公开(公告)号：US09966374B2

公开(公告)日：2018-05-08

申请号：US15096681

申请日：2016-04-12

Applicant: GLOBALFOUNDRIES INC.

Inventor： Kangguo Cheng ,  Ali Khakifirooz ,  Alexander Reznicek ,  Charan Veera Venkata Satya Surisetty

IPC: H01L29/51 ,  H01L29/417 ,  H01L27/088 ,  H01L29/66 ,  H01L21/8234 ,  H01L29/49 ,  H01L21/768

CPC classification number: H01L27/0886 ,  H01L21/76837 ,  H01L21/76897 ,  H01L21/823468 ,  H01L29/41766 ,  H01L29/4983 ,  H01L29/51 ,  H01L29/517 ,  H01L29/518 ,  H01L29/6653 ,  H01L29/66545 ,  H01L29/66795

Abstract: A semiconductor device includes gates and a low-k spacer. The low-k spacer includes low-k spacer portions formed upon the gate sidewalls and a low-k spacer portion formed upon a top surface of an underlying substrate adjacent to the gates. When a structure has previously undergone a gate processing fabrication stage, the gates and at least a portion of the top surface of the substrate may be exposed thereby allowing the formation of the low-k spacer. This exposure may include removing any original gate spacers, removing an original liner formed upon the original spacers, and removing any original fill material formed upon the liner.

公开(公告)号：US20180090327A1

公开(公告)日：2018-03-29

申请号：US15825409

申请日：2017-11-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  GLOBALFOUNDRIES INC.

Inventor： Xiuyu Cai ,  Kangguo Cheng ,  Ali Khakifirooz ,  Ruilong Xie

IPC: H01L21/28 ,  H01L29/66

CPC classification number: H01L29/7856 ,  H01L21/0217 ,  H01L21/28141 ,  H01L21/3212 ,  H01L29/42364 ,  H01L29/6653 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/66575 ,  H01L29/785 ,  H01L29/78654

Abstract: A semiconductor structure includes a substrate, and a replacement metal gate (RMG) structure is attached to the substrate. The RMG structure includes a lower portion and an upper tapered portion. A source junction is disposed on the substrate and attached to a first low-k spacer portion. A drain junction is disposed on the substrate and attached to a second low-k spacer portion. A first oxide layer is disposed on the source junction, and attached to the first low-k spacer portion. A second oxide layer is disposed on the drain junction, and attached to the second low-k spacer portion. A cap layer is disposed on a top surface layer of the RMG structure and attached to the first oxide layer and the second oxide layer.

公开(公告)号：US09754941B2

公开(公告)日：2017-09-05

申请号：US14729845

申请日：2015-06-03

Applicant: GLOBALFOUNDRIES INC.

Inventor： Kangguo Cheng ,  Ali Khakifirooz ,  Alexander Reznicek ,  Dominic J. Schepis

IPC: H01L21/18 ,  H01L27/092 ,  H01L21/8238 ,  H01L21/84 ,  H01L29/78 ,  H01L27/12 ,  H01L29/161

CPC classification number: H01L27/0924 ,  H01L21/18 ,  H01L21/823807 ,  H01L21/823821 ,  H01L21/823864 ,  H01L21/845 ,  H01L27/1211 ,  H01L29/161 ,  H01L29/7842

Abstract: A method of forming a semiconductor structure that includes compressive strained silicon germanium alloy fins having a first germanium content and tensile strained silicon germanium alloy fins having a second germanium content that is less than the first germanium content is provided. The different strained and germanium content silicon germanium alloy fins are located on a same substrate. The method includes forming a cladding layer of silicon around a set of the silicon germanium alloy fins, and forming a cladding layer of a germanium containing material around another set of the silicon germanium alloy fins. Thermal mixing is then employed to form the different strained and germanium content silicon germanium alloy fins.

公开(公告)号：US09728649B2

公开(公告)日：2017-08-08

申请号：US15009906

申请日：2016-01-29

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Thomas N. Adam ,  Kangguo Cheng ,  Ali Khakifirooz ,  Alexander Reznicek ,  Raghavasimhan Sreenivasan

IPC: H01L29/786 ,  H01L21/28 ,  H01L21/84 ,  H01L27/12 ,  H01L29/06 ,  H01L29/423

CPC classification number: H01L29/78648 ,  H01L21/28008 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/0649 ,  H01L29/42364

Abstract: A semiconductor device is disclosed. The semiconductor device can include a first dielectric layer disposed on a substrate; a set of bias lines disposed on the first dielectric layer; a second dielectric layer disposed on the first dielectric layer and between the set of bias lines, wherein a thickness of the second dielectric layer is less than a thickness of the first dielectric layer; a patterned semiconductor layer disposed on portions of the second dielectric layer; and a set of devices disposed on the patterned semiconductor layer above the set of bias lines.

