公开(公告)号：EP3358674A1

公开(公告)日：2018-08-08

申请号：EP18153562.6

申请日：2018-01-26

Applicant: Astra Gesellschaft Für Asset Management MbH&Co. Kg

Inventor： Stobbe, Anatoli ,  Maaß, Norman

IPC: H01Q1/27 ,  H01Q1/38 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  H01B7/08

CPC classification number: H05K1/028 ,  B33Y80/00 ,  H01Q1/273 ,  H01Q1/38 ,  H05K1/0298 ,  H05K1/038 ,  H05K1/095 ,  H05K1/097 ,  H05K3/1216 ,  H05K3/1241 ,  H05K3/1275 ,  H05K2201/0329 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/09709 ,  H05K2203/0108

Abstract: Es wird eine iegsame Antennenanordnung, bestehend aus einem textilen Flächengebilde und einem darauf angeordneten mehradrigen Antennenleiter beschrieben.
Der Antennenleiter (10) auf einem biegsamen, elektrisch nicht leitfähigen Träger (12) angeordnet, wobei der Träger aus einem Film, einer Folie oder einem textilen Flächengebilde besteht, und der Antennenleiter (10) aus mehreren parallel zueinander verlaufenden Leiterbahnen (14, 16, 18, 20) besteht, die elektrisch gegenseitig isoliert sind.

公开(公告)号：EP2493032B1

公开(公告)日：2018-07-11

申请号：EP12168804.8

申请日：2007-04-10

Applicant: CommScope Technologies LLC

Inventor： Hammond, Bernard ,  Murray, David P. ,  George, Ian R.

IPC: H01R24/64 ,  H01R13/6466

CPC classification number: H01R13/6466 ,  H01R4/2429 ,  H01R13/6477 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10S439/941

Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a crosstalk compensation arrangement for reducing crosstalk at the jack. The circuit board also includes arrangements that reduce return loss at the jack.

公开(公告)号：EP2480055B1

公开(公告)日：2017-10-25

申请号：EP12000868.5

申请日：2004-08-13

Applicant: Intel Corporation

Inventor： McCall, James ,  Shykind, Shawn, W.

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H05K3/10 ,  H05K1/0216 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0366 ,  H05K3/0052 ,  H05K2201/0187 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09972 ,  H05K2203/1554 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49798 ,  Y10T428/24058 ,  Y10T428/24917 ,  Y10T428/249935 ,  Y10T428/24994 ,  Y10T428/249943 ,  Y10T428/249946 ,  Y10T442/2926 ,  Y10T442/2992 ,  Y10T442/3065

公开(公告)号：EP3107149A1

公开(公告)日：2016-12-21

申请号：EP16174869.4

申请日：2016-06-16

Applicant: Ingenico Group

Inventor： ANDRE, Jérôme ,  HERNANDEZ, Vincent

IPC: H01Q1/38 ,  H05K1/02 ,  H05K1/16 ,  H04B5/00

CPC classification number: H01Q7/02 ,  H01Q1/38 ,  H05K1/028 ,  H05K1/165 ,  H05K2201/052 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/0979 ,  H05K2201/10098

Abstract: L'invention se rapporte à un circuit imprimé flexible (10, 200) de forme longitudinale, comprenant au moins une piste conductrice (101, 201, 202, 203) s'étendant sur la longueur du circuit imprimé flexible, le circuit imprimé flexible comprenant au moins une zone de pliage (105, 205) conformée pour autoriser le passage dudit circuit imprimé flexible d'un état déplié à un état plié dans lequel la piste conductrice forme au moins une boucle d'antenne.

