-
公开(公告)号：JP4429280B2
公开(公告)日：2010-03-10
申请号：JP2006068413
申请日：2006-03-13
Applicant: Necエレクトロニクス株式会社 , 日本電気株式会社
IPC: H01L23/12
CPC classification number: H01L2224/48091 , H01L2224/48227 , H01L2924/15312 , H01L2924/00014
-
公开(公告)号：JP4429281B2
公开(公告)日：2010-03-10
申请号：JP2006068419
申请日：2006-03-13
Applicant: Necエレクトロニクス株式会社 , 日本電気株式会社
IPC: H01L23/12
CPC classification number: H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/15312 , H01L2924/00014
-
公开(公告)号：JP4108643B2
公开(公告)日：2008-06-25
申请号：JP2004142133
申请日：2004-05-12
Applicant: Necエレクトロニクス株式会社 , 日本電気株式会社
IPC: H01L23/12 , H01L23/14 , H01L21/48 , H01L21/68 , H01L23/498 , H01L25/065 , H05K1/03 , H05K1/11 , H05K3/20 , H05K3/42
CPC classification number: H01L23/49816 , H01L21/4857 , H01L21/6835 , H01L23/145 , H01L23/49822 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2221/68345 , H01L2224/16225 , H01L2224/16237 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/83102 , H01L2224/92125 , H01L2225/0651 , H01L2225/06517 , H01L2225/06586 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H05K1/0366 , H05K3/205 , H05K3/423 , H05K2201/0376 , H05K2201/068 , H05K2203/0733 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 mum and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as D T (GPa) and a breaking strength at a temperature of T° C. is given as H T (MPa). (1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less (2) D 23 >=5 (3) D 150 >=2.5 (4) (D -65 /D 150 ) 23 >=140 (6) (H -65 /H 150 )
-
公开(公告)号：JP3961537B2
公开(公告)日：2007-08-22
申请号：JP2005138450
申请日：2005-05-11
Applicant: Necエレクトロニクス株式会社 , 日本電気株式会社
IPC: H01L23/12
CPC classification number: H01L21/4857 , H01L23/49822 , H01L23/49833 , H01L23/5383 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L2221/68345 , H01L2224/16225 , H01L2224/45144 , H01L2224/48227 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/181 , H05K3/007 , H05K3/205 , H05K3/28 , H05K3/4614 , H05K3/4682 , H05K2201/0376 , H05K2203/0152 , H05K2203/061 , H01L2224/05599 , H01L2924/00012
-
公开(公告)号：JP3841079B2
公开(公告)日：2006-11-01
申请号：JP2003382418
申请日：2003-11-12
Applicant: 日本電気株式会社
CPC classification number: H01L2224/16 , H01L2924/01046 , H01L2924/01078 , H01L2924/09701 , H01L2924/15311 , H01L2924/3011
-
Patent Agency Ranking
公开(公告)号：JP5061895B2
公开(公告)日：2012-10-31
申请号：JP2007501575
申请日：2006-01-31
Applicant: 日本電気株式会社
CPC classification number: H01G4/33 , H05K1/162 , H05K2201/0175 , H05K2201/0179 , H05K2201/09509 , H05K2201/09563
-
公开(公告)号：JP4768994B2
公开(公告)日：2011-09-07
申请号：JP2005031100
申请日：2005-02-07
Applicant: ルネサスエレクトロニクス株式会社 , 日本電気株式会社
IPC: H01L23/12
CPC classification number: H05K3/205 , H01L21/6835 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L25/0657 , H01L2221/68345 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/1532 , H01L2924/3511 , H05K1/113 , H05K3/107 , H05K3/4682 , H05K2201/09472 , H05K2201/096 , H05K2203/0384 , H01L2924/00 , H01L2224/0401
Abstract: An interconnecting substrate is provided with a base insulating film having a sunken section in a bottom surface thereof, a first interconnection provided in the sunken section, a via hole formed in the base insulating film, and a second interconnection which is connected to the first interconnection via a conductor within the via hole and is formed on a top surface of the base insulating film, wherein the interconnecting substrate includes a first interconnection pattern formed of the first interconnection which includes at least a linear pattern which extends along a second direction orthogonal to a first direction, and a warpage-controlling pattern which is provided in the sunken section in the bottom surface of the base insulating film and is formed in such a manner as to suppress a warpage of the interconnecting substrate toward a bottom side on both sides of the first direction.
-
-
公开(公告)号：JP4124173B2
公开(公告)日：2008-07-23
申请号：JP2004192446
申请日：2004-06-30
Applicant: 日本電気株式会社
IPC: H01L23/12
CPC classification number: H01L2224/16225 , H01L2924/15174
-
公开(公告)号：JP4389788B2
公开(公告)日：2009-12-24
申请号：JP2004564474
申请日：2003-11-19
Applicant: 日本電気株式会社
IPC: B32B3/30 , B32B7/02 , B32B7/12 , B32B27/30 , B32B27/34 , H01L23/14 , H05K1/03 , H05K1/05 , H05K3/46
CPC classification number: H05K3/4673 , B32B7/12 , H05K3/4644 , H05K2201/0154 , H05K2201/0195 , H05K2201/0358 , Y10T428/24917 , Y10T428/249953 , Y10T428/249955 , Y10T428/249958 , Y10T428/31681
-
-
-
-
-
-
-
-
-
Search Results
23
records
(took 0.028 seconds)
