High-frequency switch module
    71.
    发明专利

    公开(公告)号:JP5333578B2

    公开(公告)日:2013-11-06

    申请号:JP2011504826

    申请日:2010-03-12

    Abstract: In a high-frequency switch module, a switch IC is mounted on a multilayer board to define a high-frequency switch module. The multilayer board includes two internal wirings and two internal ground electrodes. The internal ground electrodes are spaced apart from each other at an interval when viewed from a lamination direction of the multilayer board. The first internal wiring is located on the upper surface side of the first internal ground electrode, and is entirely separated from an RF wiring, and the first internal wiring includes a power supply wiring for supplying power to the switch IC. The second internal wiring is located on the upper surface side of the second internal ground electrode, and is entirely separated from the power supply wiring, and the second internal wiring includes a signal wiring through which an RF signal propagates.

    Wiring board
    77.
    发明专利
    Wiring board 有权
    接线板

    公开(公告)号:JP2012199426A

    公开(公告)日:2012-10-18

    申请号:JP2011063152

    申请日:2011-03-22

    Inventor: HIRAOKA TETSUYA

    Abstract: PROBLEM TO BE SOLVED: To inhibit propagation of cracks occurred in an insulation layer of a wiring board without deteriorating electric characteristics of wiring arranged in each layer of the wiring board.SOLUTION: The wiring board comprises first wiring, second wiring, third wiring, fourth wiring, and an insulation layer. In a thickness direction of the wiring board, the first wiring and the fourth wiring do not overlap with each other. In the thickness direction of the wiring board, the second wiring and the third wiring do not overlap with each other. A hill and a trough are provided on a lateral face of the first wiring in a region where the first wiring and the second wiring are adjacent to each other. A hill and a trough are provided on a lateral face of the second wiring in a region where the first wiring and the second wiring are adjacent to each other. In the thickness direction of the wiring board, the trough provided on the lateral face of the first wiring and the third wiring overlap with each other. In the thickness direction of the wiring board, the trough provided on the lateral face of the second wiring and the fourth wiring overlap with each other.

    Abstract translation: 要解决的问题:在不会使配线板的各层配置的配线的电气特性恶化的情况下,抑制布线基板的绝缘层发生裂缝的传播。 解决方案:布线板包括第一布线,第二布线,第三布线,第四布线和绝缘层。 在布线板的厚度方向上,第一布线和第四布线彼此不重叠。 在布线板的厚度方向上,第二布线和第三布线彼此不重叠。 在第一布线和第二布线彼此相邻的区域中,在第一布线的侧面上设置有凹槽和槽。 在第一布线和第二布线彼此相邻的区域中,在第二布线的侧面上设置有凹槽和槽。 在布线板的厚度方向上,设置在第一布线和第三布线的侧面上的槽彼此重叠。 在布线板的厚度方向上,设置在第二布线的侧面和第四布线的槽重叠。 版权所有(C)2013,JPO&INPIT

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