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公开(公告)号：EP0303384A3
公开(公告)日：1989-10-25
申请号：EP88307130.0
申请日：1988-08-02
Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY
Inventor： Tanaka, Kiyotaka , Hirasawa, Yuji , Emori, Kenji , Tasaka, Yoshihiko
CPC classification number: H05K3/244 , H01R4/04 , H01R12/52 , H05K3/323 , H05K3/361 , H05K2201/0221 , H05K2201/0233
Abstract: A flexible connector comprising a thin metallic film circuit on a substrate and an anisotropic electrically conductive adhesive layer thereover, where said adhesive layer contains plastic particles having at least one metallic coating on the surface thereof.
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公开(公告)号：EP0303384A2
公开(公告)日：1989-02-15
申请号：EP88307130.0
申请日：1988-08-02
Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY
Inventor： Tanaka, Kiyotaka , Hirasawa, Yuji , Emori, Kenji , Tasaka, Yoshihiko
CPC classification number: H05K3/244 , H01R4/04 , H01R12/52 , H05K3/323 , H05K3/361 , H05K2201/0221 , H05K2201/0233
Abstract: A flexible connector comprising a thin metallic film circuit on a substrate and an anisotropic electrically conductive adhesive layer thereover, where said adhesive layer contains plastic particles having at least one metallic coating on the surface thereof.
Abstract translation: 一种柔性连接器，包括在基板上的薄金属膜电路和其上的各向异性导电粘合剂层，其中所述粘合剂层包含其表面上具有至少一个金属涂层的塑料颗粒。
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公开(公告)号：EP2282328B1
公开(公告)日：2015-09-02
申请号：EP09754513.1
申请日：2009-03-31
Applicant: Dexerials Corporation
Inventor： SUGA, Yasuhiro
CPC classification number: H05K3/323 , C08K3/36 , C08K9/04 , C09J163/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/32225 , H01L2224/73204 , H01L2224/83851 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H05K2201/0209 , H05K2201/0221 , H01L2924/00 , H01L2924/05442 , H01L2924/00014 , H01L2924/05432 , H01L2924/05341 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
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84.发明授权THERMOPLASTIC RESIN COMPOSITION, RESIN ARTICLE, AND METHOD OF MANUFACTURING RESIN ARTICLE WITH PLATED LAYER 有权热固性树脂组合物的树脂制品及其制备方法的树脂制品具有镀敷层
公开(公告)号：EP2711399B1
公开(公告)日：2014-12-31
申请号：EP13764808.5
申请日：2013-03-15
Applicant: Mitsubishi Engineering-Plastics Corporation
Inventor： TAKANO Takahiro , SUMINO Takahiko , ISHIHARA Kentarou
IPC: C08L101/00 , C08K3/22 , C08K3/34 , C08K3/40 , C08K7/14 , C08L77/00 , H05K1/03 , H05K3/10 , C08K9/02
CPC classification number: C08K3/00 , C08K3/22 , C08K3/2279 , C08K3/40 , C08K7/14 , C08K9/02 , C08K2003/2231 , C08K2003/2241 , C08L23/06 , C08L77/06 , C08L91/06 , C08L101/12 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/204 , C23C18/32 , C23C18/38 , C23C18/42 , F21V7/22 , H05K1/0373 , H05K3/105 , H05K2201/0129 , H05K2201/0209 , H05K2201/0221 , H05K2201/0245 , H05K2201/0254 , H05K2201/0293 , H05K2201/0347 , H05K2201/09118 , H05K2201/10106 , H05K2201/2054 , H05K2203/0723 , H05K2203/107
Abstract: Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10°C/min, of 250°C or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.
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公开(公告)号：EP2582214B1
公开(公告)日：2014-11-26
申请号：EP12188121.3
申请日：2012-10-11
Applicant: Shin-Etsu Chemical Co., Ltd.
Inventor： Hamada, Yoshitaka , Yamakawa, Naoki
IPC: H05K1/09 , C09D11/00 , H05K3/12 , H01L23/482
CPC classification number: H05K1/095 , C09D11/037 , C09D11/52 , H01L2924/0002 , H05K3/1216 , H05K3/1283 , H05K2201/0218 , H05K2201/0221 , H05K2201/0224 , H05K2201/0245 , H01L2924/00
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Patent Agency Ranking86.发明公开Conductive fine particles, method for plating fine particles, and substrate structure 审中-公开导电性细颗粒，细颗粒和衬底结构的镀覆方法
公开(公告)号：EP2495732A3
公开(公告)日：2014-04-16
申请号：EP12003885.6
申请日：2001-04-27
Applicant: Sekisui Chemical Co., Ltd.
