size. To limit wicking of solder on the leads, selective masking may be performed by applying a water soluble mask coating to the leads and removing the mask from selected areas by placing the component against a surface charged with water before placing the component on the transfer member.

    Abstract translation: 一种方法，以及用于施加预定大小的焊料的离散的机构的部件的引线用于表面安装之后一个衬底的焊料转印构件（18）。 转印构件具有板的非润湿表面（20）对于实施例钛，与腔的阵列（22）的元件引线图案匹配，每一个具有体积对应于焊料的期望量将被施加到所述 相应的铅。 该方法包括将所述转印部件上的焊膏和通过擦拭该板表面填充所述空腔。 该组件被放置与引线接触在空腔中焊膏的转印部件上。 焊膏结合到每个引线回流具有精确地确定开采尺寸的焊料的离散体。 为了限制在引线焊料的芯吸，选择性掩蔽可以执行通过应用水溶性掩模涂层到引线并通过将针对装有水的表面的元件放置部件的转印部件上之前，除去选择的区域的掩模。

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