公开(公告)号：EP2566307A2

公开(公告)日：2013-03-06

申请号：EP12005825.0

申请日：2012-08-10

Applicant: Eppendorf AG

Inventor： Reichmuth, Burkardt

IPC: H05K1/02 ,  B01L3/02 ,  G01F11/02 ,  H05K1/03

CPC classification number: H05K1/0296 ,  B01L3/0227 ,  B01L2200/087 ,  B01L2200/12 ,  G01F11/021 ,  G01N35/1002 ,  H05K1/0393 ,  H05K2201/053 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/0939 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2201/09972 ,  H05K2201/10151

Abstract: The invention relates to a laboratory sample instrument (200) with a cable holding space (185) in which a printed circuit board cable device (100) is arranged, more particularly to a dispenser or a pipette. The printed circuit board cable device has at least one printed circuit board (102), which has a first and a second side of the board, and, arranged in succession, at least one first printed circuit board section (A), at least one second printed circuit board section (B) and at least one third printed circuit board section (C), with the printed circuit board having a number of conductor tracks (121,122) which, at least in sections, are arranged parallel with respect to one another on the printed circuit board and extend from a first track section, which is arranged in the first printed circuit board section, via the second printed circuit board section to the third printed circuit board section, in which a second track section is arranged, wherein, in the second printed circuit board section, at least one conductor track (121a, 122a) is arranged on the first side of the board and at least one conductor track (121b, 122b) is arranged on the second side of the board.

Abstract translation: 本发明涉及具有电缆保持空间（185）的实验室样品仪器（200），其中布置有印刷电路板电缆装置（100），更具体地涉及一种分配器或移液器。 所述印刷电路板电缆装置具有至少一个印刷电路板（102），所述印刷电路板具有所述板的第一和第二侧，并且依次配置有至少一个第一印刷电路板部分（A），至少一个 第二印刷电路板部分（B）和至少一个第三印刷电路板部分（C），其中印刷电路板具有多个导体轨道（121,122），其至少部分地相对于彼此平行布置 在印刷电路板上并且经由第二印刷电路板部分从布置在第一印刷电路板部分中的第一轨道部分延伸到布置有第二轨道部分的第三印刷电路板部分， 在第二印刷电路板部分中，至少一个导体轨道（121a，122a）布置在板的第一侧上，并且至少一个导体轨道（121b，122b）布置在板的第二侧上。

公开(公告)号：EP2559930A1

公开(公告)日：2013-02-20

申请号：EP11187975.5

申请日：2011-11-04

Applicant: Wu, Guang-Yi ,  Xiang, Shao-Ai

Inventor： Wu, Guang-Yi ,  Xiang, Shao-Ai

IPC: F21K99/00 ,  H05K1/02 ,  F21Y101/02 ,  F21Y111/00

CPC classification number: F21V21/00 ,  F21K9/00 ,  F21K9/90 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05K1/0278 ,  H05K1/05 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2203/302 ,  Y10T29/49124

Abstract: The invention discloses a method for manufacturing a three-dimensional tensile and helical circuit board (1) for a LED lamp comprises the steps of: forming a helical continuous carved wire slot on a circuit board; providing patch light-emitting diode tubes (4) to be welded in between the helical continuous carved wire slot; and directly tensioning a center of the circuit board and lifting the tensioned circuit board along the helical continuous carved wire slot to form as the three-dimensional tensile and helical circuit board (1). The invention enable the light to be uniformly projected on a lamp shade from the LED patches, realizing the LED lamp with a long life span, low manufacturing cost and excellent reliability.

Abstract translation: 本发明盘松动用于制造三维拉伸和螺旋电路板（1）一种LED灯包括以下步骤的方法：形成螺旋状连续线刻在电路板上的槽; 提供贴片发光二极管管（4），以螺旋形连续刻线缝之间被焊接在; 直接和张紧所述电路板的中心和提升张紧电路板沿着所述螺旋线刻连续时隙，以形成作为三维拉伸和螺旋电路板（1）。 本发明使来自所述LED的补丁匀灯罩被投射的光，实现所述LED灯有长寿命，低制造成本和优良的可靠性。

公开(公告)号：EP2532216A2

公开(公告)日：2012-12-12

申请号：EP11740411.1

申请日：2011-02-04

Applicant: Kodadek, III, Robert E.

Inventor： Kodadek, III, Robert E.

IPC: H05K7/20 ,  H01L33/64

CPC classification number: F21V29/67 ,  F21V29/02 ,  F21V29/673 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10545

Abstract: A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one end attached to a second side of the PCB, and another end disposed away from the PCB. The elongate member also has an open interior that facilitates fluid communication between the two ends. One of the ends defines an at least partially closed boundary on the PCB. The PCB includes an aperture disposed therethrough proximate the boundary such that fluid communication is facilitated between the first side of the PCB and the second side of the PCB, and along at least a portion of the elongate member.

