公开(公告)号：EP1643552A1

公开(公告)日：2006-04-05

申请号：EP04731753.2

申请日：2004-05-07

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： HANDA, Hiroyuki ,  NAKATANI, Seiichi ,  HIRANO, Koichi ,  INOUE, Osamu ,  ISHIKAWA, Akihiro ,  YOSHIDA, Tsunenori

IPC: H01L25/00 ,  H05K3/46

CPC classification number: H01L25/16 ,  H01L23/5389 ,  H01L2224/73204 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K1/185 ,  H05K3/4614 ,  H05K2201/0209 ,  H05K2201/10416

Abstract: In a module (51) including circuit elements, a plurality of wires (12), which are generally two-dimensionally formed, are multi-layered via electrically insulating material (11), which comprises a mixture including at least filler and electrically insulating resin. One or more circuit elements are electrically connected to the wires, and at least a part of those circuit elements is embedded in the electrically insulating material. The module (51) further includes a heat sink member (13) that has a higher thermal conductivity than the electrically insulating material, and that, when viewed from the direction of multi-layering the wires, overlaps with a circuit element (14), which is one of those circuit elements, exhibiting the highest temperature rise at least in the module.

Abstract translation: 在包括电路元件的模块（51）中，通过电绝缘材料（11），通常二维地形成多个电线（12），其包括至少包含填料和电绝缘树脂的混合物 。 一个或多个电路元件电连接到电线，并且这些电路元件的至少一部分嵌入电绝缘材料中。 模块（51）还包括具有比电绝缘材料更高的热导率的散热构件（13），并且当从多层的方向观察时，导线与电路元件（14）重叠， 这是这些电路元件之一，至少在模块中呈现最高的温度上升。

公开(公告)号：EP1639869A1

公开(公告)日：2006-03-29

申请号：EP04729604.1

申请日：2004-04-27

Applicant: Korstens & Goossens GmbH

Inventor： GRÜTER, Ernst-Christoph

IPC: H05K1/02

CPC classification number: H05K1/0265 ,  H05K1/0203 ,  H05K1/183 ,  H05K2201/0919 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2201/10416

Abstract: The invention relates to a printed circuit board comprising at least one non conductive support plate (1) equipped with components and printed conductors for electrically contacting said components, at least one low-current circuit arrangement (2) for coupling or transmitting low current outputs and at least one high-current circuit arrangement (3) for coupling and/or transmitting high current outputs. Printed circuit boards of this type are known, but have the disadvantage of being inflexible or expensive to produce. To solve this problem, the inventive high-current circuit arrangement is only situated in one section of the printed circuit board and in order to house the printed conductors (4) and/or the contact block (5) of the high-current circuit arrangement (3), the support plate (1) comprises at least one component receptacle (6) in the form of a pocket-type recess or continuous cavity, in which the printed conductors (4) and/or the contact block (5) of the high-current circuit arrangement (3) are mounted.

Abstract translation: 本发明涉及一种印刷电路板，其包括至少一个配备有用于电接触所述部件的部件和印刷导体的不导电支撑板（1），至少一个用于耦合或传输低电流输出的低电流电路装置（2）以及 至少一个用于耦合和/或传输高电流输出的高电流电路装置（3）。 这种类型的印刷电路板是已知的，但是具有生产不灵活或昂贵的缺点。 为了解决这个问题，本发明的大电流电路装置仅位于印刷电路板的一个部分中，并且为了容纳大电流电路装置的印刷导体（4）和/或接触块（5） （3）中，所述支撑板（1）包括至少一个形式为袋状凹部或连续腔的部件容纳部（6），其中印刷导体（4）和/或接触块（5） 大电流电路装置（3）被安装。

公开(公告)号：EP1638384A1

公开(公告)日：2006-03-22

申请号：EP05445068.9

申请日：2005-09-12

Applicant: Danaher Motion Stockholm AB

Inventor： Nilson, thord Agne Gustaf ,  Ro, Ola ,  Karlsson, Ulf Bengt Ingemar ,  Förborgen, Carl Erik Mikael ,  Berglund, Jan Anders ,  Röcklinger, Erik Hakan

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K1/0204 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/10166 ,  H05K2201/10416

Abstract: A circuit arrangement comprises a circuit board (10), a semi-conductor (12) provided on a first side of the circuit board, and a heat sink (15) provided on a second side of the circuit board opposite to the first side and in heat transferring contact with the power semi-conductor. A heat conductive element (13) is provided in a hole (10a) in the circuit board, wherein the heat conductive element is positioned in heat transferring contact with both the semi-conductor and the heat sink for transfer of heat generated by the semi-conductor to the heat sink. A circuit arrangement is provided, wherein the provision of a low thermal resistance path through the circuit board by means of heat conductive elements provides a compact circuit arrangement well suited for assembly by means of an automated surface mounting process.

