公开(公告)号：US20070089551A1

公开(公告)日：2007-04-26

申请号：US11529784

申请日：2006-09-29

Applicant: Scott Williams ,  Edward Laurent ,  David Beatson ,  Bahadir Tunaboylu ,  Edward Malantonio

Inventor： Scott Williams ,  Edward Laurent ,  David Beatson ,  Bahadir Tunaboylu ,  Edward Malantonio

IPC: G01B5/28 ,  G01D21/00

CPC classification number: G01R1/06727

Abstract: A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum.

Abstract translation: 用于探针卡组件的探针包括光束和支点元件。 支点元件位于梁的基端部分和梁的顶端部分之间，并且适于与梁接触，使得梁被支点悬臂。

公开(公告)号：US20070026574A1

公开(公告)日：2007-02-01

申请号：US10552429

申请日：2004-04-08

Applicant: David Beatson ,  Horst Clauderg ,  Kenneth Dury

Inventor： David Beatson ,  Horst Clauderg ,  Kenneth Dury

IPC: H01L21/00 ,  H01L23/495

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2224/49175 ,  H01L2224/81801 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/49204 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/00015

Abstract: Disclosed are interconnect structures and methods which utilize a bonding surface comprising copper nitride. The interconnect structures include a bonding surface comprising copper nitride which is effective at preventing oxidation and/or other unwanted corrosion of the underlying conductive material while providing the basis for a high conductivity bond. The copper nitride bonding surface provides a relatively non-conductive, corrosion-resistant bonding surface while at the same time being readily transformed into a conductive layer at or just prior to the time of bonding.

Abstract translation: 公开了利用包含氮化铜的接合表面的互连结构和方法。 互连结构包括包含氮化铜的结合表面，其有效地防止下面的导电材料的氧化和/或其它不希望的腐蚀，同时为高导电性键提供基础。 氮化铜接合表面提供相对不导电的耐腐蚀粘合表面，同时在粘合时或之前容易地转变成导电层。

公开(公告)号：US20050046968A1

公开(公告)日：2005-03-03

申请号：US10953962

申请日：2004-09-29

Applicant: David Beatson ,  Christian Hoffman

Inventor： David Beatson ,  Christian Hoffman

IPC: G01N21/88 ,  G02B27/14 ,  G02B27/10 ,  G02B9/08 ,  G02B13/00

CPC classification number: G02B27/145 ,  G01N21/8806 ,  G01N2021/8845 ,  G02B27/1066

Abstract: A method and system for providing different images representing plural depths of field of an electronic device. The vision system has a beamsplitter for receiving an image of the device illuminated by the at least one light source, the beamsplitter providing one of the plurality of images of the device based in a wavelength of the light source; an aperture having a plurality of effective diameters based on the wavelength of light from the at least one light source, the aperture determining a depth of field of the image of the device; and an optical element for receiving the image of the device, the optical element magnifying the image by a predetermined magnification factor to produce a magnified image having the determined depth of field.

Abstract translation: 一种用于提供表示电子设备的多个景深的不同图像的方法和系统。 视觉系统具有用于接收由至少一个光源照射的装置的图像的分束器，分束器基于光源的波长提供装置的多个图像中的一个; 基于来自所述至少一个光源的光的波长具有多个有效直径的孔，所述孔确定所述装置的图像的景深; 以及用于接收装置的图像的光学元件，所述光学元件以预定的放大系数放大图像以产生具有确定的景深的放大图像。

公开(公告)号：US20070210815A1

公开(公告)日：2007-09-13

申请号：US11711319

申请日：2007-02-26

Applicant: Habib Kilicaslan ,  David McDevitt ,  Bahadir Tunaboylu ,  David Beatson

Inventor： Habib Kilicaslan ,  David McDevitt ,  Bahadir Tunaboylu ,  David Beatson

IPC: G01R31/02

CPC classification number: G01R1/07342 ,  G01R1/06772

Abstract: A blade probe card includes a plurality of blades that each includes a first end connected to a printed circuit board and a second end. A probe member is attached to the second end of each blade and extends outward to make contact with a device under test. A ground member is attached to the second end of each blade. The blade probe card also includes a common ground member that is separate from the printed circuit board and coupled to the ground member of each blade. Each blade may also include a first conductive signal trace and two or more conductive ground traces formed on a surface of each blade. The first conductive signal trace electrically connects the probe member to a contact on the printed circuit board. The two or more conductive ground traces are adjacent to the conductive signal trace and reduce crosstalk between the blades.

