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公开(公告)号：KR1020140093623A
公开(公告)日：2014-07-28
申请号：KR1020140005429
申请日：2014-01-16
申请人： 쇼오트 아게
CPC分类号： H01L23/08 , H01L23/045 , H01L23/3157 , H01L23/64 , H01L23/66 , H01L24/05 , H01L24/48 , H01L24/49 , H01L2223/6622 , H01L2224/04042 , H01L2224/05554 , H01L2224/32225 , H01L2224/32245 , H01L2224/48011 , H01L2224/48091 , H01L2224/48137 , H01L2224/48245 , H01L2224/49171 , H01L2224/49175 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2924/00014 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2924/3011 , H01L2924/30111 , H01L2924/2065 , H01L2924/20649 , H01L2924/20645 , H01L2924/20644 , H01L2924/20643 , H01L2224/45099 , H01L2924/00
摘要： The present invention relates to a TO housing and a method for producing the same. The TO housing and a method for producing the same according to one embodiment of the present invention includes a socket which receives a device (5). According to the embodiment of the present invention, the TO housing is arranged in an air gap between a printed circuit board (12) and the socket. According to the embodiment of the present invention, the TO housing has a connection part which has a protrusion part.
摘要翻译： 本发明涉及一种TO壳体及其制造方法。 根据本发明的一个实施例的TO壳体及其制造方法包括一个容纳装置（5）的插座。 根据本发明的实施例，TO壳体布置在印刷电路板（12）和插座之间的气隙中。 根据本发明的实施例，TO壳体具有连接部分，该连接部分具有突出部分。
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公开(公告)号：KR1020170038081A
公开(公告)日：2017-04-05
申请号：KR1020177008009
申请日：2013-09-11
申请人： 베릴리 라이프 사이언시즈 엘엘시
发明人： 에츠콘,제임스
CPC分类号： G02C11/10 , A61B5/6821 , A61B2562/12 , B29D11/00048 , B29D11/00807 , G02C7/04 , G02C7/049 , H01L21/56 , H01L21/563 , H01L21/768 , H01L23/3107 , H01L23/3121 , H01L23/48 , H01L23/528 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/742 , H01L24/81 , H01L24/83 , H01L24/89 , H01L24/97 , H01L2224/02375 , H01L2224/0401 , H01L2224/05548 , H01L2224/05553 , H01L2224/05554 , H01L2224/08225 , H01L2224/11312 , H01L2224/13109 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/8012 , H01L2224/8085 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81204 , H01L2224/81815 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2224/83855 , H01L2224/9211 , H01L2224/92125 , H01L2924/00014 , H01L2924/10161 , H01L2924/10162 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H01L2924/20645 , H01L2924/20646 , H01L2924/20647 , H01L2924/20648 , H01L2924/20649 , H01L2924/2065 , H01L2924/00 , H01L2224/83104 , H01L2224/05599 , H01L2924/013 , H01L2924/0105 , H01L2924/01083 , H01L2924/00013 , H01L2924/20105 , H01L2924/00012 , H01L2924/0665
摘要： 내부에박형실리콘칩이집적되어있는콘택트렌즈가, 콘택트렌즈내에실리콘칩을조립하는방법과함께제공된다. 한양태에서, 방법은복수의렌즈접촉패드를렌즈기판상에생성하고칩 상에복수의칩 접촉패드를생성하는단계를포함한다. 이방법은, 복수의렌즈접촉패드또는칩 접촉패드의각각에조립접합재를도포하는단계, 복수의렌즈접촉패드를복수의칩 접촉패드와정렬하는단계, 플립칩 접합을이용하여조립접합재를통해렌즈기판에칩을접합하는단계, 및렌즈기판으로콘택트렌즈를형성하는단계를포함한다.
