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公开(公告)号:JP5333578B2
公开(公告)日:2013-11-06
申请号:JP2011504826
申请日:2010-03-12
Applicant: 株式会社村田製作所
CPC classification number: H01P1/15 , H01P1/10 , H05K1/0227 , H05K1/0237 , H05K2201/09663 , H05K2201/09972
Abstract: In a high-frequency switch module, a switch IC is mounted on a multilayer board to define a high-frequency switch module. The multilayer board includes two internal wirings and two internal ground electrodes. The internal ground electrodes are spaced apart from each other at an interval when viewed from a lamination direction of the multilayer board. The first internal wiring is located on the upper surface side of the first internal ground electrode, and is entirely separated from an RF wiring, and the first internal wiring includes a power supply wiring for supplying power to the switch IC. The second internal wiring is located on the upper surface side of the second internal ground electrode, and is entirely separated from the power supply wiring, and the second internal wiring includes a signal wiring through which an RF signal propagates.
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72.
公开(公告)号:JP5319417B2
公开(公告)日:2013-10-16
申请号:JP2009150070
申请日:2009-06-24
Applicant: 三星電子株式会社Samsung Electronics Co.,Ltd.
CPC classification number: H05K1/0295 , H01L25/0753 , H01L2224/16225 , H05K2201/09227 , H05K2201/09254 , H05K2201/09318 , H05K2201/0949 , H05K2201/09663 , H05K2201/09954 , H05K2201/10106 , H05K2203/173
Abstract: A sub-mount adapted for AC and DC operation of devices mountable thereon, light emitting devices including such a sub-mount, and methods of manufacturing such a sub-mount are provided. The sub-mount includes a base substrate having first and second surfaces, a conductive pattern on the first surface, first and second pairs of first and second electrodes on the second surface and vias extending through the base substrate between the first and second surfaces. The conductive pattern includes a first set of mounting portions and two via portions along a first electrical path between the first pair of first and second electrodes, and a second set of mounting portions and two via portions along a second electrical path between the second pair of first and second electrodes, the via portions connecting respective portions of the conductive pattern to respective electrodes.
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公开(公告)号:JP5274564B2
公开(公告)日:2013-08-28
申请号:JP2010524704
申请日:2009-08-03
Applicant: シャープ株式会社
IPC: H05K1/02 , G02F1/1345 , H05K1/11 , H05K1/14
CPC classification number: H05K3/361 , G02F1/13452 , H05K1/0266 , H05K1/0269 , H05K1/117 , H05K3/323 , H05K2201/09381 , H05K2201/09663 , H05K2201/09727 , H05K2201/0979 , H05K2201/09936
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公开(公告)号:JPWO2011111313A1
公开(公告)日:2013-06-27
申请号:JP2012504300
申请日:2011-02-18
Applicant: 日本電気株式会社
CPC classification number: H05K1/0236 , H05K1/0218 , H05K1/0243 , H05K1/0298 , H05K1/116 , H05K1/162 , H05K1/165 , H05K2201/09309 , H05K2201/09618 , H05K2201/09663 , H05K2201/0969 , H05K2201/0979 , H05K2201/10371 , H05K2201/10674
Abstract: 配線基板(100)は、電子素子(101)の実装予定位置を囲うように配置され、メタルキャップ(102)の端部と接続されるメタルキャップパッド(113)と、電子素子(101)と接続部材(116)によって接続し、間隙(137)を有する電源プレーン(131)と、電子素子(101)と接続部材(115)によって接続しているグラウンドプレーン(151)と、接続部材(115、116)と間隙(137)とを囲うように繰り返し配列されている複数の導体エレメント(121、141)と、を含む。そして、電源プレーン(131)とグラウンドプレーン(151)とは、複数の導体エレメント(121、141)によって囲われた領域の少なくとも一部と、複数の導体エレメント(121、141)に対向している領域の少なくとも一部とを平面視で包含するように延在している。
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公开(公告)号:JP5184115B2
公开(公告)日:2013-04-17
申请号:JP2008021272
申请日:2008-01-31
Applicant: 日東電工株式会社
CPC classification number: H05K1/0209 , H01L23/3735 , H01L23/562 , H01L2224/16225 , H05K1/0271 , H05K1/189 , H05K2201/09318 , H05K2201/09663 , H05K2201/0969 , H05K2201/09781 , H05K2201/10674 , Y10T29/49162
Abstract: A mounting region (S) is provided at an approximately center of one surface of an insulating layer (1). A conductive trace (2) is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer (4) is formed in the periphery of the mounting region so as to cover the conductive trace. A terminal (21) of the conductive trace is arranged in the mounting region, and a bump (5a) of an electronic component (5) is bonded to the terminal. A metal layer (3) made of copper, for example, is provided on the other surface of the insulating layer. A slit is formed in the metal layer so as to cross a region being opposite to the electronic component and to divide the metal layer.
