公开(公告)号：EP0777873B1

公开(公告)日：2000-05-10

申请号：EP95930072.4

申请日：1995-07-31

Applicant: TELEFONAKTIEBOLAGET LM ERICSSON

Inventor： BODAHL JOHNSEN, Helge ,  TIMGREN, Mats, Olav

IPC: G05F1/46

CPC classification number: H05K1/162 ,  H02M1/14 ,  H05K1/0262 ,  H05K1/0366 ,  H05K3/4611 ,  H05K2201/0191 ,  H05K2201/09309

公开(公告)号：EP0902048A1

公开(公告)日：1999-03-17

申请号：EP98302799.6

申请日：1998-04-09

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： Lee, Yueh-Ling ,  Min, Gary

IPC: C08K3/24 ,  C08K3/22 ,  B32B27/30 ,  B32B27/34 ,  B32B15/08 ,  H05K1/16

CPC classification number: B32B27/08 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/281 ,  B32B27/34 ,  B32B2255/20 ,  B32B2307/204 ,  B32B2379/08 ,  B32B2457/08 ,  B32B2457/16 ,  C08K3/24 ,  H05K1/0346 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/386 ,  H05K3/4611 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09309 ,  Y10T428/252 ,  Y10T428/2852 ,  Y10T428/2896 ,  Y10T428/31721 ,  C08L79/08

Abstract: A flexible, high dielectric constant polyimide film composed of either a single layer of an adhesive thermoplastic polyimide film or a multilayer polyimide film having adhesive thermoplastic polyimide film layers bonded to one or both sides of the film and having dispersed in at least one of the polyimide layers from 4 to 85 weight % of a ferroelectric ceramic filler, such as barium titanate or polyimide coated barium titanate, and having a dielectric constant of from 4 to 60.
The high dielectric constant polyimide film can be used in electronic circuitry and electronic components such as multilayer printed circuits, flexible circuits, semiconductor packaging and buried film capacitors.

Abstract translation: 一种柔性的高介电常数聚酰亚胺膜，由一层粘合的热塑性聚酰亚胺膜或多层聚酰亚胺膜组成，所述多层聚酰亚胺膜具有粘接在该膜的一面或两面上并具有分散在至少一个聚酰亚胺 4至85重量％的铁电陶瓷填料，例如钛酸钡或聚酰亚胺涂覆的钛酸钡，并且介电常数为4至60.介电常数聚酰亚胺膜可用于电子电路和电子部件，例如 作为多层印刷电路，柔性电路，半导体封装和埋膜电容器。

公开(公告)号：EP0897653A1

公开(公告)日：1999-02-24

申请号：EP97918276.0

申请日：1997-05-01

Applicant: FORD MOTOR COMPANY LIMITED ,  FORD-WERKE AKTIENGESELLSCHAFT

Inventor： GLOVATSKY, Andrew Zachary ,  TODD, Michael, George ,  MCMILLAN, Richard, Keith, II

IPC: H05K1 ,  H05K3

CPC classification number: H05K1/0207 ,  H05K1/0206 ,  H05K1/0224 ,  H05K1/0253 ,  H05K3/4092 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/0323 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/09163 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09681 ,  H05K2201/10689

Abstract: A circuit board is disclosed comprising a substantially non-conductive substrate (12) and first and second rigid sheets (14, 16). The first sheet (14) forms a grid pattern substantially encapsulated by the substrate (12), and a portion (20) of the first sheet extends beyond a boundary of the substrate to form a first interconnection terminal. The second sheet (16) is also substantially encapsulated by the substrate (12) and has a portion which extends beyond the boundary of the substrate (12) to form a second interconnection terminal. The second sheet (16) acts as an electromagnetic interference shield, and also has a coefficient of thermal expansion less than a coefficient of thermal expansion of the substrate (12).

公开(公告)号：EP0880150A2

公开(公告)日：1998-11-25

申请号：EP98109129.1

申请日：1998-05-19

Applicant: NEC CORPORATION

Inventor： Tohya, Hirokazu ,  Yoshida, Shiro ,  Shimada, Yuzo

IPC: H01F17/00

CPC classification number: H01F17/0013 ,  H05K1/0233 ,  H05K1/165 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/086 ,  H05K2201/09309 ,  H05K2201/09336 ,  H05K2201/097

Abstract: An insulative magnetic layer is disposed between a power source conductor layer and a ground conductor layer of a printed-wiring board. Two pieces of conductors are formed by cutting out a part of the power source conductor layer. Another two pieces of conductors are formed by cutting out a part of the ground conductor layer. The former conductors and the latter conductors are connected by five viaholes. A spiral coil inductor of a spiral form is formed in this way. This inductor has the strengthened inductance owing to the insulative magnetic layer provided therein.