Inventor： Kuroda, Hiroshi , Okinaga, Nobuyuki
CPC classification number: H01R4/00 , H01R4/02 , H01R4/04 , H01R13/035 , H05K3/321 , H05K3/3436 , H05K3/3473 , H05K3/3484 , H05K2201/0212 , H05K2201/0221 , H05K2201/068 , H05K2203/0425 , Y02P70/613 , Y10T428/12181 , Y10T428/2991
Abstract: This invention provides a conductive fine particle for soldering two or more electrodes of an electric circuit, the conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like.
A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3 × 10 -5 to 7 × 10 -5 (1/K).-
87.发明授权
公开(公告)号：EP2053615B1
公开(公告)日：2013-10-16
申请号：EP07791966.0
申请日：2007-08-03
Applicant: I.S.T. Corporation
Inventor： HAMA, Nobuyuki , TAKEDA, Yasuaki , MORIUCHI, Koji
IPC: H01B1/22 , C09D179/08
CPC classification number: H01B1/22 , C08K5/378 , C08K9/02 , C08L79/08 , C09D179/08 , C09J9/02 , C09J11/04 , C09J11/06 , C09J179/08 , H05K1/095 , H05K2201/0154 , H05K2201/0221 , H05K2203/124
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公开(公告)号：EP2582214A2
公开(公告)日：2013-04-17
申请号：EP12188121.3
申请日：2012-10-11
Applicant: Shin-Etsu Chemical Co., Ltd.
Inventor： Hamada, Yoshitaka , Yamakawa, Naoki
CPC classification number: H05K1/095 , C09D11/037 , C09D11/52 , H01L2924/0002 , H05K3/1216 , H05K3/1283 , H05K2201/0218 , H05K2201/0221 , H05K2201/0224 , H05K2201/0245 , H01L2924/00
Abstract: A conductive circuit is formed by printing a pattern using a conductive ink composition and heat curing the pattern. A thixotropic agent, typically carbon black is added to the solvent-free ink composition comprising an addition type silicone resin precursor, a curing catalyst, and conductive particles. The ink composition has such thixotropy that the printed pattern may retain its shape after curing.
Abstract translation: 通过使用导电油墨组合物印刷图案并热固化图案来形成导电电路。 将触变剂（通常为炭黑）加入到包含加成型有机硅树脂前体，固化催化剂和导电颗粒的无溶剂油墨组合物中。 油墨组合物具有这样的触变性，即印刷图案可以在固化后保持其形状。
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公开(公告)号：EP2451014A4
公开(公告)日：2013-03-13
申请号：EP10794233
申请日：2010-07-01
Applicant: HITACHI CHEMICAL CO LTD
Inventor： TAKAI KENJI , EJIRI YOSHINORI , NAGAHARA YUUKO , MATSUZAWA MITSUHARU
IPC: H05K3/32
CPC classification number: H05K3/323 , B22F1/0062 , B22F1/025 , B22F2998/10 , H05K2201/0221 , H05K2201/0224 , H05K2201/0338 , B22F1/02
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90.发明公开CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL 审中-公开电路连接材料和电路元件的连接结构的电路元件的连接方法在电路连接材料的基
公开(公告)号：EP2178094A4
公开(公告)日：2013-02-20
申请号：EP08791996
申请日：2008-07-31
Applicant: HITACHI CHEMICAL CO LTD
Inventor： TOMISAKA KATSUHIKO , KOBAYASHI KOUJI , TAKETATSU JUN , ARIFUKU MOTOHIRO , KOJIMA KAZUYOSHI , MOCHIZUKI NICHIOMI
IPC: C09J9/02 , C09J11/04 , C09J163/00 , H05K3/32 , H05K3/36
CPC classification number: H05K3/323 , C08K7/16 , C08K9/02 , C09J9/02 , C09J11/04 , C09J163/00 , H01L24/29 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/13016 , H01L2224/13144 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29439 , H01L2224/29447 , H01L2224/29455 , H01L2224/29499 , H01L2224/2989 , H01L2224/81903 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H01R11/01 , H01R12/52 , H01R13/03 , H05K2201/0218 , H05K2201/0221 , Y10T29/49117 , Y10T428/256 , H01L2924/01028 , H01L2924/01026 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: A circuit connection material 10 comprising an adhesive composition 11 and conductive particles 12, wherein the conductive particles 12 are conductive particles 12 with protrusions 14 comprising one or more metal layers 22 on a core 21, with the metal layer 22 being formed on at least surfaces of the protrusions 14 and the metal layer 22 being composed of nickel or a nickel alloy, and compression modulus of the conductive particles 12 under 20% compression is 100-800 kgf/mm 2 .
Abstract translation: 一种电路连接材料10，其包括粘合剂组合物11和导电粒子12，worin导电性粒子12是导电性粒子12与突起部14上的芯21，其包括一个或多个金属层22，与金属层22的至少表面上形成 突起部14和金属层22的部分由镍或镍合金，和导电性粒子12在20％的压缩是100-800千克力/毫米2的压缩模量的。
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