摘要翻译： 其中集成有薄硅芯片的隐形眼镜与在隐形眼镜中组装硅芯片的方法一起提供。 在一个方面中，一种方法包括在透镜基底上创建多个透镜接触垫并且在芯片上创建多个芯片接触垫。 该方法包括以下步骤：将组装接合施加到多个透镜接触垫或芯片接触垫中的每一个，将多个透镜接触垫与多个芯片接触垫对准， 将芯片粘合到衬底上，并与透镜衬底一起形成隐形眼镜。
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公开(公告)号：KR1020160132499A
公开(公告)日：2016-11-18
申请号：KR1020167031425
申请日：2012-09-04
申请人： 미쓰비시덴키 가부시키가이샤
IPC分类号： H01L23/488 , H01L23/495 , H01L23/00
CPC分类号： H01L24/05 , H01L23/498 , H01L24/01 , H01L24/03 , H01L24/08 , H01L24/11 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/034 , H01L2224/0401 , H01L2224/04042 , H01L2224/05083 , H01L2224/05124 , H01L2224/05155 , H01L2224/05166 , H01L2224/05624 , H01L2224/05644 , H01L2224/0603 , H01L2224/16113 , H01L2224/16245 , H01L2224/29101 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73251 , H01L2224/73265 , H01L2924/00014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01042 , H01L2924/01047 , H01L2924/01079 , H01L2924/07025 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H01L2924/20645 , H01L2924/20646 , H01L2924/20647 , H01L2924/20648 , H01L2924/20649 , H01L2924/2065 , H01L2924/351 , H01L2924/00 , H01L2224/45099 , H01L2924/014 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/01201 , H01L2924/01014
摘要： 본원의발명에관한반도체장치는, 반도체소자와, 상기반도체소자의표면에형성된표면전극과, 상기표면전극위에, 접합부와, 상기접합부와접하면서상기접합부를둘러싸도록형성된응력완화부를갖도록형성된금속막과, 상기응력완화부를피해서상기접합부에접합된땜납과, 상기땜납을거쳐상기접합부에접합된외부전극을구비한것을특징으로한다.
摘要翻译： 本发明的半导体器件包括半导体元件，形成在半导体元件的表面上的表面电极，形成在表面电极上的金属膜，以具有形成为接合部分的接合部分和应力消除部分 并且围绕接合部分，焊料接合到接合部分同时避免应力消除部分，以及外部电极通过焊料接合到接合部分。
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公开(公告)号：KR1020150038535A
公开(公告)日：2015-04-08
申请号：KR1020157005393
申请日：2012-09-04
申请人： 미쓰비시덴키 가부시키가이샤
IPC分类号： H01L23/488 , H01L23/495 , H01L23/00
CPC分类号： H01L24/05 , H01L23/498 , H01L24/01 , H01L24/03 , H01L24/08 , H01L24/11 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/034 , H01L2224/0401 , H01L2224/04042 , H01L2224/05083 , H01L2224/05124 , H01L2224/05155 , H01L2224/05166 , H01L2224/05624 , H01L2224/05644 , H01L2224/0603 , H01L2224/16113 , H01L2224/16245 , H01L2224/29101 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73251 , H01L2224/73265 , H01L2924/00014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01042 , H01L2924/01047 , H01L2924/01079 , H01L2924/07025 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H01L2924/20645 , H01L2924/20646 , H01L2924/20647 , H01L2924/20648 , H01L2924/20649 , H01L2924/2065 , H01L2924/351 , H01L2924/00 , H01L2224/45099 , H01L2924/014 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/01201 , H01L2924/01014 , H01L23/488 , H01L23/495 , H01L24/10
摘要： 본원의발명에관한반도체장치는, 반도체소자와, 상기반도체소자의표면에형성된표면전극과, 상기표면전극위에, 접합부와, 상기접합부와접하면서상기접합부를둘러싸도록형성된응력완화부를갖도록형성된금속막과, 상기응력완화부를피해서상기접합부에접합된땜납과, 상기땜납을거쳐상기접합부에접합된외부전극을구비한것을특징으로한다.