Abstract translation: 电路装置包括电路板（10），设置在电路板的第一侧上的半导体（12）和设置在电路板的与第一侧相对的第二侧上的散热片（15），以及 与电力半导体传热接触。 导电元件（13）设置在电路板的孔（10a）中，其中导热元件与半导体和散热片传热接触，用于传递由半导体元件产生的热量， 导体到散热器。 提供了一种电路装置，其中通过导热元件提供通过电路板的低热阻路径提供了非常适合于通过自动表面安装工艺组装的紧凑的电路布置。

公开(公告)号：EP1622432A2

公开(公告)日：2006-02-01

申请号：EP05014706.5

申请日：2005-07-06

Applicant: Patent -Treuhand-Gesellschaft für elektrische Glühlampen mbH

Inventor： Müller, Patrick ,  Hockel, Jens Florian

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K2201/0323 ,  H05K2201/10106 ,  H05K2201/10416

Abstract: Es wird eine Leiterplatte angegeben, mit einer thermisch leitende und elektrisch isolierenden Schicht (1) an der Oberseite der Leiterplatte (6) und ein Wärmeleitelement (2), das die Schicht (1) thermisch mit der Unterseite der Leiterplatte (6) verbindet. Ferner wird ein Verfahren zur Herstellung einer solchen Leiterplatte (6) angegeben. Die Leiterpatte (6) zeichnet sich dabei besonders durch ihre guten Wärmeleiteigenschaften aus.

Abstract translation: 电路板在电路板的上侧具有热和电绝缘的涂层，以及将涂层热连接到电路板的下侧的导热元件。 该涂层含有至少一种具有至少100Ωm的比电阻和至少100W / mK的热导率的材料。 还包括以下独立权利要求：（A）制造电路板的方法; 和（B）使用用于从光电子部件去除热量的碳涂覆体。

公开(公告)号：EP1496546A2

公开(公告)日：2005-01-12

申请号：EP04076633.9

申请日：1998-09-23

Applicant: Hewlett-Packard Company

Inventor： Rubens, Paul A. ,  Gilson, Charlie W. ,  Spreadbury, Brian G. ,  Irmscher, Horst F. ,  Jondrow, Tim J.

IPC: H01L21/48 ,  H05K1/02

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L23/4006 ,  H01L24/50 ,  H01L2924/14 ,  H05K2201/10409 ,  H05K2201/10416 ,  H05K2201/1059 ,  H05K2201/10681 ,  H05K2203/0191 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A heat conductive substrate (50) is mounted within a through-opening (60) of a printed circuit board (52). An integrated circuit (42) then is mounted to one side of the heat conductive substrate, while a heat sink (90) is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions (71) of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap (75) occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery (67) of the substrate.

Abstract translation: 导热基板（50）安装内的通孔的印刷电路板（52）的（60）。 一种集成电路（42），然后被安装到导热基片的一侧，而一个热沉（90）被固定在热接触于基板的另一侧。 有IC和PCB板之间没有直接的热接触。 导热基板，通过施加受控的压力到衬底的多个部分（71）的正常表面安装到印刷电路板上。 搜索压力减小厚度和扩展被按压部锁定基板到PC板的面积。 的空气间隙（75）的基片与PC板间的发生到处除了基板的按压区域。 搜索被按压区域沿所述基板的周缘（67）好发。

公开(公告)号：EP1195813A3

公开(公告)日：2005-01-05

申请号：EP01302542.4

申请日：2001-03-20

Applicant: Sanyo Electric Co., Ltd.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Okada, Yukio ,  Igarashi, Yusuke ,  Maehara, Eiju ,  Takahashi, Kouji

IPC: H01L23/367 ,  H01L23/433 ,  H01L23/31 ,  H01L21/68

CPC classification number: H01L24/32 ,  G11B5/4853 ,  H01L21/4832 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68377 ,  H01L2224/02166 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/10416 ,  H05K2201/10727 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01046 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to the heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially within a same plane, so that it is readily affixed to a second supporting member (24). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) and the second supporting member (24).

公开(公告)号：EP1276357A3

公开(公告)日：2004-08-25

申请号：EP02015752.5

申请日：2002-07-13

Applicant: Behr-Hella Thermocontrol GmbH

Inventor： Röhling, Hans-Dieter

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K3/4046 ,  H05K2201/0347 ,  H05K2201/10416

Abstract: Die Leiterplatte für elektrische Schaltungen ist mit einer Trägerplatte (12) versehen, die eine Ober- und eine Unterseite (14,16) aufweist, wobei sich in mindestens einer dieser Seiten (14,16) der Trägerplatte (12) eine von einem Rand begrenzte Ausnehmung (22) befindet. Ferner ist die Leiterplatte mit einem ein elektrisch leitendes Material aufweisenden Wärmeleitelement (24) versehen, das in die mindestens eine Ausnehmung (22) eingepasst und im wesentlichen mit der betreffenden Seite (14,16) der Trägerplatte (12) fluchtend angeordnet ist. Auf mindestens der mit der mindestens einen Ausnehmung (22) versehenen Seite (14,16) der Trägerplatte (12) verlaufen Leiterbahnen (32) aus elektrisch leitendem Material. Das Wärmeleitelement (24) ist von dem elektrisch leitenden Material der Leiterbahnen (32) überdeckt und diese Überdeckung (34) erstreckt sich zumindest bereichsweise bis über den Rand der Ausnehmung (22).

