公开(公告)号：US20160202084A1

公开(公告)日：2016-07-14

申请号：US14596196

申请日：2015-01-13

申请人： Nen-Tsua Li ,  Chen-Yu Liao ,  Chia-Ching Chen

发明人： Nen-Tsua Li ,  Chen-Yu Liao ,  Chia-Ching Chen

IPC分类号： G01D5/12

CPC分类号： G01D5/145 ,  G01B3/10 ,  G01B3/12 ,  G01B7/026

摘要： A measurement device includes a movable member 1, an angle-detection unit 2 and a rotary unit 3. The rotary unit 3 has a shaft 31, a roller 32 and a magnetic disk 33, all of which are connected along a common axis. The outer periphery of the roller 32 rolls along the movable member 1 when the movable member 1 is pulled. There is a gap formed between the angle-detection unit 2 and the magnetic disk 33 which is located corresponding to the center of the angle-detection unit 2 so that the angle-detection unit 2 detects the angular change of the magnetic disk 33 and precisely calculates the distance that the movable member 1 moves.

摘要翻译： 测量装置包括可动构件1，角度检测单元2和旋转单元3.旋转单元3具有轴31，辊32和磁盘33，它们都沿着公共轴线连接。 当可动件1被拉动时，滚筒32的外周沿可动件1滚动。 在与角度检测单元2的中心对应的角度检测单元2和磁盘33之间形成有间隙，使得角度检测单元2检测磁盘33的角度变化，并且精确地 计算可动构件1移动的距离。

公开(公告)号：US20110241194A1

公开(公告)日：2011-10-06

申请号：US12753843

申请日：2010-04-02

申请人： Chia-Ching Chen ,  Yu-Pin Tsai

发明人： Chia-Ching Chen ,  Yu-Pin Tsai

IPC分类号： H01L25/065 ,  H01L23/538

CPC分类号： H01L25/03 ,  H01L24/19 ,  H01L24/24 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An embodiment of a stacked package assembly includes: (1) a first semiconductor device package including: (a) a semiconductor device including back and lateral surfaces; (b) a package body including an upper surface and substantially covering the back and lateral surfaces of the device; and (c) a first conductive contact adjacent to the upper surface of the body and electrically connected to the device; (2) a second semiconductor device package disposed above the upper surface of the body; (3) a conductive bump adjacent to the first contact and to the second device package; (4) a second conductive contact external to the first and the second device packages; and (5) a conductive wire electrically connecting the first and the second device packages to the second contact, a first end of the wire adjacent to the first contact and at least partially covered by the bump.

摘要翻译： 堆叠封装组件的实施例包括：（1）第一半导体器件封装，包括：（a）包括背面和侧表面的半导体器件; （b）包装体，其包括上表面并且基本上覆盖所述装置的后表面和侧表面; 和（c）邻近所述主体的上表面并电连接到所述装置的第一导电接触件; （2）设置在所述主体的上表面上方的第二半导体器件封装; （3）邻近所述第一触点和所述第二器件封装的导电凸块; （4）在第一和第二器件封装外部的第二导电触点; 以及（5）将所述第一和第二器件封装电连接到所述第二触点的导线，所述导线的与所述第一触点相邻并且至少部分地被所述凸块覆盖的第一端。

公开(公告)号：US20110241193A1

公开(公告)日：2011-10-06

申请号：US12753840

申请日：2010-04-02

申请人： Yi-Chuan Ding ,  Chia-Ching Chen

发明人： Yi-Chuan Ding ,  Chia-Ching Chen

IPC分类号： H01L23/538 ,  H01L21/50

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/16237 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2224/81

摘要： An embodiment of a semiconductor device package includes: (1) an interconnection unit including a patterned conductive layer; (2) an electrical interconnect extending substantially vertically from the conductive layer; (3) a semiconductor device adjacent to the interconnection unit and electrically connected to the conductive layer; (4) a package body: (a) substantially covering an upper surface of the interconnection unit and the device; and (b) defining an opening adjacent to an upper surface of the package body and exposing an upper surface of the interconnect; and (5) a connecting element electrically connected to the device, substantially filling the opening, and being exposed at an external periphery of the device package. The upper surface of the interconnect defines a first plane above a second plane defined by at least a portion of the upper surface of the interconnection unit, and below a third plane defined by the upper surface of the package body.