Abstract translation: 刀片探针卡包括多个叶片，每个叶片包括连接到印刷电路板的第一端和第二端。 探针构件附接到每个叶片的第二端并向外延伸以与待测试的装置接触。 接地构件附接到每个叶片的第二端。 刀片探针卡还包括与印刷电路板分离并联接到每个叶片的接地构件的公共接地构件。 每个叶片还可以包括形成在每个叶片的表面上的第一导电信号迹线和两个或更多个导电接地迹线。 第一导电信号迹线将探针构件电连接到印刷电路板上的触点。 两个或多个导电接地迹线与导电信号迹线相邻并且减小了叶片之间的串扰。

公开(公告)号：US20060060631A1

公开(公告)日：2006-03-23

申请号：US11230767

申请日：2005-09-20

Applicant: E. Frasch ,  David Beatson

Inventor： E. Frasch ,  David Beatson

IPC: B23K37/00

CPC classification number: H01L24/78 ,  B23K20/004 ,  B23K20/005 ,  B23K37/0282 ,  B23K2101/40 ,  B23Q1/44 ,  B23Q1/4852 ,  H01L2224/78301 ,  H01L2224/78822 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01105 ,  H02K41/0356 ,  H02K2201/18 ,  H01L2224/48 ,  H01L2224/45099

Abstract: A motion control device for controlling rotary and linear motion which includes a first linear actuator having a first fixed member and a first moveable drive member, the first moveable drive member being driven for motion relative to the first fixed member along a first longitudinal axis. The device also includes a second linear actuator having a second fixed member and a second moveable drive member, the second movable drive member being driven for motion relative to the second fixed member along a second longitudinal axis. A drive assembly is configured to be driven by the first and second moveable drive members for (a) linear motion along an axis substantially parallel to the first and second longitudinal axes, and (b) rotation about an axis of rotation. A position of each of the moveable drive members is separately controllable to control rotational and linear positions of the drive assembly.

Abstract translation: 一种用于控制旋转和直线运动的运动控制装置，其包括具有第一固定构件和第一可移动驱动构件的第一线性致动器，所述第一可移动驱动构件被驱动以沿着第一纵向轴线相对于第一固定构件运动。 该装置还包括具有第二固定构件和第二可移动驱动构件的第二线性致动器，第二可动驱动构件被驱动以相对于第二固定构件沿着第二纵向轴线运动。 驱动组件被构造成由第一和第二可移动驱动构件驱动，用于（a）沿着基本上平行于第一和第二纵向轴线的轴线的直线运动，以及（b）围绕旋转轴线旋转。 每个可移动驱动构件的位置是可分离地控制的，以控制驱动组件的旋转和线性位置。

公开(公告)号：US20060027747A1

公开(公告)日：2006-02-09

申请号：US11196194

申请日：2005-08-03

Applicant: Bahadir Tunaboylu ,  Edward Malantonio ,  David Beatson ,  Andrew Hmiel

Inventor： Bahadir Tunaboylu ,  Edward Malantonio ,  David Beatson ,  Andrew Hmiel

IPC: C25D5/02 ,  C25D17/00 ,  H01J40/00

CPC classification number: C25D5/02 ,  C25D5/022 ,  C25D7/00 ,  C25D17/00 ,  G01R1/06738 ,  G01R1/06761 ,  G01R1/07307 ,  G01R3/00

Abstract: A method of processing a probe element includes (a) providing a probe element comprising a first conductive material, and (b) coating only a tip portion of the probe element with a second conductive material.

公开(公告)号：US20050286060A1

公开(公告)日：2005-12-29

申请号：US11148486

申请日：2005-06-09

Applicant: David Beatson ,  Deepak Sood ,  Norman Lucas

Inventor： David Beatson ,  Deepak Sood ,  Norman Lucas

IPC: B23K20/00 ,  G01B11/14

CPC classification number: H01L24/78 ,  B23K20/007 ,  H01L2224/78301 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/12043 ,  H01L2924/14 ,  Y10S228/904 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A system for determining wire bonding tool placement for use with a wire bonder and an optical imager is provided. The system includes a prism disposed below the optical imager and the wire bonding tool. The system also includes at least one lens positioned between the prism and a lower portion of the wire bonding tool along a first optical axis. The at least one lens and the prism define an object plane between the at least one lens and the lower portion of the wire bonding tool. The at least one lens is positioned between the prism and the optical imager along a second optical axis. The at least one lens and the prism define an image plane between the at least one lens and the optical imager.