Abstract translation: 在印刷电路板的电源导体层和接地导体层之间设置有绝缘性的磁性层。 通过切割电源导体层的一部分来形成两个导体。 通过切掉接地导体层的一部分来形成另外两个导体。 前导体和后导体通过五个通孔连接。 以这种方式形成螺旋形螺旋线圈电感器。 该电感器由于其中提供的绝缘磁性层而具有增强的电感。

公开(公告)号：EP0873046A1

公开(公告)日：1998-10-21

申请号：EP97942258.1

申请日：1997-10-06

Applicant: Fuji Xerox Co., Ltd.

Inventor： IGUCHI, Daisuke,Fuji Xerox Co., Ltd. ,  UENO, Osamu,Fuji Xerox Co., Ltd.,Green-Tech Nakai

IPC: H05K1/02

CPC classification number: H05K1/0231 ,  H05K1/023 ,  H05K2201/09309 ,  H05K2201/10022 ,  H05K2201/10446 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10689 ,  Y02P70/611

Abstract: A printed wiring board device used for electronic equipment, such as the information equipment, etc. A printed wiring board (10) has a power source layer (11) and a ground layer (12) and is mounted with active elements (3 and 4), such as digital ICs, etc. A first capacitor (1) which conductively couples the layers (11 and 12) with each other at a high frequency is provided in the peripheral section of one end side or the other end side of the section of the board (10) where the layers (11 and 12) are faced to each other. Second capacitors (2) which respectively supply transient currents to the active elements (3 and 4) are provided between the power supply pins (3V and 4V) of the elements (3 and 4) and the ground layer (12) near the elements (3 and 4). Therefore, the electromagnetic radiation caused by the power source layer (11) and the ground layer (12) of the printed wiring board (10) can be suppressed easily and remarkably.

Abstract translation: 印刷电路板（10）具有电源层（11）和接地层（12），安装有有源元件（3和4） ），例如数字IC等。在第一电容器（1）的一端侧或另一端侧的周边部分设置有以高频率将层（11和12）彼此导电耦合的第一电容器（1） （10）的层（11和12）彼此面对。 分别向有源元件（3和4）提供瞬态电流的第二电容器（2）设置在元件（3和4）的电源引脚（3V和4V）与​​元件附近的接地层（12）之间 3和4）。 因此，可以容易且显着地抑制由印刷电路板（10）的电源层（11）和接地层（12）引起的电磁辐射。

公开(公告)号：EP0789390A3

公开(公告)日：1998-01-14

申请号：EP97200966.6

申请日：1990-01-12

Applicant: TDK Corporation

Inventor： Takaya, Minoru ,  Mochizuki, Yoshinori

IPC: H01L21/48 ,  H01L25/16 ,  H05K1/16

CPC classification number: H05K1/165 ,  H01L21/4857 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49589 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/30105 ,  H03H3/00 ,  H03H7/06 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/141 ,  H05K1/142 ,  H05K1/162 ,  H05K1/167 ,  H05K3/403 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/086 ,  H05K2201/09309 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A method for producing a multi-layer hybrid circuit comprising the steps of :
providing a laminated body having a plurality of passive elements including at least one selected from a capacitor (5) and an inductor (16), and also including a resistor (9), laminating an inner wiring portion (17) on said laminated body by laminating a plurality of insulation layers and flat conductive layers, attaching a plurality of side terminals (11) on sides of said laminated body for external connection, and sintering said laminated body at about 800°C, all of the steps prior to the last step being performed without baking of the circuit being produced.

Abstract translation: 看起来像传统印刷电路板的多层混合电路具有层叠体（1），其具有多个电介质层（17,18）磁性层中的至少一个以及构成电容器的导电图案（19） 电感器和电阻器，并且安装半导体芯片。 外部连接由位于层叠体的侧壁上的侧端子（11）进行。 在一个实施例中，所述层叠体和所述半导体芯片由塑料（4）模制在一起，使得它看起来像传统的半导体芯片。 在另一个实施例中，当安装在母板上时，弹性中继板与层叠体联接，使得母板上的应力不直接施加到层压体。

公开(公告)号：EP0813355A2

公开(公告)日：1997-12-17

申请号：EP97304050.4

申请日：1997-06-11

Applicant: International Business Machines Corporation

Inventor： Lauffer, John M. ,  Papathomas, Konstantinos

IPC: H05K1/16 ,  H05K3/46

CPC classification number: H05K1/162 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/0759 ,  Y10T29/43 ,  Y10T29/435

Abstract: A method is provided for producing a capacitor to be embedded in an electronic circuit package comprising the steps of selecting a first conductor foil, selecting a dielectric material, coating the dielectric material on at least one side of the first conductor foil, and layering the coated foil with a second conductor foil on top of the coating of dielectric material. Also claimed is an electronic circuit package incorporating at least one embedded capacitor manufactured in accordance with the present invention.