Abstract translation: 用于电气部件的热管理系统包括能够接收PCB的第一侧上的电气部件的印刷电路板（PCB）。 细长构件具有连接到PCB的第二侧的一端，以及远离PCB设置的另一端。 细长构件还具有有利于两端之间的流体连通的开放内部。 端部中的一个限定了PCB上的至少部分闭合的边界。 PCB包括邻近边界设置穿过的孔，使得在PCB的第一侧和PCB的第二侧之间以及沿着细长构件的至少一部分便于流体连通。

公开(公告)号：EP2496060A1

公开(公告)日：2012-09-05

申请号：EP10826344.3

申请日：2010-10-28

Applicant: Daikin Industries, Ltd.

Inventor： KAGIMURA, Sumio ,  DOUMAE, Hiroshi

IPC: H05K1/18 ,  H01R9/00

CPC classification number: H05K3/32 ,  H01R4/34 ,  H01R12/515 ,  H01R12/585 ,  H05K1/0263 ,  H05K1/18 ,  H05K2201/09063 ,  H05K2201/10166 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/10962

Abstract: A circuit board unit includes a printed circuit board (2) and a terminal block (10) mounted on the printed circuit board (2) and connecting a power module (3) and an electrical wire (8) together. The terminal block (10) includes a terminal connection part (11) to be directly connected to the power module (3), and a wire connection part (12) to be connected to the electrical wire (8). In the printed circuit board (2), a hole (2c) having an orthographic projection area larger than that of the terminal connection part (11) as viewed in plane is formed. The terminal connection part (11) is positioned below or above the hole (2c) of the printed circuit board (2).

Abstract translation: 电路板单元包括印刷电路板（2）和安装在印刷电路板（2）上并将功率模块（3）和电线（8）连接在一起的端子块（10）。 端子块（10）包括直接连接到电源模块（3）的端子连接部分（11）和与电线（8）连接的电线连接部分（12）。 在印刷电路板（2）中，形成具有比平面上的端子连接部（11）大的正投影面积的孔（2c）。 端子连接部（11）位于印刷电路板（2）的孔（2c）的下方或上方。

公开(公告)号：EP2484957A1

公开(公告)日：2012-08-08

申请号：EP10797109.5

申请日：2010-07-05

Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Materials Co., Ltd.

Inventor： FUKUDA, Yoshiyuki ,  KATO, Hiromasa

IPC: F21S8/10 ,  F21W101/10 ,  F21Y101/02

CPC classification number: H05K1/02 ,  H05K1/0306 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2203/167 ,  Y10T428/24273

Abstract: Provided is an element mounting ceramic substrate having a through-hole and a recessed portion which is open on at least one side.

Abstract translation: 提供一种具有通孔的元件安装陶瓷基板和在至少一侧开口的凹部。

公开(公告)号：EP2481269A1

公开(公告)日：2012-08-01

申请号：EP10768427.6

申请日：2010-09-24

Applicant: Option

Inventor： VANDEBRIL, Stijn

IPC: H05K1/00 ,  H05K1/18

CPC classification number: H05K3/3436 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/112 ,  H05K3/284 ,  H05K3/3494 ,  H05K2201/09063 ,  H05K2201/09127 ,  H05K2201/09472 ,  H05K2201/0969 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613

Abstract: System in package (1) comprising a substrate (4) having at least a first external layer (2) comprising a first conductive patterned layer (29) and being externally accessible for electrically connecting the system in package (1) to an external electric circuit and a second internal layer (3) comprising a second conductive patterned layer (30) and being covered by the first layer (2) and electronic devices (6) provided on the substrate (4) and electrically connected to external contact pads (7) of the first conductive patterned layer (29), the devices (6) and the first and the second conductive patterned layer (29, 30) being electrically connected such as to form an internal electric circuit provided to be electronically connected to the external electric circuit, the first (2) and the second layer (3) being adjacently positioned, the electronic devices (6) being enclosed in an over mould compound,characterised in that at least one of the devices (6) is electrically connected to at least one hidden contact pad (5) of the second conductive patterned layer (30) which is accessible after removal of a removable strip (8) of the first layer (2).