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公开(公告)号：KR101341725B1
公开(公告)日：2013-12-16
申请号：KR1020107020084
申请日：2008-07-24
IPC分类号： H01L21/60
CPC分类号： H01L24/85 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05624 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43847 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/456 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/45664 , H01L2224/45669 , H01L2224/45671 , H01L2224/45673 , H01L2224/4568 , H01L2224/45684 , H01L2224/48011 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48463 , H01L2224/48472 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48724 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/78251 , H01L2224/78301 , H01L2224/85045 , H01L2224/85048 , H01L2224/85065 , H01L2224/85075 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2224/859 , H01L2924/00011 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01105 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/15747 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/3025 , H01L2924/3861 , H01L2924/01001 , H01L2924/01203 , H01L2924/01034 , H01L2924/01081 , H01L2924/20645 , H01L2924/20652 , H01L2924/20653 , H01L2924/00014 , H01L2924/20108 , H01L2224/45657 , H01L2224/45666 , H01L2924/01008 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/2076 , H01L2924/2065 , H01L2924/20651 , H01L2924/20654 , H01L2924/00 , H01L2224/45124 , H01L2924/013 , H01L2924/20751 , H01L2924/2075 , H01L2924/00013 , H01L2924/01049
摘要： 재료비가저렴하고, 볼접합성, 열사이클시험또는리플로우시험의신뢰성이우수하며, 보관수명이양호하고, 협피치용세선화에도적응하는구리계본딩와이어를제공하는것을목적으로한다. 구리를주성분으로하는심재와, 상기심재위에설치된, 상기심재와성분및 조성의어느하나또는두 가지가모두다른금속 M과구리를함유하는외층을가진본딩와이어로서, 상기외층의두께가 0.021 내지 0.12 ㎛인것을특징으로하는반도체장치용본딩와이어.
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公开(公告)号：KR1020070084060A
公开(公告)日：2007-08-24
申请号：KR1020077010429
申请日：2005-11-14
申请人： 스태츠 칩팩 피티이. 엘티디.
发明人： 리,흥태 , 김,종국 , 김,철식 , 장,기영 , 펜드세,라젠드라디.
IPC分类号： H01L23/48
CPC分类号： H01L24/85 , H01L23/13 , H01L23/4952 , H01L23/49833 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48011 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48455 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/4848 , H01L2224/48599 , H01L2224/48644 , H01L2224/48647 , H01L2224/48699 , H01L2224/48744 , H01L2224/48747 , H01L2224/49109 , H01L2224/49175 , H01L2224/49433 , H01L2224/73265 , H01L2224/85051 , H01L2224/85205 , H01L2224/85444 , H01L2224/85447 , H01L2224/85986 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2224/85181 , H01L2224/85186 , H01L2924/2065 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal. Also, such a package in which the package substrate includes a two-tier substrate, each tier including a plurality of lead fingers having a lead finger bond pitch about twice the die pad pitch, the lead fingers of the first tier and the second tier having a staggered arrangement. In some embodiments the support pedestal is formed using a wire bonding tool as in formation of a stud bump, and in such embodiments the support pedestal is metallurgically bonded to the lead finger. Also, a method for forming a wire bond interconnection between a semiconductor die and a substrate, by providing a die affixed on a die mount portion of a first side of a substrate and oriented with the active side oriented away from the substrate, the substrate having patterned traces including lead fingers in the first surface of the substrate; forming a support pedestal on a bond site of a lead finger; forming a first bond on a die pad; and forming a second bond on the support pedestal.