摘要翻译： 半导体器件封装的实施例包括：（1）包括图案化导电层的互连单元; （2）从导电层基本垂直延伸的电互连; （3）与所述互连单元相邻并且电连接到所述导电层的半导体器件; （4）包装体;（a）基本上覆盖所述互连单元和所述装置的上表面; 和（b）限定与所述包装体的上表面相邻的开口并暴露所述互连件的上表面; 以及（5）电连接到所述装置的连接元件，基本上填充所述开口并暴露在所述装置封装的外周边。 互连的上表面限定了由互连单元的上表面的至少一部分限定的第二平面上方的第一平面，并且在由封装主体的上表面限定的第三平面之下。

公开(公告)号：US20100289132A1

公开(公告)日：2010-11-18

申请号：US12716873

申请日：2010-03-03

申请人： Shih-Fu Huang ,  Yuan-Chang Su ,  Chia-Cheng Chen ,  Chia-Ching Chen

发明人： Shih-Fu Huang ,  Yuan-Chang Su ,  Chia-Cheng Chen ,  Chia-Ching Chen

IPC分类号： H01L23/48 ,  H05K1/03 ,  H05K3/10

CPC分类号： H05K3/20 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/85411 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/007 ,  H05K3/28 ,  H05K2203/0152 ,  H05K2203/1536 ,  H05K2203/1563 ,  Y10T29/49155 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A substrate having single patterned metal layer applied in a package is provided. The substrate includes a first patterned dielectric layer, a patterned metal layer and a second patterned dielectric layer, wherein the patterned metal layer is embedded in the first patterned dielectric layer. Also, the top surfaces of the patterned metal layer and the first patterned dielectric layer lie in the same plane. At least part of the patterned metal layer are exposed from the holes formed on the lower surface of the first patterned dielectric layer, so as to form plural first contact pads for electrical connection downwardly. The second patterned dielectric layer, formed above the patterned metal layer and the first patterned dielectric layer, at least exposes part of the patterned metal layer to form plural second contact pads at the top surface of the patterned metal layer for electrical connection upwardly.

摘要翻译： 提供了一种施加在封装中的具有单一图案化金属层的衬底。 衬底包括第一图案化电介质层，图案化金属层和第二图案化电介质层，其中图案化金属层嵌入第一图案化电介质层中。 此外，图案化金属层和第一图案化电介质层的顶表面位于相同的平面中。 图案化金属层的至少一部分从形成在第一图案化电介质层的下表面上的孔露出，从而形成用于向下电连接的多个第一接触焊盘。 形成在图案化金属层和第一图案化电介质层之上的第二图案化电介质层至少暴露图案化金属层的一部分以在图案化金属层的顶表面处形成多个第二接触焊盘，用于向上电连接。

公开(公告)号：US20130276639A1

公开(公告)日：2013-10-24

申请号：US13452938

申请日：2012-04-23

申请人： Chia-Ching Chen

发明人： Chia-Ching Chen

IPC分类号： A47J31/44 ,  A47J31/06

CPC分类号： A47J31/20

摘要： A portable cup for brewing includes a cup. A bottom of the cup is defined as a bottom cap. A receiving space is defined on the upper surface of the bottom cap. A food product is received in the receiving space. A soluble edible gum seals the receiving space. Wherein, the food product is fully protected by the soluble edible gum from exposing in the air for preserving the food product from corrupt.

摘要翻译： 用于冲泡的便携式杯包括杯子。 杯的底部被定义为底盖。 在底盖的上表面上限定接收空间。 在接收空间接收食品。 可溶性食用胶密封接收空间。 其中食品完全受到可溶性食用胶的保护，不会在空气中露出，以保护食品免受腐败。

公开(公告)号：US08405213B2

公开(公告)日：2013-03-26

申请号：US12874144

申请日：2010-09-01

申请人： Chia-Ching Chen ,  Yi-Chuan Ding

发明人： Chia-Ching Chen ,  Yi-Chuan Ding

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L21/50 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/293 ,  H01L23/295 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/81 ,  H01L24/96 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05173 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16165 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/21 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/81192 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05193

摘要： A semiconductor package includes a set of stud bumps, which can be formed by wire bonding technology and can be bonded or joined to a semiconductor element to form a stacked package assembly. Since the process of bonding the semiconductor element to the stud bumps can be carried out without reflow, an undesirable deformation resulting from high temperatures can be controlled or reduced.