Abstract translation: 提供了一种用于确定用于引线接合器和光学成像器的引线接合工具布置的系统。 该系统包括设置在光学成像器下方的棱镜和引线接合工具。 该系统还包括沿着第一光轴定位在棱镜和引线接合工具的下部之间的至少一个透镜。 所述至少一个透镜和所述棱镜在所述至少一个透镜和所述引线接合工具的下部之间限定物平面。 所述至少一个透镜沿着第二光轴定位在所述棱镜和所述光学成像器之间。 所述至少一个透镜和所述棱镜限定所述至少一个透镜和所述光学成像器之间的图像平面。

公开(公告)号：US20050253140A1

公开(公告)日：2005-11-17

申请号：US11121703

申请日：2005-05-03

Applicant: David Beatson

Inventor： David Beatson

IPC: G01R31/28 ,  H01L21/60 ,  H01L21/607 ,  H01L21/66 ,  H01L23/485 ,  H01L23/58

CPC classification number: H01L24/11 ,  G01R31/2884 ,  H01L22/32 ,  H01L24/05 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48471 ,  H01L2224/48477 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48844 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2224/45099

Abstract: A method of processing a semiconductor wafer including a plurality of semiconductor dies is provided. The method includes providing a semiconductor wafer including a plurality of semiconductor dies, at least a portion of the semiconductor dies including contact pads for testing the respective semiconductor die. The method also includes positioning conductive bumps on the contact pads prior to completing wafer testing of the semiconductor wafer and prior to the singulation of the plurality of semiconductor dies from the semiconductor wafer. At least a portion of the conductive bumps are configured to be electrical paths during wafer testing of the semiconductor wafer.

Abstract translation: 提供了一种处理包括多个半导体管芯的半导体晶片的方法。 该方法包括提供包括多个半导体管芯的半导体晶片，半导体管芯的至少一部分包括用于测试各个半导体管芯的接触焊盘。 该方法还包括在完成半导体晶片的晶片测试之前和在从半导体晶片分离多个半导体管芯之前，在接触焊盘上定位导电凸块。 在半导体晶片的晶片测试期间，导电凸块的至少一部分被配置为电路径。

公开(公告)号：US20060219754A1

公开(公告)日：2006-10-05

申请号：US11096140

申请日：2005-03-31

Applicant: Horst Clauberg ,  Ronald Focia ,  David Beatson ,  Kenneth Dury

Inventor： Horst Clauberg ,  Ronald Focia ,  David Beatson ,  Kenneth Dury

IPC: B23K13/08 ,  B23K37/00

CPC classification number: H01L24/85 ,  B08B7/00 ,  B08B7/0057 ,  B23K20/004 ,  B23K20/24 ,  B23K2101/40 ,  C23F4/00 ,  H01L21/67138 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/7801 ,  H01L2224/78301 ,  H01L2224/85013 ,  H01L2224/85055 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/851 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/01001 ,  H01L2924/01002 ,  H01L2924/206

Abstract: A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire in the chamber prior to the wire being wirebonded.

Abstract translation: 提供了一种用于清洁被配置为引线键合的导线的电线清洁系统。 电线清洁系统包括一个室，通过该室配置成引线接合的导线在导线接合之前延伸。 电线清洁系统还包括能量源，用于在电线被引线接合之前去除腔室中的电线的污染物。

公开(公告)号：US20050284914A1

公开(公告)日：2005-12-29

申请号：US11148540

申请日：2005-06-09

Applicant: David Beatson ,  Deepak Sood ,  Norman Lucas ,  Zhijie Wang

Inventor： David Beatson ,  Deepak Sood ,  Norman Lucas ,  Zhijie Wang

IPC: B23K20/00 ,  B23K20/10 ,  B23K31/02 ,  B23K31/12 ,  B23K37/00

CPC classification number: B23K20/007 ,  B23K20/10 ,  B23K31/12 ,  B23K2101/40 ,  H01L2224/78301 ,  H01L2924/14

Abstract: A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.

Abstract translation: 提供了一种用于测量与具有引线接合工具和电火焰熄灭（EFO）装置的引线接合器一起使用的自由空气球的尺寸的系统。 该系统包括设置在第一图像平面上方的成像器，设置在成像器下方的棱镜以及位于第一光路中的第一像面与棱镜之间的至少一个透镜。 所述至少一个透镜位于所述棱镜和所述成像器之间的第二光路中，其中所述第二光路不同于所述第一光路。 设置在引线接合工具的下部的自由空气球的图像通过棱镜和至少一个透镜被提供给成像器。