摘要翻译： 芯片焊盘和键合指状物之间的引线键合互连包括在引线指的键合位置处的支撑基座，芯片焊盘上的球接合以及支撑基座上的线圈接合，其中引线指 在焊接点处小于支撑基座的直径。 此外，包括安装在多个引线键合并且电连接到基板的裸片的半导体封装，其中每个引线键合包括接合到模具上的焊盘的线球，并且在与基板上的支撑基座上接合 引线指的键位置，并且其中引线指在键合位置处的宽度小于支撑基座的直径。 另外，封装基板包括双层基板的这种封装，每层包括多个引线指，其具有大约两倍于管芯焊盘间距的引线接合间距，第一层和第二层的引线指具有 交错排列 在一些实施例中，在形成柱形凸块时使用引线接合工具形成支撑基座，并且在这种实施例中，支撑基座冶金地结合到引线指。 另外，在半导体管芯和基板之间形成引线接合互连的方法，通过设置固定在基板的第一面的管芯安装部上并且朝向远离基板的有源侧取向的管芯，所述基板具有 图案化痕迹，包括在所述衬底的第一表面中的引线指; 在引线指的接合部位上形成支撑基座; 在芯片焊盘上形成第一键; 以及在所述支撑座上形成第二接合。
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公开(公告)号：KR101640298B1
公开(公告)日：2016-07-15
申请号：KR1020140005429
申请日：2014-01-16
申请人： 쇼오트 아게
CPC分类号： H01L23/08 , H01L23/045 , H01L23/3157 , H01L23/64 , H01L23/66 , H01L24/05 , H01L24/48 , H01L24/49 , H01L2223/6622 , H01L2224/04042 , H01L2224/05554 , H01L2224/32225 , H01L2224/32245 , H01L2224/48011 , H01L2224/48091 , H01L2224/48137 , H01L2224/48245 , H01L2224/49171 , H01L2224/49175 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2924/00014 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2924/3011 , H01L2924/30111 , H01L2924/2065 , H01L2924/20649 , H01L2924/20645 , H01L2924/20644 , H01L2924/20643 , H01L2224/45099 , H01L2924/00
摘要： 본발명은 TO 하우징에관한것으로서, 이 TO 하우징의경우에상측에서본딩와이어의길이가단축되어있고단자와마주하는쪽에서연결선이돌출부를가지고있다.
摘要翻译： 提供了在上表面具有接合线的晶体管轮廓外壳。 接合线的长度减小，并且在与接合端相对的端部处具有连续引线，其具有多余的长度。
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公开(公告)号：KR1020150056653A
公开(公告)日：2015-05-26
申请号：KR1020157010387
申请日：2013-09-11
申请人： 베릴리 라이프 사이언시즈 엘엘시
发明人： 에츠콘,제임스
CPC分类号： G02C11/10 , A61B5/6821 , A61B2562/12 , B29D11/00048 , B29D11/00807 , G02C7/04 , G02C7/049 , H01L21/56 , H01L21/563 , H01L21/768 , H01L23/3107 , H01L23/3121 , H01L23/48 , H01L23/528 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/742 , H01L24/81 , H01L24/83 , H01L24/89 , H01L24/97 , H01L2224/02375 , H01L2224/0401 , H01L2224/05548 , H01L2224/05553 , H01L2224/05554 , H01L2224/08225 , H01L2224/11312 , H01L2224/13109 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/8012 , H01L2224/8085 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81204 , H01L2224/81815 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2224/83855 , H01L2224/9211 , H01L2224/92125 , H01L2924/00014 , H01L2924/10161 , H01L2924/10162 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/20644 , H01L2924/20645 , H01L2924/20646 , H01L2924/20647 , H01L2924/20648 , H01L2924/20649 , H01L2924/2065 , H01L2924/00 , H01L2224/83104 , H01L2224/05599 , H01L2924/013 , H01L2924/0105 , H01L2924/01083 , H01L2924/00013 , H01L2924/20105 , H01L2924/00012 , H01L2924/0665
摘要： 내부에박형실리콘칩이집적되어있는콘택트렌즈가, 콘택트렌즈내에실리콘칩을조립하는방법과함께제공된다. 한양태에서, 방법은복수의렌즈접촉패드를렌즈기판상에생성하고칩 상에복수의칩 접촉패드를생성하는단계를포함한다. 이방법은, 복수의렌즈접촉패드또는칩 접촉패드의각각에조립접합재를도포하는단계, 복수의렌즈접촉패드를복수의칩 접촉패드와정렬하는단계, 플립칩 접합을이용하여조립접합재를통해렌즈기판에칩을접합하는단계, 및렌즈기판으로콘택트렌즈를형성하는단계를포함한다.