摘要翻译： 半导体封装包括一组螺柱凸块，其可以通过引线接合技术形成并且可以结合或接合到半导体元件以形成堆叠的封装组件。 由于将半导体元件接合到凸块凸块的过程可以在不回流的情况下进行，因此可以控制或降低由高温导致的不期望的变形。

公开(公告)号：US08278746B2

公开(公告)日：2012-10-02

申请号：US12753837

申请日：2010-04-02

申请人： Yi-Chuan Ding ,  Chia-Ching Chen

发明人： Yi-Chuan Ding ,  Chia-Ching Chen

IPC分类号： H01L25/065 ,  H01L23/52 ,  H01L21/70 ,  H01L23/48

CPC分类号： H01L23/3107 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Described herein are wafer-level semiconductor device packages with stacking functionality and related stacked package assemblies and methods. In one embodiment, a semiconductor device package includes a set of connecting elements disposed adjacent to a periphery of a set of stacked semiconductor devices. At least one of the connecting elements is wire-bonded to an active surface of an upper one of the stacked semiconductor devices.

摘要翻译： 这里描述的是具有堆叠功能和相关的堆叠封装组件和方法的晶片级半导体器件封装。 在一个实施例中，半导体器件封装包括一组邻近一组堆叠半导体器件的周边设置的连接元件。 至少一个连接元件被引线接合到堆叠的半导体器件的上部的有源表面。

公开(公告)号：US20120130964A1

公开(公告)日：2012-05-24

申请号：US13299243

申请日：2011-11-17

申请人： Show-Jane YEN ,  Chia-Ching Chen ,  Yue-Shi Lee

发明人： Show-Jane YEN ,  Chia-Ching Chen ,  Yue-Shi Lee

IPC分类号： G06F17/30 ,  G06F7/00

CPC分类号： G06Q30/02 ,  G06Q10/0637

摘要： The present invention discloses a fast algorithm for mining high utility itemsets, wherein some transaction data and item utilities are recorded in a tree structure. The method to construct a tree structure is recording on a node the item utilities appearing from the root node to the node. Some techniques are used to reduce the mining space, whereby the fast algorithm can directly generate high utility itemsets from the tree structure without generating any candidates. The fast algorithm of the present invention is more efficient than the existing highest-efficiency algorithm. The present invention further proposes a compression method to effectively save memory space.

摘要翻译： 本发明公开了一种用于挖掘高效用项集的快速算法，其中一些事务数据和项目实用程序以树结构记录。 构建树结构的方法是在节点上记录从根节点到节点出现的项目实用程序。 一些技术用于减少挖掘空间，因此快速算法可以直接从树结构生成高效用项集，而不产生任何候选。 本发明的快速算法比现有的最高效率算法更有效。 本发明还提出了一种有效地节省存储空间的压缩方法。

公开(公告)号：USD539192S1

公开(公告)日：2007-03-27

申请号：US29246695

申请日：2006-05-04

申请人： Chia-Ching Chen ,  Jung-Chung Chen

设计人： Chia-Ching Chen ,  Jung-Chung Chen

公开(公告)号：US5207118A

公开(公告)日：1993-05-04

申请号：US763244

申请日：1991-09-20

申请人： Chia-Ching Chen

发明人： Chia-Ching Chen

IPC分类号： B60B27/02 ,  B62K19/34 ,  B62M3/00

CPC分类号： B62K19/34 ,  B60B27/023 ,  B62M3/003 ,  Y10T74/2164 ,  Y10T74/2168

摘要： An improved pedal shaft core is characterized in that the contact surfaces of both shaft core and shaft bearing are designed to be oblique and conical to enable the bearing to comprise roller nest bearing and a casing of circular and conical arc so as to enhance the rotational stability of the pedal shaft core. The toothed cup of the shaft core comprises grease filling apparatus of an inclined type located on the external surface of one end thereof. The improved pedal shaft core further comprises of a pair of W-shaped non-return washers of waterproof and oil-proof nature.

摘要翻译： 改进的踏板轴芯的特征在于，轴芯和轴承的接触表面被设计为倾斜和圆锥形，以使轴承能够包括滚子轴承和圆弧和圆锥形的壳体，以增强旋转稳定性 的踏板轴芯。 轴芯的齿形杯包括位于其一端的外表面上的倾斜型油脂填充装置。 改进的踏板轴芯还包括一对具有防水和防油性质的W形无回转垫圈。