Abstract translation: 提供了一种用于制造要被嵌入到电子电路封装包括：选择第一导电薄片，选择介电材料，在所述第一导体箔的至少一侧上涂覆介电材料，和分层涂覆的步骤的电容器的方法 与介电材料的涂层的顶部上的第二导体箔箔。 所以声称是一种电子电路封装掺入雅舞蹈与本发明制造的至少一个嵌入的电容器。

公开(公告)号：EP0451500B1

公开(公告)日：1997-11-19

申请号：EP91103285.2

申请日：1991-03-05

Applicant: International Business Machines Corporation

Inventor： Lauffer, John Matthew ,  Schumacher, Richard Anthony

IPC: H05K3/46 ,  H01L23/538 ,  H05K1/16

CPC classification number: H05K1/162 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/09309 ,  Y10S257/916 ,  Y10T29/435

公开(公告)号：EP0777873A1

公开(公告)日：1997-06-11

申请号：EP95930072.0

申请日：1995-07-31

Applicant: TELEFONAKTIEBOLAGET LM ERICSSON

Inventor： BODAHL JOHNSEN, Helge ,  TIMGREN, Mats, Olav

IPC: H02M1 ,  H05K1 ,  H05K3

CPC classification number: H05K1/162 ,  H02M1/14 ,  H05K1/0262 ,  H05K1/0366 ,  H05K3/4611 ,  H05K2201/0191 ,  H05K2201/09309

Abstract: The invention relates to a coupling device presenting a capacitance belonging to a board with a printed circuit, where said board (1) consists of several electrically conducting layers (50e, 50g) with electrically isolating layers in between (50eg). A surface extension of a reference potential related layer (50e), an opposite surface extension of a supply voltage related layer (50g) and a chosen distance in between said layers are adapted to form a capacitor function to smooth voltage spikes so that the DC-supply voltage can be constant around circuits (2) mounted on said board even at rapid current variations as said circuits and/or components are activated.

公开(公告)号：EP0495470A3

公开(公告)日：1994-02-23

申请号：EP92100541.9

申请日：1992-01-15

Applicant: Firma Carl Zeiss ,  CARL ZEISS-STIFTUNG HANDELND ALS CARL ZEISS

Inventor： Benninger, Ralf

IPC: H04B15/02

CPC classification number: H05K1/0231 ,  H02M3/155 ,  H04B15/02 ,  H05K1/0215 ,  H05K2201/0715 ,  H05K2201/09309 ,  H05K2201/09672 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: Anordnung zur Entstörung eines Schaltnetzteils, mit einem Leistungsteil, das ein schaltendes Bauteil (3) enthält und auf einer Platine mit mehreren Leiterebenen (10 - 15, 101, 102) und jeweils dazwischenliegenden Isolierschichten (91 - 95) aufgebaut ist, wobei die beiden Pole (+, -) des Leistungsteils in übereinanderliegenden ersten (10 - 12) und zweiten (13) Leiterbahnen geführt werden und mit dem Eingang (10) des schaltenden Bauteils (3) zwei ober-und unterhalb davon liegenden dritte und vierte Leiterebenen (101, 102) mit flächigen Leitern verbunden sind, und zwei ober- und unterhalb davon liegende fünfte und sechste Leiterebenen (14, 15) mit flächigen Leitern mit Gerätemasse (16) verbunden sind. Verwendung zur Stromversorgung der Bogenlampen eines Festkörperlasers.

Abstract translation: 被建立，其特征在于，用于与功率部件的开关电源，它包括一个切换部件的干扰抑制的两个极装置（3）和在具有多个导体平面的电路板（10 - - 15，101,102），并且每个中间绝缘层（95 91） （+， - ） - 在第一叠加在动力单元（12 10）的执行和第二（13）的导体和所述切换构件（3）的输入端（10）包括两个顶部和位于下面其第三和第四导体层（101， 102）连接到平面导体，并且在它上面和下面的两个连接具有带有装置接地（16）的扁平导体的第五和第六导体平面（14,15）。 用于为固态激光器的弧光灯供电。