公开(公告)号：EP1445799A2

公开(公告)日：2004-08-11

申请号：EP04002127.1

申请日：2004-01-31

Applicant: Leopold Kostal GmbH & Co. KG

Inventor： Hütz, Uwe ,  Rüggen, Christian

IPC: H01L23/367

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K2201/09981 ,  H05K2201/10166 ,  H05K2201/10416 ,  H01L2924/00

Abstract: Die Erfindung betrifft eine elektrische Einrichtung mit einer metallkaschierten Leiterplatte, der ein auf einer ihrer beiden Oberflächen angeordneter, an von Anteilen der Metallkaschierung gebildeten Leiterbahnen der Leiterplatte angeschlossener, Wärmeenergie abgebender elektrischer Baustein zugeordnet ist, der über ein in einem mit einer an seiner Wandung vorhandenen duktilen Metallschicht versehenen Durchbruch der Leiterplatte form- und kraftschlüssig gehaltenes metallisches Verbindungselement mit einem auf der anderen der beiden Oberflächen der Leiterplatte angeordneten Kühlkörper über ein wärmeleitendes Mittel gekoppelt ist, dadurch gekennzeichnet, daß die in dem Durchbruch vorhandene duktile Metallschicht zur elektrischen Verbindung von auf beiden Oberflächen der Leiterplatte angeordneten Anteilen der Metallkaschierung vorgesehen ist und mit einer am Verbindungselement vorhandenen, strukturierten Oberfläche in mechanischem Eingriff steht, die an einem dem Durchbruch zugeordneten (ersten) Bereich des Verbindungselementes ausgebildet ist.

Abstract translation: 该装置具有金属封装电路板（1）。 相关联的电模块（2）布置在电路板表面之一上。 该模块连接到电路板的一些导电轨道并产生热能。 模块通过设置在电路板的金属化通孔中的金属连接器元件（3）经由导热装置（5）耦合到电路板的另一侧上的冷却体（4）。 通孔中的金属层在电路板两侧的金属外壳之间提供电连接。 金属层与连接元件（3）上的结构化表面机械接合。

公开(公告)号：EP1342305A2

公开(公告)日：2003-09-10

申请号：EP01270942.4

申请日：2001-12-13

Applicant: Ascom Energy Systems AG

Inventor： JITARU, Ionel, Dan

IPC: H02J1/00 ,  H02M3/335

CPC classification number: H02J1/102 ,  H01F27/06 ,  H02M7/003 ,  H05K1/0204 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/10166 ,  H05K2201/10416

Abstract: A modular power supply. A plurality of power supply modules and a system control circuit for controlling the power supply modules are provided. Each power supply module has a power circuit coupled to a power input of the module for receiving an input power current and produces an output power current at a power output of the module. The power circuits each include at least one switching element for switching the input power current or the output power current of a module. The power circuits further include a control circuit input that is coupled directly to the respective said switching device. The system control circuit includes a control circuit output bus for connecting to the control circuit inputs of each of the power modules and provides a respective signal to each module for directly controlling the respective switching devices.

公开(公告)号：EP1325545A2

公开(公告)日：2003-07-09

申请号：EP01975308.6

申请日：2001-09-24

Applicant: M-Flex Multi-Fineline Electronix, Inc.

Inventor： HARDING, Philip, A.

IPC: H02M1/00

CPC classification number: H01F41/046 ,  H01F17/0033 ,  H05K1/165 ,  H05K3/06 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/097 ,  H05K2201/10416 ,  Y10S29/016 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49075 ,  Y10T29/49165

Abstract: The present invention relates to the methods of construction for inductive components of, preferably, ferromagnetic materials such as inductors, chokes, and transformers when used as an integral part of the fabrication of PCB's or FLEX's. In one preferred embodiment, holes (56, 58) are formed through a ferromagnetic substrate (50) and plated with conductive material. The arrangement of these holes, and the subsequent design that ensues, will form the inductive components within the plane of the media in which the device is formed; using the substrate (50) for a magnetic core (90). By using this approach, the inductive components can be miniaturized to physical sizes compatible with the requirements of modern surface mount technology (SMT) for integrated circuitry (IC). This process also allows these components to be fabricated using mass production techniques, thereby avoiding the need to handle discrete devices during the manufacturing process. In another preferred embodiment, a series of thin, concentric high permeability rings (315) are etched on a substrate (330) to provide high permeability transformers and inductors having minimal eddy current effects.