公开(公告)号：US20170194153A1

公开(公告)日：2017-07-06

申请号：US15462657

申请日：2017-03-17

Applicant: International Business Machines Corporation ,  GLOBALFOUNDRIES INC.

Inventor： Xiuyu Cai ,  Kangguo Cheng ,  Ali Khakifirooz ,  Ruilong Xie

IPC: H01L21/28 ,  H01L29/66

CPC classification number: H01L29/7856 ,  H01L21/0217 ,  H01L21/28141 ,  H01L21/3212 ,  H01L29/42364 ,  H01L29/6653 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/66575 ,  H01L29/785 ,  H01L29/78654

Abstract: Forming a semiconductor structure includes forming a dummy gate stack on a substrate including a sacrificial spacer on the peripheral of the dummy gate stack. The dummy gate stack is partially recessed. The sacrificial spacer is etched down to the partially recessed dummy gate stack. Remaining portions of the sacrificial spacer are etched leaving gaps on sides of a remaining portion of the dummy gate stack. A first low-k spacer portion and a second low-k spacer portion are formed to fill gaps around the remaining portions of the dummy gate stack and extending vertically along a sidewall of a dummy gate cavity. The first and second low-k spacer portions are etched. A poly pull process is performed on the remaining portions of the dummy gate stack. A replacement metal gate (RMG) structure is formed with the first low-k spacer portion and the second low-k spacer portion.

公开(公告)号：US09673296B2

公开(公告)日：2017-06-06

申请号：US14937029

申请日：2015-11-10

Applicant: GLOBALFOUNDRIES INC.

Inventor： Thomas N. Adam ,  Kangguo Cheng ,  Ali Khakifirooz ,  Jinghong Li ,  Alexander Reznicek

IPC: H01L29/76 ,  H01L21/336 ,  H01L29/66 ,  H01L29/78 ,  H01L29/06 ,  H01L29/08 ,  H01L21/02 ,  H01L21/84

CPC classification number: H01L29/66636 ,  H01L21/02532 ,  H01L21/02579 ,  H01L21/02609 ,  H01L21/84 ,  H01L29/0657 ,  H01L29/0847 ,  H01L29/78

Abstract: A semiconductor structure including a semiconductor wafer. The semiconductor wafer includes a gate structure, a first trench in the semiconductor wafer adjacent to a first side of the gate structure and a second trench adjacent to a second side of the gate structure, the first and second trenches filled with a doped epitaxial silicon to form a source in the filled first trench and a drain in the filled second trench such that each of the source and drain are recessed and have an inverted facet. In a preferred exemplary embodiment, the epitaxial silicon is doped with boron.

公开(公告)号：US20170117274A1

公开(公告)日：2017-04-27

申请号：US14920354

申请日：2015-10-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  GLOBALFOUNDRIES INC.

Inventor： Xiuyu Cai ,  Kangguo Cheng ,  Ali Khakifirooz ,  Ruilong Xie ,  Tenko Yamashita

IPC: H01L27/088 ,  H01L21/8234 ,  H01L29/66

CPC classification number: H01L29/6653 ,  H01L21/2018 ,  H01L21/3065 ,  H01L21/3081 ,  H01L21/3086 ,  H01L21/31053 ,  H01L21/823418 ,  H01L21/823431 ,  H01L27/0886 ,  H01L29/0649 ,  H01L29/1037 ,  H01L29/66545 ,  H01L29/66553 ,  H01L29/6656 ,  H01L29/66795 ,  H01L29/7853

Abstract: Semiconductor devices and methods for making the same includes conformally forming a first spacer on a plurality of fins. A second spacer is conformally formed on the first spacer, the second spacer being formed from a different material from the first spacer. The plurality of fins are etched below a bottom level of the first spacer to form a fin cavity. Material from the first spacer is removed to expand the fin cavity. Fin material is grown directly on the etched plurality of fins to fill the fin cavity.

公开(公告)号：US09576956B2

公开(公告)日：2017-02-21

申请号：US15157861

申请日：2016-05-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  GLOBALFOUNDRIES INC.

Inventor： Xiuyu Cai ,  Kangguo Cheng ,  Ali Khakifirooz ,  Ruilong Xie ,  Tenko Yamashita

IPC: H01L27/088 ,  H01L27/02 ,  H01L29/78 ,  H01L29/66 ,  H01L29/417 ,  H01L29/06 ,  H01L21/336

CPC classification number: H01L27/0886 ,  H01L27/0207 ,  H01L29/0649 ,  H01L29/41791 ,  H01L29/6656 ,  H01L29/66795 ,  H01L29/6681 ,  H01L29/7848 ,  H01L29/785

Abstract: A method of forming a semiconductor device that includes forming a plurality of semiconductor pillars. A dielectric spacer is formed between at least one set of adjacent semiconductor pillars. Semiconductor material is epitaxially formed on sidewalls of the adjacent semiconductor pillars, wherein the dielectric spacer obstructs a first portion of epitaxial semiconductor material formed on a first semiconductor pillar from merging with a second portion of epitaxial semiconductor material formed on a second semiconductor pillar.

