公开(公告)号：US20240364000A1

公开(公告)日：2024-10-31

申请号：US18140361

申请日：2023-04-27

Applicant: Intel Corporation

Inventor： Bernd WAIDHAS ,  Thomas WAGNER ,  Georg SEIDEMANN ,  Harald GOSSNER ,  Telesphor KAMGAING ,  Shuhei YAMADA ,  Tae Young YANG

IPC: H01Q1/42 ,  H01Q1/22 ,  H01Q9/04

CPC classification number: H01Q1/422 ,  H01Q1/2283 ,  H01Q9/0407

Abstract: Embodiments disclosed herein include a die module. In an embodiment, the die module comprises a die with a first surface and a second surface. In an embodiment, a first pad is on the second surface of the die, and a dielectric layer is over the second surface of the die and the first pad. In an embodiment, an antenna module is over the dielectric layer, where the antenna module comprises a second pad that is aligned over the first pad.

公开(公告)号：US20220344835A1

公开(公告)日：2022-10-27

申请号：US17763207

申请日：2019-12-24

Applicant: Intel Corporation

Inventor： Seong-Youp John SUH ,  Timo Sakari HUUSARI ,  Shuhei YAMADA ,  Oner ORHAN ,  Jose Rodrigo CAMACHO PEREZ

IPC: H01Q21/20 ,  H01Q13/10 ,  H01Q3/24

Abstract: Monodirectional antennas may be arranged to radiate in a near omni-directional pattern. By incorporating switches into the antenna arrangement, the antennas can be controlled to selectively radiate from a common radiofrequency feed. These arrangements may be packaged in a housing, which may aid both in antenna performance and in antenna installation. According to another aspect of the disclosure, housings may include a plurality of antennas, and one or more procedures may be implemented to determine a codebook to radiate from the circular arrangement according to various beam constrains.

公开(公告)号：US20220352622A1

公开(公告)日：2022-11-03

申请号：US17762749

申请日：2019-12-27

Applicant: Intel Corporation

Inventor： Debabani CHOUDHURY ,  Jose Rodrigo CAMACHO PEREZ ,  Shuhei YAMADA ,  Vida Ilderem BURGER ,  Bryce D. HORINE ,  Harry SKINNER

IPC: H01Q1/32 ,  H01Q3/34 ,  B60Q1/00

Abstract: Various antennas elements including antennas arrays can support various communication technologies and can be integrated into different components or subcomponents of a vehicle, including various vehicle light assemblies. The vehicular antennas elements include low profile and/or concealed antenna elements that are inconspicuous aesthetically and do not affect or substantially affect vehicle aerodynamics.

公开(公告)号：US20240222859A1

公开(公告)日：2024-07-04

申请号：US18147768

申请日：2022-12-29

Applicant: Intel Corporation

Inventor： Tae Young YANG ,  Zhen ZHOU ,  Shuhei YAMADA ,  Tolga ACIKALIN ,  Kenneth P. FOUST ,  Bryce D. HORINE

IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q17/00 ,  H01Q19/10

CPC classification number: H01Q1/526 ,  H01Q1/2291 ,  H01Q17/00 ,  H01Q19/10

Abstract: An apparatus may include a substrate including: a first antenna configured to form a first short range wireless interconnection with a first antenna of a further substrate, a second antenna spaced apart from the first antenna, the second antenna is configured to form a second short range wireless interconnection with a second antenna of the further substrate, and a metamaterial configured to form a surface with effective negative permeability within a space formed between a surface of the substrate and a surface of the further substrate for an established short range wireless interconnection of the first short range wireless interconnection and the second short range wireless interconnection.

公开(公告)号：US20240113438A1

公开(公告)日：2024-04-04

申请号：US17955551

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Shuhei YAMADA ,  Renzhi LIU ,  Tae Young YANG ,  Tolga ACIKALIN ,  Kenneth P. FOUST

IPC: H01Q9/16

CPC classification number: H01Q9/16

Abstract: A package-to-package communication system is provided including a first package having integrated on a first substrate a first antenna, a second antenna, and a first transceiver coupled to the first antenna and the second antenna. The first antenna is arranged along a first edge of the first substrate. The second antenna is arranged along a second edge of the first substrate. A second package having integrated on a second substrate a third antenna, a fourth antenna and a second transceiver coupled to the third antenna and the fourth antenna. The third antenna is arranged along a third edge of the second substrate. The fourth antenna is arranged along a fourth edge of the second substrate. The first antenna and the third antenna are configured to communicate signals of a vertical polarization. The second antenna and the fourth antenna are configured to communicate signals of a horizontal polarization.