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公开(公告)号：KR101030838B1
公开(公告)日：2011-04-22
申请号：KR1020097025455
申请日：2008-07-24
CPC分类号： H01L24/85 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05624 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43847 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/456 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/45664 , H01L2224/45669 , H01L2224/45671 , H01L2224/45673 , H01L2224/4568 , H01L2224/45684 , H01L2224/48011 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48463 , H01L2224/48472 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48724 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/78251 , H01L2224/78301 , H01L2224/85045 , H01L2224/85048 , H01L2224/85065 , H01L2224/85075 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2224/859 , H01L2924/00011 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01105 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/15747 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/3025 , H01L2924/3861 , H01L2924/01001 , H01L2924/01203 , H01L2924/01034 , H01L2924/01081 , H01L2924/20645 , H01L2924/20652 , H01L2924/20653 , H01L2924/00014 , H01L2924/20108 , H01L2224/45657 , H01L2224/45666 , H01L2924/01008 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/2076 , H01L2924/2065 , H01L2924/20651 , H01L2924/20654 , H01L2924/00 , H01L2224/45124 , H01L2924/013 , H01L2924/20751 , H01L2924/2075 , H01L2924/00013 , H01L2924/01049
摘要： 재료비가 저렴하고, 볼 접합성, 열 사이클 시험 또는 리플로우 시험의 신뢰성이 우수하며, 보관 수명이 양호하고, 협피치용 세선화에도 적응하는 구리계 본딩 와이어를 제공하는 것을 목적으로 한다. 구리를 주성분으로 하는 심재와, 상기 심재 위에 설치된, 상기 심재와 성분 및 조성의 어느 하나 또는 두 가지가 모두 다른 금속 M과 구리를 함유하는 외층을 가진 본딩 와이어로서, 상기 외층의 두께가 0.021 내지 0.12 ㎛인 것을 특징으로 하는 반도체 장치용 본딩 와이어.
구리계 본딩 와이어, 볼 접합성, 열 사이클, 리플로우摘要翻译： 和材料成本是便宜的，并且球接合性，良好的热循环试验或回流试验的可靠性，良好的保质期，并且其目的是提供一种铜基接合线，以适应减薄的窄间距。 和主要由铜芯构件，其中之一或两者设置在芯材的芯材的和成分和两个包含不同金属M和铜，外层0.021的厚度至0.12的外层的作为接合线的组合物 Mu m。＆lt;
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公开(公告)号：KR1020090131297A
公开(公告)日：2009-12-28
申请号：KR1020097025455
申请日：2008-07-24
CPC分类号： H01L24/85 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05624 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43847 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/456 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/45664 , H01L2224/45669 , H01L2224/45671 , H01L2224/45673 , H01L2224/4568 , H01L2224/45684 , H01L2224/48011 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48463 , H01L2224/48472 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48724 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/78251 , H01L2224/78301 , H01L2224/85045 , H01L2224/85048 , H01L2224/85065 , H01L2224/85075 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2224/859 , H01L2924/00011 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01105 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/15747 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/3025 , H01L2924/3861 , H01L2924/01001 , H01L2924/01203 , H01L2924/01034 , H01L2924/01081 , H01L2924/20645 , H01L2924/20652 , H01L2924/20653 , H01L2924/00014 , H01L2924/20108 , H01L2224/45657 , H01L2224/45666 , H01L2924/01008 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/2076 , H01L2924/2065 , H01L2924/20651 , H01L2924/20654 , H01L2924/00 , H01L2224/45124 , H01L2924/013 , H01L2924/20751 , H01L2924/2075 , H01L2924/00013 , H01L2924/01049
摘要： Provided is a copper-based bonding wire whose material cost is low, and ball bondability and reliability in thermal cycle test or reflow test is excellent. The copper-based bonding wire also has excellent storage life and is applicable to fine wiring for narrow pitch. The bonding wire is provided with a core material having copper as a main component, and an outer layer, which is arranged on the core material and contains a metal (M) having one of or both of the components and composition different from those of the core material, and copper. The semiconductor device bonding wire is characterized in that the thickness of the outer layer is 0.021-0.12μm.
摘要翻译： 提供材料成本低的铜基接合线，热循环试验或回流试验的球接合性和可靠性优异。 铜基接合线也具有优良的储存寿命，适用于窄间距的精细布线。 接合线设置有以铜为主要成分的芯材和外层，该外层设置在芯材上并含有金属（M），该金属（M）具有不同于 芯材和铜。 半导体器件接合线的特征在于外层的厚度为0.021-0.12μm。
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