Abstract translation: 一种形成包括形成多个半导体柱的半导体器件的方法。 在至少一组相邻的半导体柱之间形成介电间隔物。 半导体材料外延地形成在相邻半导体柱的侧壁上，其中电介质间隔物阻挡形成在第一半导体柱上的外延半导体材料的第一部分与形成在第二半导体柱上的第二部分外延半导体材料合并。

公开(公告)号：US09559009B2

公开(公告)日：2017-01-31

申请号：US14876212

申请日：2015-10-06

Applicant: International Business Machines Corporation ,  GLOBALFOUNDRIES Inc.

Inventor： Xiuyu Cai ,  Kangguo Cheng ,  Johnathan E. Faltermeier ,  Ali Khakifirooz ,  Theodorus E. Standaert ,  Ruilong Xie

IPC: H01L21/311 ,  H01L21/8234 ,  H01L29/417 ,  H01L27/088 ,  H01L29/08 ,  H01L21/84 ,  H01L29/66

CPC classification number: H01L21/823437 ,  H01L21/31111 ,  H01L21/823418 ,  H01L21/823431 ,  H01L21/823468 ,  H01L21/845 ,  H01L27/088 ,  H01L27/0886 ,  H01L29/0847 ,  H01L29/41783 ,  H01L29/665 ,  H01L29/66795 ,  H01L29/785

Abstract: A gate structure straddling a plurality of semiconductor material portions is formed. Source regions and drain regions are formed in the plurality of semiconductor material portions, and a gate spacer laterally surrounding the gate structure is formed. Epitaxial active regions are formed from the source and drain regions by a selective epitaxy process. The assembly of the gate structure and the gate spacer is cut into multiple portions employing a cut mask and an etch to form multiple gate assemblies. Each gate assembly includes a gate structure portion and two disjoined gate spacer portions laterally spaced by the gate structure portion. Portions of the epitaxial active regions can be removed from around sidewalls of the gate spacers to prevent electrical shorts among the epitaxial active regions. A dielectric spacer or a dielectric liner may be employed to limit areas in which metal semiconductor alloys are formed.

Abstract translation: 形成跨越多个半导体材料部分的栅极结构。 源极区域和漏极区域形成在多个半导体材料部分中，并且形成横向围绕栅极结构的栅极间隔物。 通过选择性外延工艺从源极和漏极区域形成外延有源区。 通过切割掩模和蚀刻将栅极结构和栅极间隔物的组装切成多个部分以形成多个栅极组件。 每个门组件包括栅极结构部分和由栅极结构部分横向隔开的两个分离的栅极间隔部分。 可以从栅极间隔物的侧壁的周围去除外延有源区的一部分，以防止外延有源区中的电短路。 可以使用电介质间隔物或电介质衬垫来限制形成金属半导体合金的区域。

公开(公告)号：US09536877B2

公开(公告)日：2017-01-03

申请号：US14195484

申请日：2014-03-03

Applicant: GLOBALFOUNDRIES Inc. ,  International Business Machines Corporation

Inventor： Xiuyu Cai ,  Ruilong Xie ,  Kangguo Cheng ,  Ali Khakifirooz

IPC: H01L27/088 ,  H01L23/485 ,  H01L21/768 ,  H01L23/532

CPC classification number: H01L27/088 ,  H01L21/76831 ,  H01L21/76897 ,  H01L23/485 ,  H01L23/53257 ,  H01L2924/0002 ,  H01L2924/00

Abstract: One example disclosed herein involves forming source/drain conductive contacts to first and second source/drain regions, the first source/drain region being positioned between a first pair of transistor devices having a first gate pitch dimension, the second source/drain region being positioned between a second pair of transistor devices having a second gate pitch dimension that is greater than the first gate pitch dimension, wherein the first and second pairs of transistor devices have a gate structure and sidewall spacers positioned adjacent the gate structure.

Abstract translation: 本文公开的一个示例涉及将源极/漏极导电触点形成到第一和第二源极/漏极区域，第一源极/漏极区域位于具有第一栅极间距尺​​寸的第一对晶体管器件之间，第二源极/漏极区域被定位 在具有大于第一栅极间距尺​​寸的第二栅极间距尺​​寸的第二对晶体管器件之间，其中第一和第二对晶体管器件具有栅极结构和邻近栅极结构定位的侧壁间隔物。