Abstract translation: 本发明涉及纵向形状，包括至少一个导电迹线延伸在所述柔性印刷电路的长度的柔性印刷电路板，所述柔性印刷电路板包括至少一个折叠区域形，以便允许所述柔性印刷电路板，以 从在展开状态传递给其中导电轨迹形成至少一个天线环的折叠状态。

公开(公告)号：EP2227927B1

公开(公告)日：2016-08-31

申请号：EP08859312.4

申请日：2008-12-09

Applicant: Airbus Group SAS

Inventor： ASPAS-PUERTOLAS, Jesus

IPC: H05K1/14 ,  H05K3/10 ,  H05K3/28 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/103 ,  H05K1/142 ,  H05K3/281 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/09236 ,  H05K2201/09681 ,  H05K2201/10287

公开(公告)号：EP2519086B1

公开(公告)日：2016-03-23

申请号：EP11163695.7

申请日：2011-04-26

Applicant: Tyco Electronics Belgium EC BVBA ,  Tyco Electronics Nederland B.V.

Inventor： Smink, Rutger ,  Decrock, Lieven

IPC: H05K1/02 ,  H01R107/00 ,  H01R13/6461 ,  H01R13/6476 ,  H01R13/6466 ,  H01R12/62

CPC classification number: H01R13/6461 ,  H01R9/032 ,  H01R12/62 ,  H01R13/6466 ,  H01R13/6585 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0219 ,  H05K1/0221 ,  H05K1/0225 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/09236 ,  H05K2201/0969 ,  H05K2201/10287

公开(公告)号：EP2904204A4

公开(公告)日：2015-11-25

申请号：EP13882614

申请日：2013-10-31

Applicant: HALLIBURTON ENERGY SERVICES INC

Inventor： BONAVIDES CLOVIS S ,  COOPER HOMI PHIROZE

IPC: E21B47/125 ,  E21B47/09 ,  G01V3/22 ,  G01V11/00 ,  H05K1/02

CPC classification number: E21B47/12 ,  G01V3/22 ,  H05K1/0228 ,  H05K2201/09236 ,  H05K2203/101 ,  H05K2203/105

公开(公告)号：EP2738799A4

公开(公告)日：2015-06-17

申请号：EP11870478

申请日：2011-07-29

Applicant: NGK INSULATORS LTD

Inventor： TANI MAKOTO ,  HIRAI TAKAMI ,  YANO SHINSUKE ,  NANATAKI TSUTOMU

IPC: H01L23/13 ,  H01L23/15 ,  H01L23/32 ,  H01L23/498 ,  H05K3/46

CPC classification number: H01L23/49822 ,  H01L23/15 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4629 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09672 ,  H01L2924/00

公开(公告)号：EP2684431A1

公开(公告)日：2014-01-15

申请号：EP12755093.7

申请日：2012-03-05

Applicant: MediaTek, Inc

Inventor： CHEN, Nan-Jang

IPC: H05K1/02

CPC classification number: H05K1/0219 ,  H01P3/08 ,  H05K1/0224 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/09236

Abstract: A printed circuit board (PCB) is disclosed. The PCB (200) includes a substrate (202) have a top surface (202a) and a bottom surface (202b). A first conductive layer (203) is disposed on the top surface of the substrate. The first conductive layer comprises a first signal net (203a) and a second signal net (203b). An outermost insulating layer (204) is disposed on the top surface of the substrate to cover the substrate and the first conductive layer. The outmost insulating layer comprises an opening (209) to expose a portion of the second signal net. And, a second conductive layer (207) is disposed on the outermost insulating layer and substantially covering at least a portion of the first signal net. The second conductive layer is filled into the opening to electrically connect to the second signal net which is able to provide one of a ground potential and a power potential. The thickness of outermost insulating layer (204) is less than 1 mm.

公开(公告)号：EP2179634B1

公开(公告)日：2013-10-09

申请号：EP08795313.9

申请日：2008-08-13

Applicant: Force 10 Networks, Inc.

Inventor： GOERGEN, Joel, R. ,  HUNT, Greg

IPC: H05K3/42 ,  H05K1/02

CPC classification number: H05K3/429 ,  H05K1/0216 ,  H05K1/0237 ,  H05K3/0047 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09845 ,  H05K2203/0207 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165