公开(公告)号：EP2117082A4

公开(公告)日：2012-05-16

申请号：EP06822495

申请日：2006-10-27

Applicant: ASAHI DENKA KENKYUSHO CO LTD

Inventor： MIZOGUCHI MASANORI

IPC: H05K1/14 ,  H01R12/52 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R12/592 ,  H01R12/58 ,  H01R12/613 ,  H01R12/62 ,  H01R12/777 ,  H01R12/778 ,  H01R12/78 ,  H01R12/79 ,  H05K1/118 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/0969 ,  H05K2201/1059 ,  H05K2201/209

公开(公告)号：EP2426740A1

公开(公告)日：2012-03-07

申请号：EP10769729.4

申请日：2010-04-27

Applicant: Sharp Kabushiki Kaisha

Inventor： TAKEUCHI, Hideto

IPC: H01L33/00 ,  F21S2/00 ,  F21V17/00 ,  F21V19/00 ,  F21V23/00 ,  F21V23/06 ,  H01L33/48 ,  F21Y101/02

CPC classification number: H05K1/142 ,  G02F1/133603 ,  G02F1/133608 ,  G02F2201/465 ,  H05K2201/0311 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10189

Abstract: Provided are a board holder which can easily hold the relative positions of a plurality of circuit boards disposed in parallel without using a screw, an electronic device which can easily affix the circuit boards held by the board holder, and a display apparatus including the electronic device. A hole (23) that penetrates each light emitting diode board (2) in the thickness direction of the board is provided, on one end portion in the longitudinal direction of each of a plurality of light emitting diode boards (2) which have a plurality of light emitting diodes (1) mounted on one surface, respectively have substantially a strip shape, and are arranged in a plurality of rows. The board holder (4) has: protruding sections (41, 41) which are inserted into the holes (23, 23) of the adjacent light emitting diode boards (2, 2); and a coupling section (42) which is disposed in the direction orthogonally intersecting the longitudinal direction of the light emitting diode board (2), has a strip-shape, and couples respective base ends of the protruding sections (41, 41). The plurality of light emitting diode boards (2) disposed in parallel are held by inserting the protruding sections (41, 41) into the holes (23, 23).

Abstract translation: 提供一种能够容易地保持平行配置的多个电路板的相对位置而不使用螺钉的板保持器，能够容易地固定由板保持器保持的电路板的电子设备和包括电子设备的显示设备 。 在多个发光二极管板（2）的长度方向的一端部上设置有沿着板的厚度方向贯穿各发光二极管板（2）的孔（23） 安装在一个表面上的发光二极管（1）分别具有基本上的条形，并且被布置成多行。 板保持器（4）具有：插入相邻发光二极管板（2,2）的孔（23,23）中的突出部分（41,41）。 以及与所述发光二极管板（2）的长度方向正交的方向配置的耦合部（42）具有带状，并且与所述突出部（41,41）的各个基端相连接。 通过将突出部分（41,41）插入到孔（23,23）中来保持并联设置的多个发光二极管板（2）。

公开(公告)号：EP2408279A8

公开(公告)日：2012-02-29

申请号：EP11173981.9

申请日：2011-07-14

Applicant: FELA Hilzinger GmbH

Inventor： Heiser, Eberhard

IPC: H05K1/02

CPC classification number: H05K1/0278 ,  H05K1/056 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09745 ,  H05K2203/302

Abstract: Metallkernleiterplatte (1) mit einem metallischen Träger (2), auf dem auf mindestens einer seiner Hauptflächen (A, B) eine Isolierschicht (3) mit darüber angeordneten elektrischen Leiterbahnen (7a, 7b) sitzt, wobei die Metallkernleiterplatte einen Biegebereich (BB) aufweist, in welchen der metallische Träger (2) im Vergleich zur übrigen Metallkernleiterplatte (1) zumindest verdünnt ausgebildet ist. Darüber hinaus betrifft die Erfindung auch ein Verfahren zum Herstellen einer solchen Metallkernleiterplatte (1).
Vorteile: Durch das Vorsehen von Biegebereichen (BB) können die elektrischen Bauelemente (10, 100) der Metallkernleiterplatte (1) in zueinander verschiedenen Ebenen angeordnet werden.

公开(公告)号：EP2028691A3

公开(公告)日：2011-09-07

申请号：EP08014445.4

申请日：2008-08-13

Applicant: Broadcom Corporation

Inventor： Zhao, Sam Ziqun ,  Zhong, Chonghua ,  Khan, Rezavr Rahman

IPC: H01L23/58 ,  H01L21/78 ,  H01L23/00 ,  H05K3/00

CPC classification number: H01L21/78 ,  H01L23/562 ,  H01L23/585 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/09681 ,  H05K2201/09781 ,  H01L2924/00

Abstract: Systems and methods for preventing damage to a unit (e.g. a semiconductor wafer) with preventive structures are presented. In an embodiment, a unit (400) of a collection of units (ICs) includes a functional area (404) and a preventive structure (402a,402b,410) configured to prevent cracks from propagating into the functional area.