公开(公告)号：US20230207405A1

公开(公告)日：2023-06-29

申请号：US17561722

申请日：2021-12-24

Applicant: Intel Corporation

Inventor： Arghya SAIN ,  Andrew P. COLLINS ,  Sivaseetharaman PANDI ,  Telesphor KAMGAING ,  Tolga ACIKALIN ,  Shuhei YAMADA

IPC: H01L23/15 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/15 ,  H01L23/49827 ,  H01L23/49822 ,  H01L21/486 ,  H01L24/16 ,  H01L2924/15311 ,  H01L2224/16227

Abstract: Embodiments disclosed herein include electronic devices. In an embodiment, an electronic device comprises a core, where the core comprises a first layer comprising glass, and a second layer comprising glass over the first layer. In an embodiment, a trace is between the first layer and the second layer. In an embodiment, routing layers are on the core.

公开(公告)号：US20240363567A1

公开(公告)日：2024-10-31

申请号：US18140465

申请日：2023-04-27

Applicant: Intel Corporation

Inventor： Bernd WAIDHAS ,  Thomas WAGNER ,  Georg SEIDEMANN ,  Harald GOSSNER ,  Telesphor KAMGAING ,  Shuhei YAMADA ,  Tae Young YANG

IPC: H01L23/00 ,  H01Q1/22 ,  H01Q1/38

CPC classification number: H01L24/08 ,  H01L24/05 ,  H01Q1/2283 ,  H01Q1/38 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05647 ,  H01L2224/08265 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32265 ,  H01L2924/0665

Abstract: Embodiments disclosed herein include a die module. In an embodiment, the die module comprises a die with a first surface and a second surface. In an embodiment, a first pad is on the second surface of the die, where a top surface of the first pad is substantially coplanar with the second surface. In an embodiment, the die module comprises an antenna module with a third surface and a fourth surface. In an embodiment, a second pad is on the third surface of the antenna module, where a bottom surface of the second pad is substantially coplanar with the third surface. In an embodiment, the top surface of the first pad directly contacts the bottom surface of the second pad.

公开(公告)号：US20240106126A1

公开(公告)日：2024-03-28

申请号：US18352296

申请日：2023-07-14

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Tolga ACIKALIN ,  Kenneth FOUST ,  Shuhei YAMADA ,  Tae Young YANG ,  Timothy F. COX ,  Renzhi LIU ,  Richard DORRANCE ,  Johanny ESCOBAR PELAEZ

IPC: H01Q9/04 ,  H01Q1/22

CPC classification number: H01Q9/0414 ,  H01Q1/2283 ,  H01Q9/045

Abstract: A communication system, including a first carrier and a first antenna mounted on the first carrier; a second carrier and a second antenna mounted on the second carrier, wherein the first antenna and the second antenna are arranged relative to each other that the first antenna and the second antenna can establish wireless link; a third carrier and a third antenna mounted on the third carrier; a fourth carrier and a fourth antenna mounted on the fourth carrier, wherein the third antenna and the fourth antenna are arranged relative to each other that the third antenna and the fourth antenna can establish wireless link; and a transmission structure, within which the signal propagate through, connects the second antenna and the third antenna.

公开(公告)号：US20240021522A1

公开(公告)日：2024-01-18

申请号：US18253945

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Tolga ACIKALIN ,  Tae Young YANG ,  Debabani CHOUDHURY ,  Shuhei YAMADA ,  Roya DOOSTNEJAD ,  Hosein NIKOPOUR ,  Issy KIPNIS ,  Oner ORHAN ,  Mehnaz RAHMAN ,  Kenneth P. FOUST ,  Christopher D. HULL ,  Telesphor KAMGAING ,  Omkar KARHADE ,  Stefano PELLERANO ,  Peter SAGAZIO ,  Sai VADLAMANI

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L23/66 ,  H01L23/498 ,  H01Q1/22

CPC classification number: H01L23/5381 ,  H01L25/0652 ,  H01L24/16 ,  H01L23/66 ,  H01L23/49822 ,  H01Q1/2283 ,  H01L24/81 ,  H01L2924/14222 ,  H01L2924/1431 ,  H01L2223/6677 ,  H01L2223/6616 ,  H01L2223/6655 ,  H01L2224/16235 ,  H01L2224/16146

Abstract: Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.

公开(公告)号：US20220337282A1

公开(公告)日：2022-10-20

申请号：US17763208

申请日：2019-12-24

Applicant: Intel Corporation

Inventor： Jose Rodrigo CAMACHO PEREZ ,  Debabani CHOUDHURY ,  Timo Sakari HUUSARI ,  Seong-Youp John SUH ,  Shuhei YAMADA

IPC: H04B1/48 ,  H01Q13/02

Abstract: A radio frequency front end and an antenna front end may be separated from one another to maintain close proximity between a low noise amplifier and an antenna while achieving improved thermal regulation of a power amplifier. The radio frequency front end antenna front end may include a duplexing system that enables operation with a single electrical cable. Furthermore, where it is desired to transmit a radiofrequency signal via a waveguide, a flexible waveguide may be constructed with a distributed capacitance between waveguide protrusions.