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公开(公告)号:JP5088135B2
公开(公告)日:2012-12-05
申请号:JP2007540931
申请日:2006-10-10
Applicant: 日本電気株式会社
CPC classification number: H05K1/0222 , H01L23/49827 , H01L23/49838 , H01L2223/6622 , H01L2224/16235 , H01L2924/01004 , H01L2924/01057 , H01L2924/01087 , H01L2924/3011 , H01L2924/3025 , H05K1/115 , H05K1/116 , H05K3/429 , H05K2201/093 , H05K2201/09618 , H05K2201/09636 , H05K2201/09663 , H05K2201/09718
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公开(公告)号:JP2012199426A
公开(公告)日:2012-10-18
申请号:JP2011063152
申请日:2011-03-22
Applicant: Fujitsu Semiconductor Ltd , 富士通セミコンダクター株式会社
Inventor: HIRAOKA TETSUYA
CPC classification number: H05K1/0271 , H01L24/45 , H01L24/49 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/49175 , H01L2924/00014 , H01L2924/15311 , H01L2924/351 , H05K1/0224 , H05K2201/09263 , H05K2201/09663 , H01L2924/00 , H01L2224/05599
Abstract: PROBLEM TO BE SOLVED: To inhibit propagation of cracks occurred in an insulation layer of a wiring board without deteriorating electric characteristics of wiring arranged in each layer of the wiring board.SOLUTION: The wiring board comprises first wiring, second wiring, third wiring, fourth wiring, and an insulation layer. In a thickness direction of the wiring board, the first wiring and the fourth wiring do not overlap with each other. In the thickness direction of the wiring board, the second wiring and the third wiring do not overlap with each other. A hill and a trough are provided on a lateral face of the first wiring in a region where the first wiring and the second wiring are adjacent to each other. A hill and a trough are provided on a lateral face of the second wiring in a region where the first wiring and the second wiring are adjacent to each other. In the thickness direction of the wiring board, the trough provided on the lateral face of the first wiring and the third wiring overlap with each other. In the thickness direction of the wiring board, the trough provided on the lateral face of the second wiring and the fourth wiring overlap with each other.
Abstract translation: 要解决的问题:在不会使配线板的各层配置的配线的电气特性恶化的情况下,抑制布线基板的绝缘层发生裂缝的传播。 解决方案:布线板包括第一布线,第二布线,第三布线,第四布线和绝缘层。 在布线板的厚度方向上,第一布线和第四布线彼此不重叠。 在布线板的厚度方向上,第二布线和第三布线彼此不重叠。 在第一布线和第二布线彼此相邻的区域中,在第一布线的侧面上设置有凹槽和槽。 在第一布线和第二布线彼此相邻的区域中,在第二布线的侧面上设置有凹槽和槽。 在布线板的厚度方向上,设置在第一布线和第三布线的侧面上的槽彼此重叠。 在布线板的厚度方向上,设置在第二布线的侧面和第四布线的槽重叠。 版权所有(C)2013,JPO&INPIT
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78.
公开(公告)号:JP5039356B2
公开(公告)日:2012-10-03
申请号:JP2006280010
申请日:2006-10-13
Applicant: 三菱重工業株式会社
IPC: H02M7/48
CPC classification number: H05K1/0262 , H05K1/0227 , H05K1/0231 , H05K2201/093 , H05K2201/09663
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公开(公告)号:JP4958410B2
公开(公告)日:2012-06-20
申请号:JP2005166710
申请日:2005-06-07
Applicant: フォード グローバル テクノロジーズ、リミテッド ライアビリティ カンパニー
Inventor: チェン チンチ
IPC: H03H7/01 , B60R16/02 , H03H1/00 , H03H7/00 , H03H7/06 , H03H7/075 , H03H7/09 , H04B15/00 , H04B15/02 , H05K1/02 , H05K1/14 , H05K1/18
CPC classification number: H03H1/0007 , H05K1/0233 , H05K1/141 , H05K1/18 , H05K2201/093 , H05K2201/09663 , H05K2201/1006
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公开(公告)号:JP4956466B2
公开(公告)日:2012-06-20
申请号:JP2008053285
申请日:2008-03-04
Applicant: サムソン エレクトロ−メカニックス カンパニーリミテッド.
CPC classification number: H05K1/0236 , H05K1/0237 , H05K2201/09309 , H05K2201/09663 , H05K2201/09681 , H05K2201/09736 , H05K2201/09745
Abstract: A printed circuit board having a stepped conduction layer is disclosed. In one embodiment of the invention, a printed circuit board is provided in which at least one conduction layer configured for use as a signal transmission layer is divided into at least two base regions and at least one connecting region connecting any adjacent two of the base regions, where the connecting region is stepped to a lower height than those of the base regions. The stepped conduction layer in the printed circuit board can be used to resolve the problem of mixed signals in a printed circuit board equipped with various parts and components, including an analog circuit and digital circuit, etc.
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